Difference between revisions of "Tool List"
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* [[E-Beam 3]] |
* [[E-Beam 3]] |
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* [[E-Beam 4]] |
* [[E-Beam 4]] |
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| − | * [[Sputter 1]] |
+ | * [[Sputter 1 (Custom)]] |
| − | * [[Sputter 2]] |
+ | * [[Sputter 2 (SFI Endeavor)]] |
* [[Sputter 3]] |
* [[Sputter 3]] |
||
* [[Sputter 4]] |
* [[Sputter 4]] |
||
|width=200| |
|width=200| |
||
| − | * [[Sputter 5]] |
+ | * [[Sputter 5 (Lesker AXXIS)]] |
* [[PECVD 1]] |
* [[PECVD 1]] |
||
| − | * [[PECVD 2]] |
+ | * [[PECVD 2 (Advanced Vacuum)]] |
* [[Unaxis VLR ICP-PECVD]] |
* [[Unaxis VLR ICP-PECVD]] |
||
* [[IBD]] |
* [[IBD]] |
||
* [[Molecular Vapor Deposition]] |
* [[Molecular Vapor Deposition]] |
||
| − | * [[Atomic Layer Deposision]] |
+ | * [[Atomic Layer Deposision (Oxford Flexal)]] |
|- |
|- |
||
|} |
|} |
||
| + | |||
=Dry Etch= |
=Dry Etch= |
||
{| |
{| |
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Revision as of 11:30, 28 June 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
Inspection, Test and Characterization
- Field Emission SEM 1
- Field Emission SEM 2
- Step Profile
- Step Profilometer
- Ellipsometer
- Microscopes
- Probe Station & Curve Tracer
- Optical Film Thickness (Filmetrics)
- Scanning Probe Microscope
- Tencor Flexus Film Stress
- Optical Film Thickness (Nanometric)
- SEM Sample Coater
- Surface Analysis
- Photo-emission & IR Microscope
- Ellipsometer (Woollam)
- Goniometer
- 4-Point Probe Resistivity Mapper