Difference between revisions of "Tool List"
Jump to navigation
Jump to search
| Line 68: | Line 68: | ||
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
||
*[[Plasma Activation (EVG 810)]] |
*[[Plasma Activation (EVG 810)]] |
||
| − | *[[ |
+ | *[[Vapor HF Etch]] |
|} |
|} |
||
Revision as of 16:24, 31 January 2014
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
- Wafer Bonder (SUSS SB6-8E)