Difference between revisions of "ICP-PECVD (Unaxis VLR)"
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| − | = About | + | =About= |
This system is configured as an ICP PECVD deposition tool with 1000 W ICP power, 600 W RF substrate power, and 50°C-350°C operation. This chamber has 100% SiH<sub>4,</sub> N<sub>2</sub>, O<sub>2</sub>, and Ar for gas sources. The high density PECVD produces a more dense, higher quality SiO<sub>2</sub> and Si<sub>3</sub>N<sub>4</sub>, as compared with conventional PECVD. With the high density plasma, deposition of high quality films can be deposited as low as 50°C for processes requiring lower temperatures. Stress compensation for silicon nitride is characterized. | This system is configured as an ICP PECVD deposition tool with 1000 W ICP power, 600 W RF substrate power, and 50°C-350°C operation. This chamber has 100% SiH<sub>4,</sub> N<sub>2</sub>, O<sub>2</sub>, and Ar for gas sources. The high density PECVD produces a more dense, higher quality SiO<sub>2</sub> and Si<sub>3</sub>N<sub>4</sub>, as compared with conventional PECVD. With the high density plasma, deposition of high quality films can be deposited as low as 50°C for processes requiring lower temperatures. Stress compensation for silicon nitride is characterized. | ||
| − | = Detailed Specifications | + | === Cluster Configuration === |
| + | A Deposition and Etch chamber are both attached to the same loadlock, allowing etching and deposition without breaking vacuum. Each chamber can be scheduled separately on SignupMonkey. | ||
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| + | * PM3: [[ICP-PECVD (Unaxis VLR)|ICP-PECVD Deposition (Unaxis VLR)]] | ||
| + | * PM1: [[ICP-Etch (Unaxis VLR)|ICP Etch (Unaxis VLR)]] | ||
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| + | =Detailed Specifications= | ||
*1000W ICP source, 600W RF Sample Bias Power Supply | *1000W ICP source, 600W RF Sample Bias Power Supply | ||
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=Documentation= | =Documentation= | ||
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| + | *[//www.nanotech.ucsb.edu/wiki/images/1/1f/Unaxis_PM3_Web_Operational_Procedure_3-27-14.pdf Operating Instructions] | ||
Revision as of 15:23, 27 November 2019
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About
This system is configured as an ICP PECVD deposition tool with 1000 W ICP power, 600 W RF substrate power, and 50°C-350°C operation. This chamber has 100% SiH4, N2, O2, and Ar for gas sources. The high density PECVD produces a more dense, higher quality SiO2 and Si3N4, as compared with conventional PECVD. With the high density plasma, deposition of high quality films can be deposited as low as 50°C for processes requiring lower temperatures. Stress compensation for silicon nitride is characterized.
Cluster Configuration
A Deposition and Etch chamber are both attached to the same loadlock, allowing etching and deposition without breaking vacuum. Each chamber can be scheduled separately on SignupMonkey.
Detailed Specifications
- 1000W ICP source, 600W RF Sample Bias Power Supply
- 50 - 350°C sample temperature
- 100% SiH4, Ar, N2, O2
- Multiple 4” diameter wafer capable system
- Pieces possible by mounting or placing on 4 ” wafer