Difference between revisions of "Template:News"

Latest revision as of 14:52, 19 April 2023

News from the U.C. Santa Barbara Nanofabrication Facility.

Wide FOV Microscope Installed

We have installed an AmScope stereo microscope in Bay 4 for wide field-of-view digital imaging/capture, with >2cm of FOV currently available. Wiki page here: AmScope Wide Field of View Stereoscope // John d 14:52, 19 April 2023 (PDT)

Loomis Scribe & Break installed

We have installed a new Loomis LSD-155LT Automated Scribe & Break Cleaving tool in the Back-End Processing lab. Qualifications are underway. Contact supervisor, Aidan Hopkins, for more information. // John d 09:41, 16 April 2023 (PDT)

JEOL SEM Installed

SEM #1 has been replaced with a new JEOL SEM, which is currently being installed and qualified. Contact the supervisor, Aidan Hopkins, for more information. // John d 09:00, 11 April 2023 (PDT)

Dektak XT installed

We have replaced the old Dektak 6M with a new Dektak XT profilometer. This tool will provide robust, fast metrology for rapid in-process topography inspection. // John d 10:41, 25 January 2023 (PST)

New Process Control data tables

We have added "Process Control Data" - data on deposition/etch repeatability - to a number of our highest used etchers and deposition tools. The datasheets are linked in multiple places, mainly on the Recipes pages for each tool, or on the general Recipes pages for Deposition Recipes or Etch Recipes. // John d 16:07, 5 January 2023 (PST)

Oxford PlasmaPro ICP Etcher installed

We have a new ICP etcher in Bay 2: Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)

The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)

In addition, the tool is capable of Atomic Layer Etching on various materials. Contact the supervisor for training. // John d 11:27, 29 September 2021 (PDT)

SiO2 etching, High-Aspect Ratio

Dr. Bill Mitchell recently published an article detailing high-aspect ratio SiO2 etching (JVST-A, May 2021) in the Plasma-Therm Fluorine ICP etcher, using a novel Ruthenium Hard Mask.

Ruthenium can be deposited using the Oxford ALD or AJA Sputter and etched in one of the Panasonic ICP's.

You can find a full process flow at the FL-ICP's Recipe Page, in this case using a Sputtered Ru hard mask and I-line stepper lithography. // John d 08:05, 27 May 2021 (PDT)

Wafer Polisher available

We have added an Allied Wafer Polish tool to our equipment list. Contact Bill_Millerski for more information. // John d 16:49, 10 May 2021 (PDT)

Digital Microscope: Olympus DSX-1000

You'll see a new digital microscope in Bay 4/Metrology, that's our new Olympus DSX-1000. We are currently developing procedures, keep an eye out for training emails. // John d 13:49, 8 April 2021 (PDT)

Raith Velion: FIB/SEM Installation

We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.

Learn more about the tool's capabilities at the Raith website:

Tool qualification is currently underway. Dr. Dan Read is the resident expert on this new tool.

// John d 06:53, 30 November 2020 (PST)

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+=== Wide FOV Microscope Installed ===
+We have installed an AmScope stereo microscope in Bay 4 for wide field-of-view digital imaging/capture, with >2cm of FOV currently available.  Wiki page here: [[Microscopes#Microscope_.238:_AmScope_Wide_Field_of_View_Stereoscope_.28Bay_4.29|AmScope Wide Field of View Stereoscope]]
+// [[User:John d|John d]] 14:52, 19 April 2023 (PDT)
-=== Raith Velion: FIB/SEM Installation ===
+=== Loomis Scribe & Break installed ===
-You may have noticed the huge RAITH crates outside the NanoFab; in the next few months we will be installing this state-of-the-art focused ion beam/electron beam tool in Bay 1.
+We have installed a new [https://loomisinc.com/lsd-155lt/ Loomis LSD-155LT] Automated Scribe & Break Cleaving tool in the Back-End Processing lab. Qualifications are underway. Contact [[Aidan_Hopkins|supervisor, Aidan Hopkins]], for more information.
+// [[User:John d|John d]] 09:41, 16 April 2023 (PDT)
-Learn more about this upcoming capability at the Raith website:
+=== JEOL SEM Installed ===
-* [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion].
+SEM #1 has been replaced with a new JEOL SEM, which is currently being installed and qualified. Contact the [[Aidan_Hopkins|supervisor, Aidan Hopkins]], for more information.
-* [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM]
+// [[User:John d|John d]] 09:00, 11 April 2023 (PDT)
-Dr. Dan Read will be the resident expert on this exciting new technology.
+=== Dektak XT installed ===
+We have replaced the old Dektak 6M with a new Dektak XT profilometer. This tool will provide robust, fast metrology for rapid in-process topography inspection.
+// [[User:John d|John d]] 10:41, 25 January 2023 (PST)
-// [[User:John d|John d]] 17:43, 2 June 2020 (PDT)
+=== New Process Control data tables ===
+We have added [[Process_Group_-_Process_Control_Data|"Process Control Data"]] - data on deposition/etch repeatability - to a number of our highest used etchers and deposition tools. The datasheets are linked in multiple places, mainly on the Recipes pages for each tool, or on the general Recipes pages for [[Vacuum_Deposition_Recipes|'''Deposition Recipes''']] or [[Dry_Etching_Recipes|'''Etch Recipes''']].
+// [[User:John d|John d]] 16:07, 5 January 2023 (PST)
-=== Heidelberg MLA-150: Delivery Scheduled for Sept. ===
+=== Oxford PlasmaPro ICP Etcher installed ===
-We now have a delivery date for our Heidelberg Maskless Aligner (MLA150), September 2020!  This tool enables flexible I-Line lithography, in which a user can align to arbitrary features (eg. 2D materials, quantum dots), upload a CAD file to write a pattern without ordering a mask plate, grey-scale lithography and continuous auto-focus on non-planar substrates.
+We have a new ICP etcher in Bay 2:
+[[Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)]]
-Learn more about the tool at the Heidelberg Instruments website:
+The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)
-* [https://heidelberg-instruments.com/en/features-technologies/key-features/maskless-lithography.html Maskless Lithography: Direct Writing Basics]
-* [https://heidelberg-instruments.com/en/products/mla150.html Heidelberg MLA150]
-// [[User:John d|John d]] 17:43, 2 June 2020 (PDT)
+In addition, the tool is capable of Atomic Layer Etching on various materials.  Contact [[Tony_Bosch | the supervisor]] for training.
+// [[User:John d|John d]] 11:27, 29 September 2021 (PDT)
-=== TechTalk: Dr. Renan Moreira & Grégoire Coiffard ===
+=== SiO2 etching, High-Aspect Ratio ===
-[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Tech_Talks_Seminar_Series#Thursday.2C_Dec._5.2C_12pm.2C_ESB1001.2C_Light_Lunch_Provided Tech Talks on Thurs Dec 5th, in ESB room 1001 (click for more info)]:
+[[Bill_Mitchell|Dr. Bill Mitchell]] recently published an article detailing [[Template:Publications#Highly_Selective_and_Vertical_Etch_of_Silicon_Dioxide_using_Ruthenium_Films_as_an_Etch_Mask|'''high-aspect ratio SiO2 etching (JVST-A, May 2021)''']] in the [[ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher|Plasma-Therm Fluorine ICP etcher]], using a novel Ruthenium Hard Mask.
-n: Dr. Renan Moreira, ULL Technologies: “Ultra-low loss photonic integrated circuits based on Si3N4 waveguides”
+Ruthenium can be deposited using the [[Atomic_Layer_Deposition_Recipes#Ru_deposition_.28ALD_CHAMBER_1.29|Oxford ALD]] or [[Sputtering_Recipes#Ru_Deposition_.28Sputter_4.29|AJA Sputter]] and etched in one of the [[ICP_Etching_Recipes#Ru_.28Ruthenium.29_Etch_.28Panasonic_2.29|Panasonic ICP's]].
-pm: Grégoire Coiffard, Mazin Group, Physics Dept. UCSB, “The fabrication of 20,000 pixel kinetic inductance detector arrays for near-IR to visible astronomy”
+You can find a full process flow at the [[ICP_Etching_Recipes#SiO2_Etching_.28Fluorine_ICP_Etcher.29|FL-ICP's Recipe Page]], in this case using a Sputtered Ru hard mask and I-line stepper lithography.
-// [[User:John d|John d]] 11:03, 5 December 2019 (PDT)
+// [[User:John d|John d]] 08:05, 27 May 2021 (PDT)
-=== New Plasma Asher Installation ===
+=== Wafer Polisher available ===
-A new [https://www.yieldengineering.com/Products/Plasma-Strip-Descum-Systems/YES-ÉcoClean ''YES EcoClean Plasma Strip/Descum System''] is being installed, for controlled photoresist etching & residue stripping.  We will make an announcement when the system has been qualified and is ready for use.
+We have added an [https://wiki.nanotech.ucsb.edu/wiki/Mechanical_Polisher_(Allied) Allied Wafer Polish] tool to our equipment list. Contact [[Bill_Millerski]] for more information.  // [[User:John d|John d]] 16:49, 10 May 2021 (PDT)
-// [[User:John d|John d]] 11:03, 7 August 2019 (PDT)
-=== Rapid Thermal Annealer Installed ===
+=== Digital Microscope: Olympus DSX-1000 ===
-We are installing and qualifying a new [http://ssi-rtp.com/page/products/rtp-solaris-150/ SSI ''Solaris 150 Rapid Thermal Processor''].  We will make an announcement when the system is ready and trainings are scheduled.  See the [[Rapid Thermal Processor (SSI Solaris 150)|SSI RTP Wiki Page here]].
+You'll see a new digital microscope in Bay 4/Metrology, that's our new [https://www.olympus-ims.com/en/microscope/dsx1000/high-resolution-model/ Olympus DSX-1000]. We are currently developing procedures, keep an eye out for training emails.
-// [[User:John d|John d]] 12:03, 28 May 2019 (PDT)
+// [[User:John d|John d]] 13:49, 8 April 2021 (PDT)
-=== S-Cubed Spin/Coat/Dev Station Installation ===
+=== Raith Velion: FIB/SEM Installation ===
-We are currently in the process of installing a Cube system for automated Spin Coating, Baking, Developing and Edge-Bead Removal on 4-inch and 6-inch wafers.  Initially this tool will be solely purposed for Staff and the use of the sponsor, primarily for [[Stepper 3 (ASML DUV)|ASML DUV Stepper]] wafer prep. As procedures are developed, the system will be opened up for use by all ASML Stepper users, and may eventually be opened for I-Line stepper use as well.
+We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1.
-// [[User:John d|John d]] 12:10, 20 February 2019 (PST)
+The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.
-=== Filmetrics Optical Measurement Systems ===
+Learn more about the tool's capabilities at the Raith website:
-A [[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Filmetrics F10-RT]] for optical reflection/transmission spectra, and a [[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)|Filmetrics F50]] thin-film wafer-mapping system have been installed.  Contact [[Ning Cao|Ning Cao]] for more info.
+* [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion].
-// [[User:John d|John d]] 15:24, 12 December 2018 (PST)
+* [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM]
-=== KLA Tencor Profilometer Installed ===
-We have installed a new [[Step Profilometer (KLA Tencor P-7)|KLA Tencor Stylus Profilometer]], that has been installed in Bay 4. Contact [[Brian Lingg|Brian Lingg]] for training.
-// [[User:John d|John d]] 17:28, 12 September 2018 (PDT)
-=== Laser Endpoint Monitors ===
-We've installed new [http://www.intellemetrics.com/LEP.htm Intellemetrics LEP500 Laser Endpoint Detection] monitoring on the [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|DSEiii]] & [[ICP_Etch_2_(Panasonic_E640)|ICP#2]] & [[ICP_Etch_1_(Panasonic_E626I)|ICP#1]] etchers.  This allows you to terminate your etch at a calibrated/modeled distance into a layer, and removes the need to calibrate etch rates for most processes.
-// [[User:John d|John d]] 09:26, 17 July 2018 (PDT)
-=== Metal Processes on the Atomic Layer Deposition ===
-We now have Ruthenium (Ru) and Platinum (Pt) metal depositions developed on the [[Atomic_Layer_Deposition_(Oxford_FlexAL)|Oxford FlexAL ALD]] tool.  See the [[Atomic_Layer_Deposition_Recipes|Atomic Layer Deposition: Recipes]] page or contact [[Bill_Mitchell|Bill Mitchell]] for more information.
-// [[User:John d|Posted:]] 16:07, 01 June 2017 (PST)
-=== New Deep Silicon Etcher Online ===
-A new [[DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)|Plasma-Therm Versaline DSE III DRIE etcher]] has been qualified for bosch etch and single-step etches, and is available for use.  The new tool features much higher silicon etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. An Intellemetrics LEP500 laser end point monitor has also been installed on the system.
-// [[User:John d|Posted:]] 22:16, 27 November 2017 (PST)
-=== 2016 Survey Results ===
-See the May 2016 {{file|Survey052016.pdf| User Survey Results}}.
-// [[User:Thibeault|Posted:]] 12:00, 01 May 2016 (PST)
-=== CAIBE Ion Mill Available ===
+Tool qualification is currently underway.
-The [[CAIBE (Oxford Ion Mill)]] is up and running! Contact [[Brian Lingg]] for more information.
+[[Dan Read|Dr. Dan Read]] is the resident expert on this new tool.
-// [[User:Thibeault|Posted:]] 12:00, 01 July 2015 (PST)
-=== NanoFiles SFTP Online ===
+// [[User:John d|John d]] 06:53, 30 November 2020 (PST)
-Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check [http://signupmonkey.ece.ucsb.edu SignupMonkey] for details.
-// [[User:Thibeault|Posted:]] 12:00, 07 July 2013 (PST)
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