MLA Recipes

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Maskless Aligner (Heidelberg MLA150)

Photolithography Recipes for the Heidelberg MLA150. Description of litho params- different lasers available, greyscale etc.

Positive Resist (MLA150)

General notes: Hotplates used, filters, laser wavelengths, etc. “Soft Bake” is right after spin, “PEB” is post-exposure bake - right after exposure

Resist Spin Cond. Soft Bake Thickness Laser (nm) Exposure Dose (mJ/cm2) DeFocus Post-Exposure Bake Developer Developer Time Comments
AZ4110 4 krpm/30s 95°C/60s ~ 1.1 µm 405 240 5 none AZ400K:DI 1:4 50s Used MLA design (good for isolated lines 0.8-1um)
AZ4330 4 krpm/30s 95°C/60s ~ 3.3 µm 405 320 6 none AZ400K:DI 1:4 90s Used MLA design
AZ4620
SPR 220-3.0 2.5 krpm/30s 115°C/90” ~ 2.7 µm 405 325 - 4 115°C/90s AZ300MIF 60s Used MLA design
SPR 955-CM0.9 3 krpm/30s 95°C/90” ~ 0.9 µm 405 250 - 7 110°C/90s AZ300MIF 60s Used MLA design
THMR-3600HP 1.5 krpm/45s250 rpm/s 100°C/60s 0.430µm 405 180–220 -4 100°C/60s AZ300MiF 20s line/space:

low dose for clear-field, high does for dark-field

Negative Resist (MLA150)

General notes: Hotplates used, filters, laser wavelengths, etc. “Soft Bake” is right after spin, “PEB” is post-exposure bake - right after exposure. “Flood exposure” is only for AZ5214 for image reversal, after PEB.

Resist Spin Cond. Soft Bake Thickness Laser (nm) Exposure Dose (mJ/cm2) DeFocus PEB Flood Developer Developer Time Comments
AZ5214 6 krpm/30s 95°C/60s ~ 1.0 µm 375 35 - 5 110°C/60s 60" AZ300MIF 60s Used UCSB design. Good for up to ~1.3um open line space.
AZnLOF2020 4 krpm/30s 110°C/60s ~ 2.1µm 375 340 - 3 110°C/60s none AZ300MIF 90s Used UCSB design. Good for 2um open line space.
SU-8 2075 ~70µm 375 Extremely viscous. Pour into a wide-mouthed bottle, dispense directly from bottle. Replace napkin at end.

Greyscale Lithography (MLA150)

Description...

Resist Spin Cond. Bake Thickness Exposure Dose (mJ/cm2) Focus Offset PEB Flood Developer Developer Time Comments
AZ4620 – krpm/30” 95°C/60” 60" AZ300MIF 60"
  • TBD