Difference between revisions of "Tool List"
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| − | |width= |
+ | |width=300| |
| − | * [[RIE 1]] |
+ | * [[RIE 1 (Custom)]] |
| − | * [[RIE 2]] |
+ | * [[RIE 2 (MRC)]] |
| − | * [[RIE 3]] |
+ | * [[RIE 3 (MRC)]] |
| − | * [[RIE 5]] |
+ | * [[RIE 5 (PlasmaTherm SLR)]] |
| − | * [[Si Deep RIE]] |
+ | * [[Si Deep RIE (Bosch Etch)]] |
| − | * [[Ashers]] |
+ | * [[Ashers (Technics PEII]] |
* [[Unaxis VLR ICP-Etch]] |
* [[Unaxis VLR ICP-Etch]] |
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| − | |width= |
+ | |width=400| |
| − | * [[ICP Etch 1]] |
+ | * [[ICP Etch 1 (Panasonic E620)]] |
| − | * [[ICP Etch 2]] |
+ | * [[ICP Etch 2 (Panasonic E626)]] |
* [[UV Ozone Reactor]] |
* [[UV Ozone Reactor]] |
||
| − | * [[Plasma Clean]] |
+ | * [[Plasma Clean (Gasonics 2000)]] |
| − | * [[XeF2 Etch]] |
+ | * [[XeF2 Etch (Xetch)]] |
| − | * [[Plasma Activation Tool]] |
+ | * [[Plasma Activation Tool (EVG 810)]] |
| + | * [[HF Vapor Etch]] |
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|- |
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Revision as of 12:50, 28 June 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
Inspection, Test and Characterization
- Field Emission SEM 1
- Field Emission SEM 2
- Step Profile
- Step Profilometer
- Ellipsometer
- Microscopes
- Probe Station & Curve Tracer
- Optical Film Thickness (Filmetrics)
- Scanning Probe Microscope
- Tencor Flexus Film Stress
- Optical Film Thickness (Nanometric)
- SEM Sample Coater
- Surface Analysis
- Photo-emission & IR Microscope
- Ellipsometer (Woollam)
- Goniometer
- 4-Point Probe Resistivity Mapper