Difference between revisions of "Template:News"

Revision as of 10:43, 14 December 2017

News from the U.C. Santa Barbara Nanofabrication Facility.

Metal Processes on the Atomic Layer Deposition

We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the Oxford FlexAL ALD tool. See the Atomic Layer Deposition: Recipes page for more info, or contact Bill Mitchell for more information.

New Deep Silicon Etcher Online

A new Plasma-Therm Versaline DSE III DRIE etcher has been qualified for bosch etch and single-step etches, and is available for use. The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer.

-- 22:16, 27 November 2017 (PST)

2016 Survey Results

See the May 2016 User Survey Results.

-- 12:00, 01 May 2016 (PST)

CAIBE Ion Mill Available

The CAIBE (Oxford Ion Mill) is up and running! Contact Brian Lingg for more information.

-- 12:00, 01 July 2015 (PST)

NanoFiles SFTP Online

Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check SignupMonkey for details.

-- 12:00, 07 July 2013 (PST)

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+=== Metal Processes on the Atomic Layer Deposition ===
+We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the [[Atomic_Layer_Deposition_(Oxford_FlexAL)|Oxford FlexAL ALD]] tool.  See the [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition: Recipes]] page for more info, or contact [[Bill_Mitchell|Bill Mitchell]] for more information.
 === New Deep Silicon Etcher Online ===
 A new [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|Plasma-Therm Versaline DSE III DRIE etcher]] has been qualified for bosch etch and single-step etches, and is available for use.  The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer.