Difference between revisions of "Tube Furnace Wafer Bonding (Thermco)"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
Line 2: Line 2:
|type = Thermal Processing
|type = Thermal Processing
|super= Mike Silva
|super= Tony Bosch
|location=Bay 4
|location=Bay 4

Revision as of 10:47, 15 April 2020

Tube Furnace Wafer Bonding (Thermco)
Tool Type Thermal Processing
Location Bay 4
Supervisor Tony Bosch
Supervisor Phone (805) 893-3486
Supervisor E-Mail bosch@ece.ucsb.edu
Description Wafer Fusion Furnace
Manufacturer Thermco
Sign up for this tool


This wafer fusion furnace is a custom built unit designed for the fusion of different material types (such InP and Si) to create new heterostructures for novel electronic and optoelectronic devices. Custom made bonding fixtures are loaded into the furnace through a purged glove-box that is oxygen free to below 10 ppm with a dew point near -80°C. The furnace is nitrogen purged and can operate up from 200°C to 1200°C. Many different materials are allowed and maximum temperature is dependent on the materials themselves, to avoid contamination of the furnace.

Detailed Specifications

  • Temperatures 200°C to 1200°C
  • 4 inch diameter furnace
  • Nitrogen ambient at atmospheric pressure
  • Oxygen control in glove box to less than 10 ppm
  • Dew point near -80°C
  • Custom bonding fixtures of various materials allowed