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• Ashers (Technics PEII)
  .../sub>N₄ films. The systems are both equipped with O₂ for organic removal / surface activation. One system also has CF₄/O₂ 88% / 12% for etching Si₃N₄. These systems are operated manually an
  2 KB (347 words) - 13:06, 11 November 2022
• Nanofab Job Postings
  ''The following are positions we are currently hiring for:'' *This position is for current UCSB Undergraduate students. Ideally in a technical field, optional
  4 KB (607 words) - 11:48, 24 April 2024
• Sputtering Recipes
  {{recipes|Vacuum Deposition}} {{rl|Atomic Layer Deposition Recipes|Pt deposition (ALD)}}
  16 KB (2,290 words) - 21:36, 21 September 2023
• Wet Etching Recipes
  ==Table of Wet Etching Recipes== [[Wet Etching Recipes#Organic%20removal|Piranha Solution]]
  10 KB (1,405 words) - 10:34, 1 April 2024
• Stepper 3 (ASML DUV)
  The ASML 5500 stepper is a 248nm (KrF) DUV stepper for imaging dense features down to below 200nm and isolated line structures dow ...ligned patterns from multiple masks/reticles in a single session, allowing for process optimization of large vs. small features in a single lithography.
  9 KB (1,400 words) - 13:08, 3 May 2024
• ICP Etching Recipes
  {{recipes|Dry Etching}} ...a wafer from falling into the machine after the etch, you can [[Packaging Recipes#Wafer Bonder .28Logitech WBS7.29|mount to a carrier wafer using wax]].
  28 KB (4,356 words) - 12:49, 7 May 2024
• Wafer scanning process traveler
  Below is the procedure we use for calibrating particle counts on various machines, primarily depositions. The wafers for process calibration are ordered from a wafer supplier that sells high grade
  33 KB (5,424 words) - 17:05, 4 January 2024
• Frequently Asked Questions
  ...e entity (universtiy/company etc.) to see the process and paperwork needed for your staff to access our lab in-person. The [https://www.nanotech.ucsb.edu ====Can staff perform fabrication for us?====
  25 KB (4,202 words) - 20:37, 13 May 2024

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