Difference between revisions of "Tool List"

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= Vacuum Deposition =
+
=Vacuum Deposition=
 
 
{|
 
{|
|- valign="top"
+
|-valign="top"
| width="300" |
+
|width=300|
*[[E-Beam 1 (Sharon)]]
+
* [[E-Beam 1 (Sharon)]]
*[[E-Beam 2 (Custom)]]
+
* [[E-Beam 2 (Custom)]]
*[[E-Beam 3 (Temescal)]]
+
* [[E-Beam 3 (Temescal)]]
*[[E-Beam 4 (CHA)]]
+
* [[E-Beam 4 (CHA)]]
*[[Sputter 1 (Custom)]]
+
* [[Sputter 1 (Custom)]]
*[[Sputter 2 (SFI Endeavor)]]
+
* [[Sputter 2 (SFI Endeavor)]]
*[[Sputter 3 (ATC 2000-F)]]
+
* [[Sputter 3 (AJA)]]
*[[Sputter 4 (ATC 2200-V)]]
+
* [[Sputter 4 (AJA)]]
*[[Sputter 5 (Lesker AXXIS)]]
+
* [[Sputter 5 (Lesker AXXIS)]]
  +
|width=400|
 
  +
* [[PECVD 1 (PlasmaTherm 790)]]
| width="400" |
 
*[[PECVD 1 (PlasmaTherm 790)]]
+
* [[PECVD 2 (Advanced Vacuum)]]
  +
* [[Thermal Evap 1]]
*[[PECVD 2 (Advanced Vacuum)]]
 
*[[Thermal Evap 1]]
+
* [[Thermal Evap 2]]
*[[Thermal Evap 2]]
+
* [[Unaxis VLR ICP-PECVD]]
  +
* [[Ion Beam Deposition (Veeco NEXUS)]]
*[[Unaxis VLR ICP-PECVD]]
 
*[[Ion Beam Deposition (Veeco NEXUS)]]
+
* [[Molecular Vapor Deposition]]
  +
* [[Atomic Layer Deposision (Oxford FlexAL)]]
*[[Molecular Vapor Deposition]]
 
  +
|-
*[[Atomic Layer Deposision (Oxford FlexAL)]]
 
 
 
|}
 
|}
   
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| width="400" |
 
| width="400" |
*[[ICP Etch 1 (Panasonic E626I)]]
+
*[[ICP Etch 1 (Panasonic E620)]]
*[[ICP Etch 2 (Panasonic E640)]]
+
*[[ICP Etch 2 (Panasonic E626)]]
 
*[[UV Ozone Reactor]]
 
*[[UV Ozone Reactor]]
 
*[[Plasma Clean (Gasonics 2000)]]
 
*[[Plasma Clean (Gasonics 2000)]]
Line 121: Line 119:
 
* [[Optical Film Thickness (Nanometric)]]
 
* [[Optical Film Thickness (Nanometric)]]
 
* [[Scanning Probe Microscope (Veeco NanoMan)]]
 
* [[Scanning Probe Microscope (Veeco NanoMan)]]
* [[ Surfscan 6200]]
 
 
|width=400|
 
|width=400|
 
* [[Tencor Flexus Film Stress]]
 
* [[Tencor Flexus Film Stress]]

Revision as of 14:31, 9 July 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization