Difference between revisions of "RIE Etching Recipes"

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(Photoresist and ARC: added tool name to header title)
m (Photoresist and ARC (RIE 5))
 
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== Photoresist and ARC (RIE 5) ==
 
== Photoresist and ARC (RIE 5) ==
   
=== DUV42P (AR2) etching: ===
+
=== DUV42P (AR2) etching ===
 
* O2 = 20sccm // Pressure = 10mT // RF = 100W // Time = 40 sec
 
* O2 = 20sccm // Pressure = 10mT // RF = 100W // Time = 40 sec
 
* No need to pump/purge, can etch right away.
 
* No need to pump/purge, can etch right away.

Latest revision as of 10:02, 14 June 2021