Difference between revisions of "Tool List"

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(Lithography)
(Vacuum Deposition)
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{|
 
{|
 
|-valign="top"
 
|-valign="top"
|width=200|
+
|width=300|
 
* [[E-Beam 1 (Sharon)]]
 
* [[E-Beam 1 (Sharon)]]
 
* [[E-Beam 2 (Custom)]]
 
* [[E-Beam 2 (Custom)]]
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* [[Sputter 1 (Custom)]]
 
* [[Sputter 1 (Custom)]]
 
* [[Sputter 2 (SFI Endeavor)]]
 
* [[Sputter 2 (SFI Endeavor)]]
* [[Sputter 3]]
+
* [[Sputter 3 (AJA)]]
* [[Sputter 4]]
+
* [[Sputter 4 (AJA)]]
|width=200|
 
 
* [[Sputter 5 (Lesker AXXIS)]]
 
* [[Sputter 5 (Lesker AXXIS)]]
  +
|width=400|
* [[PECVD 1]]
 
  +
* [[PECVD 1 (PlasmTherm 790)]]
 
* [[PECVD 2 (Advanced Vacuum)]]
 
* [[PECVD 2 (Advanced Vacuum)]]
  +
* [[Thermal Evap 1]]
  +
* [[Thermal Evap 2]]
 
* [[Unaxis VLR ICP-PECVD]]
 
* [[Unaxis VLR ICP-PECVD]]
  +
* [[Ion Beam Deposition (Veeco NEXUS)]]
* [[IBD]]
 
 
* [[Molecular Vapor Deposition]]
 
* [[Molecular Vapor Deposition]]
 
* [[Atomic Layer Deposision (Oxford Flexal)]]
 
* [[Atomic Layer Deposision (Oxford Flexal)]]

Revision as of 11:47, 28 June 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization