Difference between revisions of "Template:News"

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<!---feedBurner name="UCSBNanofab-NewsFeed" /-->
 
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News from the U.C. Santa Barbara Nanofabrication Facility
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''News from the U.C. Santa Barbara Nanofabrication Facility.''
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'''How to add news items'''
  
<!-- Each new news item should be inserted at the TOP of the list, with level 2 heading (==), and finish with user signature (four tildes `~~~~`) -->
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* New news item should be inserted at the TOP of the list
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* Item titles should have a level 3 heading, like so:  === MyArticleTitle ===
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* Each item should finish with the user signature (four tildes: ~~~~) on it's own separated line.  When you 'Save' the page, this will be replaced with a timestamp and your user name. 
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* Then delete your username, leaving only the two dashes, so "[[User:Thibeault|-- Brain Thibeault]]" becomes "[[User:Thibeault|-- ]]"
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* Also delete the "[[... (talk)]]" link
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* The timestamp determines the order of items in the feed. Items without a timestamp will show up at the end of the feed in random order.
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<!-------- NEWS ITEMS: newest on top -------->
  
== New Deep Silicon Etcher ==
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=== SiO2 etching, High-Aspect Ratio ===
New Plasma-Therm Versaline DSE III DRIE etcher is qualified and available for use.  The new tool features much higher etch rates, improved uniformity, and allows for photoresist up to the edges of the wafer. [[User:John d|-- Demis]] ([[User talk:John d|talk]]) 22:16, 27 November 2017 (PST)
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[[Bill_Mitchell|Dr. Bill Mitchell]] recently published an article detailing [[Template:Publications#Highly_Selective_and_Vertical_Etch_of_Silicon_Dioxide_using_Ruthenium_Films_as_an_Etch_Mask|'''high-aspect ratio SiO2 etching (JVST-A, May 2021)''']] in the [[ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher|Plasma-Therm Fluorine ICP etcher]], using a novel Ruthenium Hard Mask. 
  
== 2016 Survey Results ==
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Ruthenium can be deposited using the [[Atomic_Layer_Deposition_Recipes#Ru_deposition_.28ALD_CHAMBER_1.29|Oxford ALD]] or [[Sputtering_Recipes#Ru_Deposition_.28Sputter_4.29|AJA Sputter]] and etched in one of the [[ICP_Etching_Recipes#Ru_.28Ruthenium.29_Etch_.28Panasonic_2.29|Panasonic ICP's]].
See the May 2016 User Survey Results:  {{file|Survey052016.pdf|Survey Results}}
 
  
== CAIBE Ion Mill Available ==
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You can find a full process flow at the [[ICP_Etching_Recipes#SiO2_Etching_.28Fluorine_ICP_Etcher.29|FL-ICP's Recipe Page]], in this case using a Sputtered Ru hard mask and I-line stepper lithography.
The [[CAIBE (Oxford Ion Mill)]] is up and running! Contact [[Brian Lingg]] for more information. ''(7/2015)''
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// [[User:John d|John d]] 08:05, 27 May 2021 (PDT)
  
== NanoFiles SFTP Online ==
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=== Wafer Polisher available ===
Files generated with Nanofab tools (SEM images, AFM profiles, etc.) are now available on the nanofab SFTP server. Please check [http://signupmonkey.ece.ucsb.edu SignupMonkey] for details. ''(7/7/2013)''
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We have added an [https://wiki.nanotech.ucsb.edu/wiki/Mechanical_Polisher_(Allied) Allied Wafer Polish] tool to our equipment list. Contact [[Brian Lingg]] for more information. // [[User:John d|John d]] 16:49, 10 May 2021 (PDT)
  
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=== Digital Microscope: Olympus DSX-1000 ===
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You'll see a new digital microscope in Bay 4/Metrology, that's our new [https://www.olympus-ims.com/en/microscope/dsx1000/high-resolution-model/ Olympus DSX-1000]. We are currently developing procedures, keep an eye out for training emails.
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// [[User:John d|John d]] 13:49, 8 April 2021 (PDT)
  
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=== Raith Velion: FIB/SEM Installation ===
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We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1.
<noinclude>[[Category:Templates]]</noinclude>
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The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.
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Learn more about the tool's capabilities at the Raith website:
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* [https://www.raith.com/products/velion.html?mobile=0 Raith Products: Velion]. 
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* [https://www.youtube.com/watch?v=rW5w6nMhwfQ VIDEO: Synchronized FIB beam + Laser Interferometric Stage write, with live SEM]
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Tool qualification is currently underway.
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[[Dan Read|Dr. Dan Read]] is be the resident expert on this new tool.
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// [[User:John d|John d]] 06:53, 30 November 2020 (PST)

Revision as of 14:59, 31 August 2021

News from the U.C. Santa Barbara Nanofabrication Facility.

SiO2 etching, High-Aspect Ratio

Dr. Bill Mitchell recently published an article detailing high-aspect ratio SiO2 etching (JVST-A, May 2021) in the Plasma-Therm Fluorine ICP etcher, using a novel Ruthenium Hard Mask.

Ruthenium can be deposited using the Oxford ALD or AJA Sputter and etched in one of the Panasonic ICP's.

You can find a full process flow at the FL-ICP's Recipe Page, in this case using a Sputtered Ru hard mask and I-line stepper lithography. // John d 08:05, 27 May 2021 (PDT)

Wafer Polisher available

We have added an Allied Wafer Polish tool to our equipment list. Contact Brian Lingg for more information. // John d 16:49, 10 May 2021 (PDT)

Digital Microscope: Olympus DSX-1000

You'll see a new digital microscope in Bay 4/Metrology, that's our new Olympus DSX-1000. We are currently developing procedures, keep an eye out for training emails. // John d 13:49, 8 April 2021 (PDT)

Raith Velion: FIB/SEM Installation

We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1. The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.

Learn more about the tool's capabilities at the Raith website:

Tool qualification is currently underway. Dr. Dan Read is be the resident expert on this new tool.

// John d 06:53, 30 November 2020 (PST)