Difference between revisions of "Tool List"
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* [[Goniometer]] |
* [[Goniometer]] |
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|width=400| |
|width=400| |
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− | * [[ |
+ | * [[Film Stress (Tencor Flexus)]] |
* [[SEM Sample Coater (Hummer)]] |
* [[SEM Sample Coater (Hummer)]] |
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* [[Surface Analysis (KLA/Tencor Surfscan)]] |
* [[Surface Analysis (KLA/Tencor Surfscan)]] |
Revision as of 09:31, 11 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
- Flip-Chip Bonder (Finetech)
- Vacuum Sealer
- Dicing Saw (ADT)
- Wire Saw (Takatori)
- Wafer Bonder (SUSS SB6-8E)