Difference between revisions of "Tool List"

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(Dry Etch)
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=Vacuum Deposition=
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= Vacuum Deposition =
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{|
 
{|
|-valign="top"
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|- valign="top"
|width=300|
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| width="300" |
* [[E-Beam 1 (Sharon)]]
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*[[E-Beam 1 (Sharon)]]
* [[E-Beam 2 (Custom)]]
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*[[E-Beam 2 (Custom)]]
* [[E-Beam 3 (Temescal)]]
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*[[E-Beam 3 (Temescal)]]
* [[E-Beam 4 (CHA)]]
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*[[E-Beam 4 (CHA)]]
* [[Sputter 1 (Custom)]]
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*[[Sputter 1 (Custom)]]
* [[Sputter 2 (SFI Endeavor)]]
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*[[Sputter 2 (SFI Endeavor)]]
* [[Sputter 3 (AJA 2000-F)]]
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*[[Sputter 3 (ATC 2000-F)]]
* [[Sputter 4 (AJA 2200-V)]]
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*[[Sputter 4 (ATC 2200-V)]]
* [[Sputter 5 (Lesker AXXIS)]]
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*[[Sputter 5 (Lesker AXXIS)]]
  +
|width=400|
 
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| width="400" |
* [[PECVD 1 (PlasmaTherm 790)]]
 
* [[PECVD 2 (Advanced Vacuum)]]
+
*[[PECVD 1 (PlasmaTherm 790)]]
  +
*[[PECVD 2 (Advanced Vacuum)]]
* [[Thermal Evap 1]]
 
* [[Thermal Evap 2]]
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*[[Thermal Evap 1]]
* [[Unaxis VLR ICP-PECVD]]
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*[[Thermal Evap 2]]
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*[[Unaxis VLR ICP-PECVD]]
* [[Ion Beam Deposition (Veeco NEXUS)]]
 
* [[Molecular Vapor Deposition]]
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*[[Ion Beam Deposition (Veeco NEXUS)]]
  +
*[[Molecular Vapor Deposition]]
* [[Atomic Layer Deposision (Oxford FlexAL)]]
 
  +
*[[Atomic Layer Deposision (Oxford FlexAL)]]
|-
 
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Revision as of 12:14, 9 July 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization