Difference between revisions of "Mechanical Polisher (Allied)"

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= About =
+
=About=
 
The Allied Polisher allows for bulk thinning of substrates, and fine polishing of optical waveguide facets. Various materials are typically lapped/polished, such as Silicon GaAs, InP.
 
The Allied Polisher allows for bulk thinning of substrates, and fine polishing of optical waveguide facets. Various materials are typically lapped/polished, such as Silicon GaAs, InP.
   
== Detailed Specs ==
+
==Detailed Specs==
* Max. Substrate Size
 
* Lapping Films available:
 
** 10µm AlOx
 
** 5µm AlOx
 
** 2µm AlOx
 
** 1µm AlOx
 
** 0.5 AlOx
 
   
 
*Max. Substrate Size
== Operating Procedures ==
 
 
*Lapping Films available:
* ''To Be Added''
 
 
**10µm AlOx
 
**5µm AlOx
 
**2µm AlOx
 
**1µm AlOx
 
**0.5 AlOx
   
== Recipes ==
+
==Operating Procedures==
  +
* ''To Be Added''
 
  +
*[https://wiki.nanotech.ucsb.edu/w/images/f/f2/Mechanical_Polisher_SOP_Rev_A.pdf Mechanical Polisher SOP]
  +
  +
==Recipes==
  +
 
*''To Be Added''

Latest revision as of 09:06, 15 May 2023

Mechanical Polisher (Allied)
AlliedPolisher10-1110.jpg
Location ESB Rm. 1111
Tool Type Wet Processing
Manufacturer Allied High Tech Products Inc.
Model 10-1110
Description Mechanical Polisher

Primary Supervisor Bill Millerski
(805) 893-2655
wmillerski@ucsb.edu

Recipes N/A

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About

The Allied Polisher allows for bulk thinning of substrates, and fine polishing of optical waveguide facets. Various materials are typically lapped/polished, such as Silicon GaAs, InP.

Detailed Specs

  • Max. Substrate Size
  • Lapping Films available:
    • 10µm AlOx
    • 5µm AlOx
    • 2µm AlOx
    • 1µm AlOx
    • 0.5 AlOx

Operating Procedures

Recipes

  • To Be Added