Difference between revisions of "Tool List"
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m (→Lithography Support: link to POLOS section) |
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*[[RIE 3 (MRC)]] |
*[[RIE 3 (MRC)]] |
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*[[RIE 5 (PlasmaTherm)]] |
*[[RIE 5 (PlasmaTherm)]] |
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| − | *[[Ashers (Technics PEII)]] |
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| + | =====Plasma Etching and Cleaning===== |
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| + | |||
*[[Plasma Clean (Gasonics 2000)]] |
*[[Plasma Clean (Gasonics 2000)]] |
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*[[Plasma Clean (YES EcoClean)]] |
*[[Plasma Clean (YES EcoClean)]] |
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*[[Plasma Activation (EVG 810)]] |
*[[Plasma Activation (EVG 810)]] |
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| − | *[[ |
+ | *[[Ashers (Technics PEII)]] |
=====Etch Monitoring===== |
=====Etch Monitoring===== |
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*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]] |
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]] |
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*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]] |
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]] |
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| + | |||
| + | =====Ion Milling and Reactive Ion Beam Etching===== |
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| + | |||
| + | *[[CAIBE (Oxford Ion Mill)]] |
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=====Other Dry Etching===== |
=====Other Dry Etching===== |
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*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
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*[[Vapor HF Etch]] |
*[[Vapor HF Etch]] |
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Revision as of 12:09, 20 February 2020
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
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Vacuum Deposition
Physical Vapor Deposition (PVD)
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and Cleaning
Etch Monitoring
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ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching
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Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.