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  • |super= Bill Millerski *[//wiki.nanotech.ucsb.edu/w/images/7/7b/Xactic-XetchX3-System-Manual.pdf System Manual]
    2 KB (292 words) - 10:55, 30 August 2022
  • |super2= Bill Millerski ...terials for the chlorine-based etching are photoresist (at powers &lt; 200 W), Ni, SiO<sub>2</sub>, and SrF<sub>2</sub>. The wafer chuck can be heated t
    3 KB (370 words) - 10:44, 30 August 2022
  • |super2= Bill Millerski *ICP Power (max): 3000 W
    4 KB (518 words) - 10:47, 30 August 2022
  • |super2= Bill Millerski ...'' & '''Ta<sub>2</sub>O<sub>5</sub>''', both of which are extremely stable w/r/to refractive index. Users typically calibrate their dep. rates prior to
    3 KB (436 words) - 10:38, 30 August 2022
  • |super2= Bill Millerski ...ment system, alignment error better than 0.15 um is achieved. With the 350 W Hg arc lamp, we get approximately 180 mW/cm² of i-line intensity at the wa
    4 KB (537 words) - 10:02, 30 August 2022
  • |super2 = Bill Millerski ...ent system, alignment error better than 0.15 um is achieved. With the 1000 W Hg arc lamp, we get about 420 mW/cm² of i-line intensity at the wafer.
    5 KB (660 words) - 10:02, 30 August 2022