Difference between revisions of "Tool List"

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__NOTOC__
  
__NOTOC__
 
=Lithography=
  
=Lithography=
  +
 
{|
  
{|
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|- valign="top"
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|width=300|
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| width="300" |
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=====Photoresists and Lithography Chemicals=====
−
* [[Suss Aligners (SUSS MJB-3)]]
  
  +
−
* [[IR Aligner (SUSS MJB-3 IR)]]
  
  +
*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
−
* [[DUV Flood Expose]]
  
  +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
−
* [[Ovens 1, 2 & 3 (Labline)]]
  
  +
−
* [[Oven 4 (Fisher)]]
  
  +
=====Contact Aligners (Optical Exposure)=====
−
* [[Oven 5 (Blue M)]]
  
  +
−
* [[Vacuum Oven (YES)]]
  
  +
*[[Suss Aligners (SUSS MJB-3)|Contact Aligners (SUSS MJB-3)]]
−
* [[Holographic Lith/PL Setup]]
  
  +
*[[Contact Aligner (SUSS MA-6)]]
−
|width=400|
  
−
* [[Stepper 1 (GCA 6300)]]
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*[[DUV Flood Expose]]
  +
−
* [[Stepper 2 (AutoStep 200)]]
  
  +
=====Direct-Write Lithography=====
−
* [[Stepper 3 (ASML)]]
  
  +
−
* [[E-Beam Lithography System (JEOL JBX-6300FS)]]
  
  +
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
−
* [[AFM-based Nanolithography Tool (NanoMan)]]
  
  +
*[[SEM 1 (JEOL IT800SHL)|E-Beam Lithography (Nabity v9)]]
−
* [[Nano-Imprint Tool (Nanonex NX2000)]]
  
−
* [[Contact Aligner (SUSS MA-6)]]
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*[[Focused Ion-Beam Lithography (Raith Velion)]]
−
* [[Wafer Bonder (SUSS SB6-8E)]]
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*[[Maskless Aligner (Heidelberg MLA150)]]
  +
  +
=====Other Patterning Systems=====
  +
  +
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
  +
| width="400" |
  +
=====Steppers (Optical Exposure)=====
  +
  +
*[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]]
  +
*[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]
  +
*[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]]
  +
  +
=====Thermal Processing for Photolithography=====
  +
  +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]]
  +
*[[Ovens 1, 2 & 3 (Labline)]]
  +
*[[Oven 4 (Fisher)]]
  +
*[[Oven 5 (Labline)]]
  +
*[[High Temp Oven (Blue M)]]
  +
  +
=====Lithography Support=====
  +
  +
*The [https://wiki.nanotech.ucsb.edu/w/index.php?title=Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
  +
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
  +
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
 
|-
  
|-
 
|}
  
|}
   
 
=Vacuum Deposition=
  
=Vacuum Deposition=
  +
 
{|
  
{|
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|-valign="top"
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|- valign="top"
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|width=300|
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| width="300" |
  +
====Physical Vapor Deposition (PVD)====
−
* [[E-Beam 1 (Sharon)]]
  
  +
−
* [[E-Beam 2 (Custom)]]
  
  +
=====Thermal Evaporation=====
−
* [[E-Beam 3 (Temescal)]]
  
  +
−
* [[E-Beam 4 (CHA)]]
  
−
* [[Sputter 1 (Custom)]]
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*[[E-Beam 1 (Sharon)]]
−
* [[Sputter 2 (SFI Endeavor)]]
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*[[E-Beam 2 (Custom)]]
−
* [[Sputter 3 (AJA)]]
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*[[E-Beam 3 (Temescal)]]
−
* [[Sputter 4 (AJA)]]
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*[[E-Beam 4 (CHA)]]
−
* [[Sputter 5 (Lesker AXXIS)]]
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*[[E-Beam 5 (Plasys)]]
  +
*[[Thermal Evap 1]]
−
|width=400|
  
−
* [[PECVD 1 (PlasmaTherm 790)]]
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*[[Thermal Evap 2 (Solder)]]
  +
−
* [[PECVD 2 (Advanced Vacuum)]]
  
  +
=====Sputter Deposition=====
−
* [[Thermal Evap 1]]
  
  +
−
* [[Thermal Evap 2]]
  
−
* [[Unaxis VLR ICP-PECVD]]
 +
*[[Sputter 3 (AJA ATC 2000-F)]]
−
* [[Ion Beam Deposition (Veeco NEXUS)]]
 +
*[[Sputter 4 (AJA ATC 2200-V)]]
  +
*[[Sputter 5 (AJA ATC 2200-V)]]
−
* [[Molecular Vapor Deposition]]
  
−
* [[Atomic Layer Deposision (Oxford FlexAL)]]
 +
*[[Ion Beam Deposition (Veeco NEXUS)]]
  +
*[[SEM Sample Coater (Hummer)]]
−
|-
  
  +
  +
| width="400" |
  +
=====Chemical Vapor Deposition (CVD)=====
  +
  +
*[[PECVD 1 (PlasmaTherm 790)]]
  +
*[[PECVD 2 (Advanced Vacuum)]]
  +
*[[ICP-PECVD (Unaxis VLR)]]
  +
*[[Molecular Vapor Deposition]]
  +
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]
  +
 
|}
  
|}
   
 
=Dry Etch=
  
=Dry Etch=
  +
 
{|
  
{|
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|-valign="top"
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|- valign="top"
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|width=300|
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| width="300" |
  +
=====Reactive Ion Etching (RIE)=====
−
* [[RIE 1 (Custom)]]
  
  +
−
* [[RIE 2 (MRC)]]
  
−
* [[RIE 3 (MRC)]]
 +
*[[RIE 2 (MRC)]]
−
* [[RIE 5 (PlasmaTherm SLR)]]
 +
*[[RIE 3 (MRC)]]
−
* [[Si Deep RIE (Bosch Etch)]]
 +
*[[RIE 5 (PlasmaTherm)]]
  +
−
* [[Ashers (Technics PEII]]
  
  +
=====Plasma Etching and Cleaning=====
−
* [[Unaxis VLR ICP-Etch]]
  
  +
−
|width=400|
  
−
* [[ICP Etch 1 (Panasonic E620)]]
 +
*[[Plasma Clean (YES EcoClean)]]
−
* [[ICP Etch 2 (Panasonic E626)]]
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*[[Plasma Activation (EVG 810)]]
−
* [[UV Ozone Reactor]]
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*[[Ashers (Technics PEII)]]
  +
−
* [[Plasma Clean (Gasonics 2000)]]
  
  +
=====Etch Monitoring=====
−
* [[XeF2 Etch (Xetch)]]
  
  +
−
* [[Plasma Activation Tool (EVG 810)]]
  
  +
*[[Laser Etch Monitoring]] (Endpoint Detection)
−
* [[HF Vapor Etch]]
  
  +
*Optical Emission Spectra
−
|-
  
  +
*Residual Gas Analyzer (RGA)
  +
| width="400" |
  +
=====ICP-RIE=====
  +
  +
*[[ICP Etch 1 (Panasonic E646V)]]
  +
*[[ICP Etch 2 (Panasonic E626I)]]
  +
*[[ICP-Etch (Unaxis VLR)]]
  +
*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]]
  +
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
  +
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
  +
  +
=====Ion Milling and Reactive Ion Beam Etching=====
  +
  +
*[[CAIBE (Oxford Ion Mill)]]
  +
*[[Focused Ion-Beam Lithography (Raith Velion)]]
  +
  +
=====Other Dry Etching=====
  +
  +
*[[UV Ozone Reactor]]
  +
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
  +
*[[Vapor HF Etch]]
  +
 
|}
  
|}
   
 
=Wet Processing=
  
=Wet Processing=
  +
See the [[Chemical List|Chemical List page]] for stocked chemicals such as Developers, Etchants, Solvents etc.
 
{|
  
{|
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|-valign="top"
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|- valign="top"
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|width=300|
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| width="300" |
−
* [[Gold Plating Bench]]
 +
*[[Wet Benches]]
−
* [[Critical Point Dryer]]
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**[[Solvent Cleaning Benches]]
−
* [[Spin Rinse Dryer (SemiTool)]]
 +
**[[Spin Coat Benches]]
−
* [[Scales]]
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**[[Develop Benches]]
−
** [[Wet Etch Wafer Scale]]
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**[[Toxic Corrosive Benches]]
  +
**[[Wet Benches#Wafer Toxic Corrosive Benches|Wafer Toxic Corrosive Bench]]
−
** [[Solvent Processing Wafer Scale]]
  
  +
**[[HF/TMAH Processing Benches]]
−
|width=400|
  
  +
**[[Plating Bench]]
−
* [[Chemical-Mechanical Polisher (Logitech)]]
  
  +
| width="400" |
−
* [[Wet Benches]]
  
−
**[[Photoresist Spin Benches]]
 +
*[[Gold Plating Bench]]
  +
*[[Critical Point Dryer]]
−
**[[Lithography Development & Solvent Clean Benches]]
  
−
**[[Wet Etch Benches]]
 +
*[[Spin Rinse Dryer (SemiTool)]]
  +
*[[Chemical-Mechanical Polisher (Logitech)]]
  +
*[[Mechanical Polisher (Allied)]]
  +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
  +
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
 
|-
  
|-
 
|}
  
|}
   
 
=Thermal Processing=
  
=Thermal Processing=
  +
{|
−
* [[Rapid Thermal Processor (AET RX6)]]
  
  +
|- valign="top"
−
* [[Strip Annealer]]
  
  +
| width="400" |
−
* [[Tube Furnace (Tystar 8300)]]
  
  +
*[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
−
* [[Tube Furnace Wafer Bonding (Thermco)]]
  
  +
*[[Rapid Thermal Processor (SSI Solaris 150)]]
−
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
  
  +
*[[Tube Furnace (Tystar 8300)]]
  +
*[[Tube Furnace Wafer Bonding (Thermco)]]
  +
*[[Tube Furnace AlGaAs Oxidation (Lindberg)]]
  +
*[[Wafer Bonder (SUSS SB6-8E)]]
  +
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
  +
| width="400" |
  +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]]
  +
**[[Ovens 1, 2 & 3 (Labline)]]
  +
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
  +
**[[Oven 5 (Labline)]]
  +
**[[High Temp Oven (Blue M)]]
  +
|-
  +
|}
   
 
=Packaging=
  
=Packaging=
  +
''Back-end Fabrication Tools''
−
* [[Flip-Chip Bonder (Finetech)]]
  
  +
{|
−
* [[Vacuum Sealer]]
  
  +
|
−
* [[Dicing Saw (ADT)]]
  
  +
====Die Singulation / Down-sizing====
−
* [[Wire Saw (Takatori)]]
  
   
  +
*[[Dicing Saw (ADT)]]
−
=Inspection, Test and Characterization=
  
  +
*[[Wafer Cleaver (PELCO Flip-Scribe)|Manual Wafer Cleaver (PELCO Flipscribe)]]
  +
*[[Automated Wafer Cleaver (Loomis LSD-155LT)]]
  +
  +
====Other Packaging====
  +
  +
*[[Vacuum Sealer]]
  +
|
  +
====Wafer/Die Bonding====
  +
  +
*[[Flip-Chip Bonder (Finetech)]]
  +
  +
*[[Wafer Bonder (SUSS SB6-8E)]]
  +
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
  +
|}
  +
  +
=Measurement & Characterization=
  +
''[https://en.wikipedia.org/wiki/Metrology Metrology], Electrical/Optical Testing and Thin-Film/Materials [https://en.wikipedia.org/wiki/Characterization_(materials_science) Characterization] tools''
 
{|
  
{|
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|-valign="top"
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|- valign="top"
−
|width=300|
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| width="300" |
  +
=====Optical Microscopy=====
−
* [[Field Emission SEM 1 (FEI Sirion)]]
  
  +
−
* [[Field Emission SEM 2 (JEOL 7600F]]
  
  +
*[[Microscopes|Optical Microscopes]] - ''General Use''
−
* [[Step Profile (Dektak IIA)]]
  
−
* [[Step Profilometer (Dektak 6M)]]
 +
*[[Fluorescence Microscope (Olympus MX51)]]
  +
*[[Deep UV Optical Microscope (Olympus)]]
−
* [[Ellipsometer (Rudolph)]]
  
  +
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
−
* [[Microscopes]]
  
  +
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
−
* [[Probe Station & Curve Tracer]]
  
  +
*[[Suss Aligners (SUSS MJB-3)#Backside Alignment|Near-IR Inspection Scope (MJB-IR)]]
−
* [[Optical Film Thickness (Filmetrics)]]
  
  +
−
* [[Scanning Probe Microscope (Veeco NanoMan)]]
  
  +
=====Electron Microscopy=====
−
* [[Tencor Flexus Film Stress]]
  
  +
−
|width=400|
  
−
* [[Optical Film Thickness (Nanometric)]]
 +
*[[SEM 1 (JEOL IT800SHL)]]
  +
*[[Field Emission SEM 2 (JEOL IT800SHL)|SEM 2 (JEOL IT800SHL) w/ EDAX]]
−
* [[SEM Sample Coater (Hummer)]]
  
  +
*[[SEM Sample Coater (Hummer)]]
−
* [[Surface Analysis (KLA/Tencor Surfscan)]]
  
  +
−
* [[Photo-emission & IR Microscope (QFI)]]
  
  +
=====Topographical Metrology=====
−
* [[Ellipsometer (Woollam)]]
  
  +
−
* [[Goniometer]]
  
  +
*[[Step Profilometer (KLA Tencor P-7)]]
−
* [[4-Point Probe Resistivity Mapper]]
  
  +
*[[Step Profilometer (DektakXT)]]
−
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  
−
* [[Deep UV Optical Microscope (Olympus)]]
 +
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
  +
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  +
| width="400" |
  +
  +
=====Thin-Film/Material Analysis=====
  +
  +
======Thickness + Optical Constants======
  +
  +
*[[Ellipsometer (Woollam)]]
  +
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
  +
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
  +
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
  +
  +
======Electrical Analysis======
  +
  +
*[[Resistivity Mapper (CDE RESMAP)]]
  +
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]]
  +
*[[IR Thermal Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
  +
  +
======Other Properties======
  +
  +
*[[Film Stress (Tencor Flexus)]]
  +
*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]]
  +
*[[Photoluminescence PL Setup (Custom)]]
 
|-
  
|-
 
|}
  
|}

Latest revision as of 11:52, 1 March 2024

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)

Thermal Evaporation
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Back-end Fabrication Tools

Die Singulation / Down-sizing

Other Packaging

Wafer/Die Bonding

Measurement & Characterization

Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Electrical Analysis
Other Properties
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Tool_List&oldid=161891"