Difference between revisions of "Tool List"
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− | = |
+ | =Vacuum Deposition= |
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{| |
{| |
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− | |- |
+ | |-valign="top" |
− | | |
+ | |width=300| |
− | *[[E-Beam 1 (Sharon)]] |
+ | * [[E-Beam 1 (Sharon)]] |
− | *[[E-Beam 2 (Custom)]] |
+ | * [[E-Beam 2 (Custom)]] |
− | *[[E-Beam 3 (Temescal)]] |
+ | * [[E-Beam 3 (Temescal)]] |
− | *[[E-Beam 4 (CHA)]] |
+ | * [[E-Beam 4 (CHA)]] |
− | *[[Sputter 1 (Custom)]] |
+ | * [[Sputter 1 (Custom)]] |
− | *[[Sputter 2 (SFI Endeavor)]] |
+ | * [[Sputter 2 (SFI Endeavor)]] |
− | *[[Sputter 3 ( |
+ | * [[Sputter 3 (AJA)]] |
− | *[[Sputter 4 ( |
+ | * [[Sputter 4 (AJA)]] |
− | *[[Sputter 5 (Lesker AXXIS)]] |
+ | * [[Sputter 5 (Lesker AXXIS)]] |
⚫ | |||
− | |||
⚫ | |||
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− | *[[PECVD |
+ | * [[PECVD 2 (Advanced Vacuum)]] |
+ | * [[Thermal Evap 1]] |
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⚫ | |||
− | *[[Thermal Evap |
+ | * [[Thermal Evap 2]] |
− | *[[ |
+ | * [[Unaxis VLR ICP-PECVD]] |
+ | * [[Ion Beam Deposition (Veeco NEXUS)]] |
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− | *[[Unaxis VLR ICP-PECVD]] |
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− | *[[ |
+ | * [[Molecular Vapor Deposition]] |
⚫ | |||
− | *[[Molecular Vapor Deposition]] |
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+ | |- |
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| width="400" | |
| width="400" | |
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− | *[[ICP Etch 1 (Panasonic |
+ | *[[ICP Etch 1 (Panasonic E620)]] |
− | *[[ICP Etch 2 (Panasonic |
+ | *[[ICP Etch 2 (Panasonic E626)]] |
*[[UV Ozone Reactor]] |
*[[UV Ozone Reactor]] |
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*[[Plasma Clean (Gasonics 2000)]] |
*[[Plasma Clean (Gasonics 2000)]] |
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Line 121: | Line 119: | ||
* [[Optical Film Thickness (Nanometric)]] |
* [[Optical Film Thickness (Nanometric)]] |
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* [[Scanning Probe Microscope (Veeco NanoMan)]] |
* [[Scanning Probe Microscope (Veeco NanoMan)]] |
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− | * [[ Surfscan 6200]] |
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|width=400| |
|width=400| |
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* [[Tencor Flexus Film Stress]] |
* [[Tencor Flexus Film Stress]] |
Revision as of 15:31, 9 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)