Difference between revisions of "Bill Millerski"
Jump to navigation
Jump to search
(Add Page for Bill Millerski) |
|||
| (5 intermediate revisions by the same user not shown) | |||
| Line 1: | Line 1: | ||
{{staff|{{PAGENAME}} |
{{staff|{{PAGENAME}} |
||
| − | |position = Equipment Engineer |
+ | |position = Senior Equipment Engineer |
|room = 1109F |
|room = 1109F |
||
| − | |phone = (805) |
+ | |phone = (805) 839-2655 |
| − | |cell = |
||
|email = wmillerski@ucsb.edu |
|email = wmillerski@ucsb.edu |
||
}} |
}} |
||
| − | =About= |
+ | = About = |
| + | . |
||
| + | . |
||
| − | =Current Work= |
||
| + | |||
| + | . |
||
=Tools= |
=Tools= |
||
| − | + | {{PAGENAME}} is the supervisor for the following tools. |
|
| + | |||
| − | * |
||
| + | {| |
||
| + | |- valign="top" |
||
| + | | |
||
| + | * [[Atomic Layer Deposition (Oxford FlexAL)]] |
||
| + | * [[Stepper 1 (GCA 6300)]] |
||
| + | * [[Stepper 2 (AutoStep 200)]] |
||
| + | * [[Ion Beam Deposition (Veeco NEXUS)]] |
||
| + | * [[RIE 5 (PlasmaTherm)]] |
||
| + | * [[Rapid Thermal Processor (AET RX6)]] |
||
| + | * [[Rapid Thermal Processor (SSI Solaris 150)]] |
||
| + | * [[Step Profilometer (KLA Tencor P-7)]] |
||
| + | * [[Chemical-Mechanical Polisher (Logitech)]] |
||
| + | || |
||
| + | * [[XeF2 Etch (Xetch)]] |
||
| + | * [[Mechanical Polisher (Allied)]] |
||
| + | * [[Tube Furnace Wafer Bonding (Thermco)]] |
||
| + | * [[E-Beam 1 (Sharon)]] |
||
| + | * [[Resistivity Mapper (CDE RESMAP)]] |
||
| + | * [[Optical Film Thickness (Nanometric)]] |
||
| + | * [[Vapor HF Etch]] |
||
| + | * [[Wafer Bonder (Logitech WBS7)]] |
||
| + | |} |
||
Latest revision as of 08:28, 28 October 2021
|
About
.
.
.
Tools
Bill Millerski is the supervisor for the following tools.