Difference between revisions of "Tool List"
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− | =Dry Etch= |
+ | = Dry Etch = |
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− | |-valign="top" |
+ | |- valign="top" |
− | |width=300| |
+ | | width="300" | |
− | * |
+ | *[[RIE 1 (Custom)]] |
− | * |
+ | *[[RIE 2 (MRC)]] |
− | * |
+ | *[[RIE 3 (MRC)]] |
− | * |
+ | *[[RIE 5 (PlasmaTherm SLR)]] |
− | * |
+ | *[[Si Deep RIE (Bosch Etch)]] |
− | * |
+ | *[[Ashers (Technics PEII]] |
− | * |
+ | *[[Unaxis VLR ICP-Etch]] |
+ | |||
− | |width=400| |
+ | | width="400" | |
⚫ | |||
− | * |
+ | *[[ICP Etch 1 (Panasonic E620)]] |
⚫ | |||
− | * |
+ | *[[UV Ozone Reactor]] |
− | * [[Plasma Clean (Gasonics 2000)]] |
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− | * |
+ | *[[Plasma Clean (Gasonics 2000)]] |
+ | *[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
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− | * |
+ | *[[Plasma Activation Tool (EVG 810)]] |
− | * |
+ | *[[HF Vapor Etch]] |
− | |- |
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+ | |||
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Revision as of 20:43, 30 June 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)