Search results

• Staff List
  ==Process Group== ...es, recipe development, and some direct tool training and maintenance. The Process Group helps to ensure that equipment is providing the expected processing c
  5 KB (664 words) - 09:42, 11 March 2024
• PECVD Recipes
  ...7sHNAVvo/edit#gid=1270764394 PECVD 1 Process Control Plots] - Plots of all process control data=== ...G1KvtXqqTRDBI7sHNAVvo/edit#gid=0 SiO₂<nowiki> [PECVD 1] Current Process Control Data</nowiki>]
  14 KB (2,130 words) - 10:28, 20 December 2023
• PECVD 2 (Advanced Vacuum)
  *[[Wafer Coating Process Traveler]] *For particle counting method, see the [[Wafer scanning process traveler|Surfscan Scanning Procedure]]
  2 KB (284 words) - 10:30, 30 August 2022
• Foong Fatt
  |position = Process Scientist
  260 bytes (32 words) - 11:24, 1 February 2023
• Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick
  *Enter the process settings: **[setup] -> [Process Control]
  3 KB (531 words) - 10:52, 26 April 2023
• Lift-Off with DUV Imaging + PMGI Underlayer
  This process is intended for Deep-UV Exposure on the ASML DUV Stepper. PMGI is used as ===Process Limits===
  4 KB (608 words) - 16:32, 27 April 2022
• PECVD 1 (PlasmaTherm 790)
  ...re-defined thicknesses. Custom programs for dielectric stacks or different process parameters can be written and saved. *[[PECVD1 Wafer Coating Process|Wafer Coating Process Traveler]]
  3 KB (388 words) - 10:30, 30 August 2022
• Vapor HF Etch (uETCH)
  ...is a microscope attached to this tool, with which you can monitor the etch process of your sample. You can change the number of etch cycles during a run, whic
  1 KB (257 words) - 16:41, 30 January 2014
• Stepper 1 (GCA 6300)
  ...ocesses. AZnLOF5510 for 1.0um and AZnLOF 2020 for 1.5-3 um negative resist process. Shipley LOL-2000 is also used as an underlayer for high resolution lift-of *Lens: Olympus 2142: NA = 0.42; Depth of field = 1.2 um for 0.7 um process
  5 KB (693 words) - 17:43, 12 February 2024
• Plasma Clean (YES EcoClean)
  ...~120°C to 200°C by controlling the sample height via the lift pins during process, while being exposed to ICP-cracked oxygen to remove organic materials. ...  Heat is used to increase reaction rate.  Treat this as a purely chemical process, accelerated by heat (Arrhenius plot - rate goes up exponentially with temp
  3 KB (497 words) - 12:31, 22 November 2023
• Rapid Thermal Processor (SSI Solaris 150)
  ...ermal Anneal” (RTA) system for R&D and pre-production. The Solaris 150 can process up to 152.4mm substrates at a temperature range from RT- 1200 degrees. The The Solaris uses a unique PID process controller that ensures accurate temperature stability and uniformity. The
  2 KB (248 words) - 08:36, 8 December 2023
• XeF2 Etch (Xetch)
  The XeF₂ etch process is a purely chemical one and usually results in a rough etched surface. The ...is a microscope attached to this tool, with which you can monitor the etch process of your sample. You can change the number of etch cycles during a run, whic
  2 KB (323 words) - 15:03, 30 October 2023
• Rapid Thermal Processor (AET RX6)
  ...ntrol software has been added to the system by Sedona Visual Controls. All process parameters are monitored and stored. Typical anneals are done for: ohmic co *Windows-based process monitoring and control software by Sedona Visual Controls
  2 KB (290 words) - 08:58, 15 June 2023
• Surface Analysis (KLA/Tencor Surfscan)
  *[[Wafer scanning process traveler|Wafer Particle Count - Process Traveler]]
  3 KB (357 words) - 18:02, 2 February 2024
• Ning Cao
  Processing all kinds of semiconductor devices. with deep process experience: lithography, dry etch, film depositions, etc.
  899 bytes (108 words) - 12:18, 24 March 2020
• Wafer Coating Process Traveler1
  ...u could leave and come back when all runs are finished. You should monitor process at the very beginning to make sure there are no any issues with the run. ...u could leave and come back when all runs are finished. You should monitor process at the very beginning to make sure there are no any issues with the run.
  4 KB (711 words) - 13:32, 30 March 2020
• Focused Ion-Beam Lithography (Raith Velion)
  • SEM imaging for in-situ process control, inspection and sample preparation. * Process control for rapid prototyping
  2 KB (285 words) - 09:56, 15 March 2021
• Dry Etching Recipes
  ...>[[Process Group - Process Control Data#Etching .28Process Control Data.29|Process Control Data]]</u>=== ...nked page]] for [https://en.wikipedia.org/wiki/Statistical_process_control process control data] (dep rate/stress etc. over time), for a selection of often-us
  14 KB (1,875 words) - 15:31, 7 February 2024
• Stepper 2 (AutoStep 200)
  *Lens: Olympus 2145: NA = 0.45; Depth of field = 1.2 um for 0.6 um process ==Process Information==
  6 KB (893 words) - 17:44, 12 February 2024
• Tom Reynolds
  ...nior Development Engineer to finish the new facilities and install all the process equipment into the current Engineering Science Building Nanofab. ...nues to offer assistance in the operations of the lab while working on new process equipment selection and installs. He is working on several lab projects at
  2 KB (333 words) - 08:29, 7 August 2020

View (previous 20 | next 20) (20 | 50 | 100 | 250 | 500)