Difference between revisions of "Tool List"
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Revision as of 07:30, 27 June 2012
Lithography
- Suss Aligners
- IR Aligner
- DUV Flood Expose
- Ovens
- Stepper 1
- Stepper 2
- Stepper 3
- E-Beam Lithography System
Vacuum Deposition
- E-Beam Evaporator 1
- E-Beam Evaporator 2
- E-Beam Evaporator 3
- E-Beam Evaporator 4
- Sputter Tool 1
- Sputter Tool 2
- Sputter Tool 3
- Sputter Tool 4
- Sputter Tool 5
- PECVD 1
- PECVD 2
- VLR PECVD
- IBD
- Molecular Vapor Deposition
- Atomic Layer Deposision
Dry Etch
- RIE 1
- RIE 2
- RIE 3
- RIE 5
- Si Deep RIE
- Ashers
- VLR Etch
- ICP Etch 1
- ICP Etch 2
- UV Ozone Reactor
- Plasma Clean
- XeF2 Etch
- Plasma Activation Tool
Wet Processing
Thermal Processing
Packaging
Inspection, Test and Characterization
- Field Emission SEM 1
- Field Emission SEM 2
- Step Profile
- Step Profilometer
- Ellipsometer
- Microscopes
- Probe Station & Curve Tracer
- Optical Film Thickness (Filmetrics)
- Scanning Probe Microscope
- Tencor Flexus Film Stress
- Optical Film Thickness (Nanometric)
- SEM Sample Coater
- Surface Analysis
- Photo-emission & IR Microscope
- Ellipsometer (Woollam)
- Goniometer
- 4-Point Probe Resistivity Mapper