NanoFab Process Group
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This page lists various processes used internally by the NanoFab Process Group.
Dicing Procedures
Photoresist Application, Cleaning and Shipping
- PR Spin for Dicing Protect - ~800nm thick PR only (UV6)
- PR Clean of UV-6
- Shipping Samples on Dicing Tape+Frame
Dicing Alignment Mark Exposure
For providing alignment marks to use while dicing.
- ASML Stepper #3: Dicing Alignment Guides
- How to program the ASML to shoot some alignment markers for use during dicing.
Process Control Calibration Procedures
Etching Tools
- Unaxis PM1: Indium Phosphide Etch Verification Procedure
- ICP#1/2: SiO2 Etch Verification Procedure
- PlasmaTherm SLR: SiO2 Etch Verification Procedure
- PlasmaTherm DSEiii: Si Etch Verification Procedure
Deposition Tools
- PECVD#1: Process Verification Procedure
- PECVD#2: Process Verification Procedure
- Unaxis PM3: Process Verification Procedure
- Veeco IBD: Process Verification Procedure
Equipment Calibration Procedures
Lithography Tools
- GCA 6300 Stepper #1: Calibration Procedure
- GCA AutoStep 200, Stepper #2: Calibration procedure
- ASML 5500 Stepper#3: Calibration Verification/Update procedure
Examples for Users
Example of Job Organization, Data Organization, Travelers and Design of Experiements for users.
- Example Trello task tracking board, and the corresponding:
- Google Drive folder, linked from the above cards, containing travelers, 'fab data etc.