Difference between revisions of "E-Beam 4 (CHA)"

From UCSB Nanofab Wiki
Jump to: navigation, search
(Changed tool supervisor.)
Line 2: Line 2:
 
|picture=e-beam4.jpg
 
|picture=e-beam4.jpg
 
|type = Vacuum Deposition
 
|type = Vacuum Deposition
|super= Brian Lingg
+
|super= Don Freeborn
|phone=(805)839-3918x210
+
|phone=(805)839-7975
 
|location=Bay 3
 
|location=Bay 3
|email=lingg@ece.ucsb.edu
+
|email=dfreeborn@ece.ucsb.edu
 
|description = Multi-Wafer Evaporator
 
|description = Multi-Wafer Evaporator
 
|manufacturer = CHA Industries
 
|manufacturer = CHA Industries
Line 28: Line 28:
   
 
=Documentation=
 
=Documentation=
*[[media:Wiki Operational Procedure EB4 With EBC Rev 3.pdf|Operating Procedures]]
+
*[//wiki.nanotech.ucsb.edu/w/images/8/8b/Wiki_Operational_Procedure_EB4_With_EBC_Rev_3.pdf Operating Procedures]
   
 
= Materials Table =
 
= Materials Table =

Revision as of 18:51, 20 March 2020

E-Beam 4 (CHA)
E-beam4.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Don Freeborn
Supervisor Phone (805) 893-7975
Supervisor E-Mail dfreeborn@ece.ucsb.edu
Description Multi-Wafer Evaporator
Manufacturer CHA Industries
Model SEC-600-RAP
Vacuum Deposition Recipes
Sign up for this tool


About

This electron-beam evaporation system is a bell-jar type system and has the capability to do up to 9-4” wafers in a lift-off configuration and up to 18-4” wafers in a sidewall coverage configuration. Rotational motion in combination with baffling is used for lift-off and provides roughly 5% uniformity across a 4” wafer. The sidewall coverage fixturing uses full planetary motion to provide coverage over all sidewalls. The system also an 8-pocket e-beam source and an Inficon IC/5 deposition controller that allows for programming of fully automated multiple layer depositions. The metals available for deposition are Al, Ti, Au, Pt, Ni, Pd, Ag, Ge, Fe, NiCr, NiFe and Cr. This system is used for n-type ohmic contact metalization to compound semiconductors, Schottky contacts to semiconductors, bond pads, and other general metalizations. The maximum deposition thickness during a run is limited to 1.0 microns.

Detailed Specifications

  • Temescal 10kV power supply
  • 1-Temescal 8-pocket series 260 e-beam sources
  • Cryo-pumped system with ~ 5e-7 ultimate base pressure
  • Rotation with baffle for 5% uniformity over 4” wafer
  • Automatic vacuum sequencing
  • Temescal e-beam sweep control
  • Inficon IC/5 programmable crystal thickness monitoring system
  • Automatic deposition of multiple layer stacks
  • Sample size: Pieces or up to 10-4” wafers for lift-off and 24-4” wafers for sidewall coverage
  • Metals: Al, Ti, Au, Pt, Ni, Pd, Ag, Ge, Fe, NiCr, NiFe, Cr

Documentation

Materials Table

For the materials tables, please visit the E-Beam Recipe Page.