Difference between revisions of "Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick"

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''Contributed by Miguel Daal, Mazin Group -- 2018-04-24''
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Draft only - in progress. -- Demis 2019-01-28
  
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''Procedure for wax-mounting a 100mm Silicon wafer to another 100mm silicon carrier wafer, using the [[Wafer Bonder (Logitech WBS7)|'''Logitech WBS7 Wafer Bonder''']].''
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* Heat up lower substrate on hotplate at 135°C
  
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* Apply XYZ grams of crystalbond wax, with stick, to the surface. Spread so that enough wax is present so that entire underside of upper substrate will be in contact with wax. Remove from hotplate and cool. If wax got on the underside, can spin face-down on POLOS spinner @ 2000rpm with ACE squirt bottle to remove.
  
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*Cover Hotplate surface with tinfoil, heat hotplate to 120°C. (Keep flammable solvents away!)
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* Place carrier wafer on Logitech bonder surface, wax face-up.
  
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* Place sample to be bonded on top
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*Place 4" polished handle wafer on hotplate.
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*Apply wax to center of wafer only, approximately <u>2-inch diameter</u> size puddle of crystal bond wax directly from the crystalbond stick.
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* Place 110mm chemical filter paper on top
  
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**For mounting a 4-inch wafer, you need a good amount of wax to ensure coverage to wafer edges, eg.<u>2-3mm thick</u>.
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* Close lid, secure lid clamp
  
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**Then remove wafer from hotplate. and cool. 
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* Run recipe:
  
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*Open Logitech Bonder chamber:
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** XYZ °C
  
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**Unscrew clamp until higher than clamp arm,
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** XYZ seconds
  
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**Swing front of clamp arm to the left (Difficult to disengage),
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** Vacuum etc.?
  
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**Lift bonder lid (also takes some force to open - ignore vacuum reading on digital display)
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*On the glass plate of the Logitech bonder:
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**Align work wafer on top of handle wafer placed.
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**Align the two wafers' flats.  
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*Place 6" piece of filter paper on top of work wafer.
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*Turn on Logitech bonder power (bottom right of machine chassis)
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*Close and lock Logitech bonder hatch.
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*On front panel of  Logitech bonder, confirm that Applied Pressure gauge is set to 5 psi.
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*Enter the process settings:
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**[setup] -> [Temp]
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***Bonding: 120°C      
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***Endpoint: 65°C
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***Offset: 20°C           
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***Units: C
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**[setup] -> [Vac Thres]
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***Proceed if Below: 2.4E+01 mBar
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***Abort if Below: 3.2E+01 mBar
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**[setup] -> [Process Control]
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***Process: Heat + Outgas
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***Soak: 5min
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***Bond: 15min
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***O.G. Limit: 20min
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***P.P. del: 1min
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**[Setup] -> [Heads]
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***Head 1 On
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*Start Process: [Process] -> [Start]
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*Process takes about 45min
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**Unload when it displays ''Status: Ready''
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*If wax leaked onto the glass plate: remove glass plate and clean with Acetone+Wipe.
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*Turn off Logitech bonder (bottom right of machine chassis)
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**Close lid and clamp
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*Clean excess wax off your wafer using the [[Wet Benches#Automated Wet-processing Spinners .28POLOS.29|POLOS Spinners]], and an Acetone squirt bottle, followed by ISO & N2 dry (run both sides of the wafer).

Revision as of 14:35, 15 November 2021

Contributed by Miguel Daal, Mazin Group  -- 2018-04-24

Procedure for wax-mounting a 100mm Silicon wafer to another 100mm silicon carrier wafer, using the Logitech WBS7 Wafer Bonder.

  • Cover Hotplate surface with tinfoil, heat hotplate to 120°C. (Keep flammable solvents away!)
  • Place 4" polished handle wafer on hotplate.
  • Apply wax to center of wafer only, approximately 2-inch diameter size puddle of crystal bond wax directly from the crystalbond stick.
    • For mounting a 4-inch wafer, you need a good amount of wax to ensure coverage to wafer edges, eg.2-3mm thick.
    • Then remove wafer from hotplate. and cool. 
  • Open Logitech Bonder chamber:
    • Unscrew clamp until higher than clamp arm,
    • Swing front of clamp arm to the left (Difficult to disengage),
    • Lift bonder lid (also takes some force to open - ignore vacuum reading on digital display)
  • On the glass plate of the Logitech bonder:
    • Align work wafer on top of handle wafer placed.
    • Align the two wafers' flats.  
  • Place 6" piece of filter paper on top of work wafer.
  • Turn on Logitech bonder power (bottom right of machine chassis)
  • Close and lock Logitech bonder hatch.
  • On front panel of  Logitech bonder, confirm that Applied Pressure gauge is set to 5 psi.
  • Enter the process settings:
    • [setup] -> [Temp]
      • Bonding: 120°C      
      • Endpoint: 65°C
      • Offset: 20°C           
      • Units: C
    • [setup] -> [Vac Thres]
      • Proceed if Below: 2.4E+01 mBar
      • Abort if Below: 3.2E+01 mBar
    • [setup] -> [Process Control]
      • Process: Heat + Outgas
      • Soak: 5min
      • Bond: 15min
      • O.G. Limit: 20min
      • P.P. del: 1min
    • [Setup] -> [Heads]
      • Head 1 On
  • Start Process: [Process] -> [Start]
  • Process takes about 45min
    • Unload when it displays Status: Ready
  • If wax leaked onto the glass plate: remove glass plate and clean with Acetone+Wipe.
  • Turn off Logitech bonder (bottom right of machine chassis)
    • Close lid and clamp
  • Clean excess wax off your wafer using the POLOS Spinners, and an Acetone squirt bottle, followed by ISO & N2 dry (run both sides of the wafer).
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