Difference between revisions of "File:SiO2 Etch, Ru HardMask - Fluorine ICP Etch Process - Ning Cao 2019-06.pdf"
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(Procedure for SiO2 deep etching on Plasma-Therm SLR Fluorine Etcher, using Sputtered Ruthenium hardmask) |
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Revision as of 11:56, 9 June 2020
Summary
Procedure for SiO2 deep etching on Plasma-Therm SLR Fluorine Etcher, using Sputtered Ruthenium hardmask
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current | 12:01, 9 June 2020 | (1.08 MB) | John d (talk | contribs) | updated TOC and heading styles |
11:56, 9 June 2020 | (1.08 MB) | John d (talk | contribs) | added TOC, minor formatting | |
11:29, 9 June 2020 | (1.13 MB) | John d (talk | contribs) | Procedure for SiO2 deep etching on Plasma-Therm SLR Fluorine Etcher, using Sputtered Ruthenium hardmask |
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