Difference between revisions of "Tool List"

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(Packaging)
(Inspection, Test and Characterization)
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=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=
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{|
* [[Field Emission SEM 1]]
 
  +
|-valign="top"
* [[Field Emission SEM 2]]
 
  +
|width=300|
* [[Step Profile]]
 
  +
* [[Field Emission SEM 1 (FEI Sirion)]]
* [[Step Profilometer]]
 
  +
* [[Field Emission SEM 2 (JEOL 7600F]]
* [[Ellipsometer]]
 
  +
* [[Step Profile (Dektak IIA)]]
  +
* [[Step Profilometer (Dektak 6M)]]
  +
* [[Ellipsometer (Rudolph)]]
 
* [[Microscopes]]
 
* [[Microscopes]]
 
* [[Probe Station & Curve Tracer]]
 
* [[Probe Station & Curve Tracer]]
 
* [[Optical Film Thickness (Filmetrics)]]
 
* [[Optical Film Thickness (Filmetrics)]]
* [[Scanning Probe Microscope]]
+
* [[Scanning Probe Microscope (Veeco NanoMan)]]
 
* [[Tencor Flexus Film Stress]]
 
* [[Tencor Flexus Film Stress]]
  +
|width=400|
 
* [[Optical Film Thickness (Nanometric)]]
 
* [[Optical Film Thickness (Nanometric)]]
* [[SEM Sample Coater]]
+
* [[SEM Sample Coater (Hummer)]]
* [[Surface Analysis]]
+
* [[Surface Analysis (KLA/Tencor Surfscan)]]
* [[Photo-emission & IR Microscope]]
+
* [[Photo-emission & IR Microscope (QFI)]]
 
* [[Ellipsometer (Woollam)]]
 
* [[Ellipsometer (Woollam)]]
 
* [[Goniometer]]
 
* [[Goniometer]]
 
* [[4-Point Probe Resistivity Mapper]]
 
* [[4-Point Probe Resistivity Mapper]]
  +
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  +
* [[Deep UV Optical Microscope (Olympus)]]
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|-
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|}

Revision as of 12:00, 28 June 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization