Difference between revisions of "Tool List"

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m (Protected "Tool List" ([edit=sysop] (indefinite) [move=sysop] (indefinite)))
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* [[Tube Furnace Wafer Bonding (Thermco)]]
 
* [[Tube Furnace Wafer Bonding (Thermco)]]
 
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
 
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
  +
* [[Wafer Bonder (SUSS SB6-8E)]]
   
 
=Packaging=
 
=Packaging=
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* [[Flip-Chip Bonder (Finetech)]]
 
* [[Flip-Chip Bonder (Finetech)]]
 
* [[Vacuum Sealer]]
 
* [[Vacuum Sealer]]
* [[Wafer Bonder (SUSS SB6-8E)]]
 
 
* [[Wire Saw (Takatori)]]
 
* [[Wire Saw (Takatori)]]
   

Revision as of 13:02, 18 July 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization