Difference between revisions of "Ashers (Technics PEII)"

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(Added recipes, updated applications with times.)
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= About =
+
=About=
  
 
These two parallel plate plasma etching systems are generally used to clean organic residue off of semiconductor wafers (ashing), etch organic films, or etch Si<sub>3</sub>N<sub>4</sub> films. The systems are both equipped with O<sub>2</sub> for organic removal / surface activation.   
 
These two parallel plate plasma etching systems are generally used to clean organic residue off of semiconductor wafers (ashing), etch organic films, or etch Si<sub>3</sub>N<sub>4</sub> films. The systems are both equipped with O<sub>2</sub> for organic removal / surface activation.   
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One system also has CF<sub>4</sub>/O<sub>2</sub> 88% / 12% for etching Si<sub>3</sub>N<sub>4</sub>. These systems are operated manually and no sign-up is required.  
 
One system also has CF<sub>4</sub>/O<sub>2</sub> 88% / 12% for etching Si<sub>3</sub>N<sub>4</sub>. These systems are operated manually and no sign-up is required.  
  
=== Applications ===
+
===Mechanism===
This is an RIE etch with O2 - using plasma ion bombardment, in a semi-vertical direction (although the higher 300mT pressure does attack sidewalls somewhat).  
+
This is a low-frequency RIE etch with O2 - using plasma ion bombardment, in a semi-vertical direction (although the higher 300mT pressure does attack sidewalls somewhat). The low kHz frequency allows ion to move with the RF, providing higher ion bombardment 
  
 
Low-temp (energy comes from ion acceleration, not temperature).
 
Low-temp (energy comes from ion acceleration, not temperature).
  
Use this for situation where the material to be removed is resistant to chemicals (fluorocarbon polymers - think "plastic") and/or relatively hard (chlorinated PR, after a CL2/BCl2 etch), so physical bombardment is necessary to break up the material, or if high-temp is not acceptable.
+
=== Applications ===
 +
Use this for situation where the material to be removed is resistant to chemicals (fluorocarbon polymers - think "plastic") and/or relatively hard (chlorinated PR, after a CL2/BCl2 etch), so physical bombardment is necessary to break up the material, or if high-temp is not acceptable. Typical times: ~2min and microscope inspect and repeat.
  
 
Stripping full-thickness PR's in the PEii is slow, at something like ~100nm/1min (at standard 100W/300mT).
 
Stripping full-thickness PR's in the PEii is slow, at something like ~100nm/1min (at standard 100W/300mT).
  
Surface activation, eg. making the surface hydrophilic before water-based wet-etching (15sec). This is very important for wet-etch processing through small, high aspect ratio photoresist holes or lines. Or to increase adhesion of the next deposition (~1min) - etch is a bit more aggressive and will go through any monolayers (organic or otherwise).
+
Surface activation, eg. making the surface hydrophilic before water-based wet-etching (15sec), or dehydration of wafer surface before HMDS application. This is very important for wet-etch processing through small, high aspect ratio photoresist holes or lines.  
 +
 
 +
Increase adhesion of the next deposition (~2-4min), for example right before loading into evaporator for lift-off. Etch is a bit more aggressive and will go through any monolayers (organic or otherwise), and possibly slightly roughen the surface 
 +
 
 +
=Detailed Specifications=
 +
 
 +
*Gases used: CF<sub>4</sub> / O<sub>2</sub> (88%/12%) and O<sub>2</sub>
 +
*~ 10mT ultimate chamber pressure
 +
*100 kHz directly coupled excitation source
 +
*Sample size: pieces to 6” wafers
 +
*Gas flow and power control
  
= Detailed Specifications  =
+
== Recipes ==
  
*Gases used: CF<sub>4</sub> / O<sub>2</sub> (88%/12%) and O<sub>2</sub>
 
*~ 10mT ultimate chamber pressure
 
*100 kHz directly coupled excitation source
 
*Sample size: pieces to 6” wafers
 
*Gas flow and power control
 
 
*Typical process conditions:  
 
*Typical process conditions:  
**Ashing: O2 300mT, 100W power, 30 sec.  
+
**Ashing: O2 300mT, 100W power, 30 sec up to 5 min.   Make surface hydrophilic: same as above, 15-30sec 
 
**Si3N4 Etching: CF<sub>4</sub>/O<sub>2</sub> 300mT, 100W, ~ 100–150 nm / min. etch rate
 
**Si3N4 Etching: CF<sub>4</sub>/O<sub>2</sub> 300mT, 100W, ~ 100–150 nm / min. etch rate

Revision as of 18:05, 15 June 2022

Ashers (Technics PEII)
Ashers.jpg
Tool Type Dry Etch
Location Bay 5
Supervisor Mike Day
Supervisor Phone (805) 893-3101
Supervisor E-Mail day@ece.ucsb.edu
Description Plasma Etching Systems
Manufacturer Technics
Model PE II-A
Dry Etch Recipes



About

These two parallel plate plasma etching systems are generally used to clean organic residue off of semiconductor wafers (ashing), etch organic films, or etch Si3N4 films. The systems are both equipped with O2 for organic removal / surface activation.

One system also has CF4/O2 88% / 12% for etching Si3N4. These systems are operated manually and no sign-up is required.

Mechanism

This is a low-frequency RIE etch with O2 - using plasma ion bombardment, in a semi-vertical direction (although the higher 300mT pressure does attack sidewalls somewhat). The low kHz frequency allows ion to move with the RF, providing higher ion bombardment

Low-temp (energy comes from ion acceleration, not temperature).

Applications

Use this for situation where the material to be removed is resistant to chemicals (fluorocarbon polymers - think "plastic") and/or relatively hard (chlorinated PR, after a CL2/BCl2 etch), so physical bombardment is necessary to break up the material, or if high-temp is not acceptable. Typical times: ~2min and microscope inspect and repeat.

Stripping full-thickness PR's in the PEii is slow, at something like ~100nm/1min (at standard 100W/300mT).

Surface activation, eg. making the surface hydrophilic before water-based wet-etching (15sec), or dehydration of wafer surface before HMDS application. This is very important for wet-etch processing through small, high aspect ratio photoresist holes or lines.

Increase adhesion of the next deposition (~2-4min), for example right before loading into evaporator for lift-off. Etch is a bit more aggressive and will go through any monolayers (organic or otherwise), and possibly slightly roughen the surface

Detailed Specifications

  • Gases used: CF4 / O2 (88%/12%) and O2
  • ~ 10mT ultimate chamber pressure
  • 100 kHz directly coupled excitation source
  • Sample size: pieces to 6” wafers
  • Gas flow and power control

Recipes

  • Typical process conditions:
    • Ashing: O2 300mT, 100W power, 30 sec up to 5 min. Make surface hydrophilic: same as above, 15-30sec
    • Si3N4 Etching: CF4/O2 300mT, 100W, ~ 100–150 nm / min. etch rate