Difference between revisions of "Tool List"

From UCSB Nanofab Wiki
Jump to: navigation, search
(Lithography)
(Packaging)
Line 102: Line 102:
 
* [[Dicing Saw (ADT)]]
 
* [[Dicing Saw (ADT)]]
 
* [[Wire Saw (Takatori)]]
 
* [[Wire Saw (Takatori)]]
  +
* [[Wafer Bonder (SUSS SB6-8E)]]
   
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=

Revision as of 06:01, 11 July 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization