Difference between revisions of "Test Data of etching SiO2 with CHF3/CF4-ICP1"
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Revision as of 10:09, 30 March 2022
Date | Sample# | Etch Rate (nm/min) | Etch Selectivity (SiO2/PR) | Averaged Sidewall Angle (o) | SEM Images |
1/28/2019 | I11901 | 110 | 1.35 | see SEM → | [1] |
5/29/2019 | I11903 | 105 | 1.41 | [2] | |
1/13/2020 | I12001 | 78.0 | 1.06 | unusual - two regions | [3] |
Rate on 1/13/2020 is low by ~20%, so chamber was wet-cleaned on 1/21/2020. Data below for 1/23 shows rate returned to "normal". | |||||
1/23/2020 | I12002 | 109 | 1.16 | [4] | |
2/28/2020 | I12003 | 119 | 1.17 | 56.6 | [5] |
Sidewall profile on 2/28/2020 etches is slanted, chamber will be wet-cleaned on 3/2/2020 and re-tested. Data below shows etch returned to "normal". | |||||
3/3/2020 | I12004 | 110 | 1.05 | [6] | |
1/7/2021 | I12101 | 118 | 1.12 | [7] | |
3/2/2022 | NP_ICP1_01 | 141.4 | 1.20 | [1] [2] | |
3/8/2022 | NP_ICP1_02 | 133.7 | 1.12 | [1] [2] | |
3/29/2022 | NP_ICP1_03 | 136.9 | 1.19 | [1][2] |
OLD Etch Test Data
Alternate SiO2 etch recipe with O2 included.
ICP#1: 0.5Pa, 50/500W, CHF3/CF4/O2=35/5/10sccm, time=210 sec | |||||
Date | Sample# | Etch Rate (nm/min) | Etch Selectivity (SiO2/PR) | Averaged Sidewall Angle (o) | SEM Images |
1/28/2019 | I11902 | 78.1 | 0.63 | [8] | |
5/29/2019 | I11904 | 71.1 | 0.58 | [9] |