Difference between revisions of "Tool List"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(30 intermediate revisions by 4 users not shown)
Line 1: Line 1:
 
__NOTOC__
  
__NOTOC__
 
=Lithography=
  
=Lithography=
  +
−
You can see our available photoresists on the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemical_Datasheets Chemical Datasheets page].
  
 
{|
  
{|
 
|- valign="top"
  
|- valign="top"
 
| width="300" |
  
| width="300" |
  +
=====Photoresists and Lithography Chemicals=====
−
===== Contact Aligners (Optical Exposure) =====
  
−
* [[Suss Aligners (SUSS MJB-3)]]
  
−
* [[IR Aligner (SUSS MJB-3 IR)]]
  
−
* [[Contact Aligner (SUSS MA-6)]]
  
−
* [[DUV Flood Expose]]
  
   
  +
*See the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
−
===== Other Patterning Systems =====
  
−
* [[E-Beam Lithography System (JEOL JBX-6300FS)]]
 +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
  +
−
* [[Nano-Imprint (Nanonex NX2000)]]
  
  +
=====Contact Aligners (Optical Exposure)=====
−
* [[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
  
  +
  +
*[[Suss Aligners (SUSS MJB-3)]]
  +
*[[IR Aligner (SUSS MJB-3 IR)]]
  +
*[[Contact Aligner (SUSS MA-6)]]
  +
*[[DUV Flood Expose]]
  +
  +
=====Other Patterning Systems=====
  +
  +
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
  +
*[[Nano-Imprint (Nanonex NX2000)]]
  +
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
 
| width="400" |
  
| width="400" |
−
===== Steppers (Optical Exposure) =====
 +
=====Steppers (Optical Exposure)=====
  +
−
* [[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]]
  
−
* [[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]
 +
*[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]]
−
* [[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]]
 +
*[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]
  +
*[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]]
  +
  +
=====Thermal Processing for Photolithography=====
  +
  +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]]
  +
*[[Ovens 1, 2 & 3 (Labline)]]
  +
*[[Oven 4 (Fisher)]]
  +
*[[Oven 5 (Labline)]]
  +
*[[High Temp Oven (Blue M)]]
  +
*[[Vacuum Oven (YES)]]
  +
  +
=====Lithography Support=====
   
  +
*The [https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
−
===== Thermal Processing for Photolithography =====
  
  +
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
−
* [[Ovens 1, 2 & 3 (Labline)]]
  
  +
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
−
* [[Oven 4 (Fisher)]]
  
−
* [[Oven 5 (Labline)]]
  
−
* [[High Temp Oven (Blue M)]]
  
−
* [[Vacuum Oven (YES)]]
  
−
* The [https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
  
 
|-
  
|-
 
|}
  
|}
   
−
= Vacuum Deposition =
 +
=Vacuum Deposition=
   
 
{|
  
{|
 
|- valign="top"
  
|- valign="top"
 
| width="300" |
  
| width="300" |
−
===== Physical Vapor Deposition (PVD) =====
 +
=====Physical Vapor Deposition (PVD)=====
−
*[[E-Beam 1 (Sharon)]]
 
−
*[[E-Beam 2 (Custom)]]
 
−
*[[E-Beam 3 (Temescal)]]
 
−
*[[E-Beam 4 (CHA)]]
 
−
*[[Thermal Evap 1]]
 
−
*[[Thermal Evap 2 (Solder)]]
 
   
  +
*[[E-Beam 1 (Sharon)]]
−
===== Sputter Deposition =====
  
−
*[[Sputter 3 (AJA ATC 2000-F)]]
+
*[[E-Beam 2 (Custom)]]
−
*[[Sputter 4 (AJA ATC 2200-V)]]
+
*[[E-Beam 3 (Temescal)]]
  +
*[[E-Beam 4 (CHA)]]
  +
*[[Thermal Evap 1]]
  +
*[[Thermal Evap 2 (Solder)]]
  +
  +
=====Sputter Deposition=====
  +
  +
*[[Sputter 3 (AJA ATC 2000-F)]]
  +
*[[Sputter 4 (AJA ATC 2200-V)]]
 
*[[Sputter 5 (AJA ATC 2200-V)]]
  
*[[Sputter 5 (AJA ATC 2200-V)]]
 
*[[Ion Beam Deposition (Veeco NEXUS)]]
  
*[[Ion Beam Deposition (Veeco NEXUS)]]
   
 
| width="400" |
  
| width="400" |
−
===== Chemical Vapor Deposition (CVD) =====
 +
=====Chemical Vapor Deposition (CVD)=====
  +
−
*[[PECVD 1 (PlasmaTherm 790)]]
 
−
*[[PECVD 2 (Advanced Vacuum)]]
+
*[[PECVD 1 (PlasmaTherm 790)]]
−
*[[ICP-PECVD (Unaxis VLR)]]
+
*[[PECVD 2 (Advanced Vacuum)]]
−
*[[Molecular Vapor Deposition]]
+
*[[ICP-PECVD (Unaxis VLR)]]
  +
*[[Molecular Vapor Deposition]]
 
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]
  
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]
   
 
|}
  
|}
   
−
= Dry Etch =
 +
=Dry Etch=
   
 
{|
  
{|
 
|- valign="top"
  
|- valign="top"
 
| width="300" |
  
| width="300" |
−
===== Reactive Ion Etching (RIE) =====
 +
=====Reactive Ion Etching (RIE)=====
  +
−
*[[RIE 2 (MRC)]]
 
−
*[[RIE 3 (MRC)]]
+
*[[RIE 2 (MRC)]]
−
*[[RIE 5 (PlasmaTherm)]]
+
*[[RIE 3 (MRC)]]
−
*[[Ashers (Technics PEII)]]
+
*[[RIE 5 (PlasmaTherm)]]
  +
−
*[[Plasma Clean (Gasonics 2000)]]
 
  +
=====Plasma Etching and Cleaning=====
−
*[[Plasma Activation (EVG 810)]]
 
  +
−
*[[CAIBE (Oxford Ion Mill)]]
 
  +
*[[Plasma Clean (Gasonics 2000)]]
  +
*[[Plasma Clean (YES EcoClean)]]
  +
*[[Plasma Activation (EVG 810)]]
  +
*[[Ashers (Technics PEII)]]
  +
  +
=====Etch Monitoring=====
  +
  +
*[[Laser Etch Monitoring]] (Endpoint Detection)
  +
*Optical Emission Spectra
  +
*Residual Gas Analyzer (RGA)
 
| width="400" |
  
| width="400" |
−
===== ICP-RIE =====
 +
=====ICP-RIE=====
  +
−
*[[ICP Etch 1 (Panasonic E626I)]]
 
−
*[[ICP Etch 2 (Panasonic E640)]]
+
*[[ICP Etch 1 (Panasonic E626I)]]
  +
*[[ICP Etch 2 (Panasonic E640)]]
 
*[[ICP-Etch (Unaxis VLR)]]
  
*[[ICP-Etch (Unaxis VLR)]]
−
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)|Plasma-Therm SLR: Si Deep RIE (PlasmaTherm/Bosch Etch)]]
 +
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
−
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
+
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
  +
  +
=====Ion Milling and Reactive Ion Beam Etching=====
  +
  +
*[[CAIBE (Oxford Ion Mill)]]
  +
  +
=====Other Dry Etching=====
   
  +
*[[UV Ozone Reactor]]
−
===== Other Dry Etching =====
  
  +
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
−
*[[UV Ozone Reactor]]
 
−
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
 
 
*[[Vapor HF Etch]]
  
*[[Vapor HF Etch]]
  +
   
 
|}
  
|}
Line 93: Line 128:
 
|- valign="top"
  
|- valign="top"
 
| width="300" |
  
| width="300" |
−
* [[Wet Benches]]
 +
*[[Wet Benches]]
 
**[[Solvent Cleaning Benches]]
  
**[[Solvent Cleaning Benches]]
 
**[[Spin Coat Benches]]
  
**[[Spin Coat Benches]]
Line 101: Line 136:
 
**[[Plating Bench]]
  
**[[Plating Bench]]
 
| width="400" |
  
| width="400" |
−
* [[Gold Plating Bench]]
 +
*[[Gold Plating Bench]]
−
* [[Critical Point Dryer]]
 +
*[[Critical Point Dryer]]
−
* [[Spin Rinse Dryer (SemiTool)]]
 +
*[[Spin Rinse Dryer (SemiTool)]]
−
* [[Chemical-Mechanical Polisher (Logitech)]]
 +
*[[Chemical-Mechanical Polisher (Logitech)]]
  +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
  +
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
 
|-
  
|-
 
|}
  
|}
Line 111: Line 148:
 
{|
  
{|
 
|- valign="top"
  
|- valign="top"
−
|- align="left"
 +
| width="400" |
  +
*[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
−
!
  
−
* [[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
 +
*[[Rapid Thermal Processor (SSI Solaris 150)]]
  +
*[[Tube Furnace (Tystar 8300)]]
−
* [[Strip Annealer]]
  
−
* [[Tube Furnace (Tystar 8300)]]
 +
*[[Tube Furnace Wafer Bonding (Thermco)]]
−
* [[Tube Furnace Wafer Bonding (Thermco)]]
 +
*[[Tube Furnace AlGaAs Oxidation (Lindberg)]]
  +
*[[Wafer Bonder (SUSS SB6-8E)]]
−
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
  
−
* [[Wafer Bonder (SUSS SB6-8E)]]
 +
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
  +
| width="400" |
−
!
  
−
* [[Ovens 1, 2 & 3 (Labline)]]
 +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]]
−
* [[Oven 4 (Fisher)]]
 +
**[[Ovens 1, 2 & 3 (Labline)]]
−
* [[Oven 5 (Labline)]]
 +
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
−
* [[High Temp Oven (Blue M)]]
 +
**[[Oven 5 (Labline)]]
−
* [[Vacuum Oven (YES)]]
 +
**[[Vacuum Oven (YES)]]
  +
**[[High Temp Oven (Blue M)]]
 
|-
  
|-
 
|}
  
|}
   
 
=Packaging=
  
=Packaging=
  +
−
* [[Dicing Saw (ADT)]]
  
−
* [[Flip-Chip Bonder (Finetech)]]
 +
*[[Dicing Saw (ADT)]]
  +
*[[Flip-Chip Bonder (Finetech)]]
−
* [[Vacuum Sealer]]
  
−
* [[Wire Saw (Takatori)]]
 +
*[[Vacuum Sealer]]
  +
*[[Wire Saw (Takatori)]]
   
 
=Inspection, Test and Characterization=
  
=Inspection, Test and Characterization=
Line 138: Line 177:
 
|- valign="top"
  
|- valign="top"
 
| width="300" |
  
| width="300" |
−
===== Optical/Electron Microscopy =====
 +
=====Optical/Electron Microscopy=====
−
* [[Field Emission SEM 1 (FEI Sirion)]]
  
−
* [[Field Emission SEM 2 (JEOL 7600F)]]
  
−
* [[SEM Sample Coater (Hummer)]]
  
−
* [[Microscopes|Optical Microscopes]]
  
−
* [[Fluorescence Microscope (Olympus MX51)]]
  
−
* [[Deep UV Optical Microscope (Olympus)]]
  
−
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  
−
* [[Photo-emission & IR Microscope (QFI)]]
  
   
  +
*[[Microscopes|Optical Microscopes]]
−
===== Topographical Metrology =====
  
−
* [[Step Profile (Dektak IIA)]]
 +
*[[Fluorescence Microscope (Olympus MX51)]]
  +
*[[Deep UV Optical Microscope (Olympus)]]
−
* [[Step Profilometer (Dektak 6M)]]
  
  +
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
−
* [[Atomic Force Microsope (Dimension 3100/Nanoscope IVA)]]
  
  +
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
−
* [[Surface Analysis (KLA/Tencor Surfscan)]]
  
  +
*[[Field Emission SEM 1 (FEI Sirion)]]
−
** ''Sub-micron Particle Counter''
  
−
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 +
*[[Field Emission SEM 2 (JEOL 7600F)]]
  +
*[[SEM Sample Coater (Hummer)]]
  +
  +
=====Topographical Metrology=====
  +
  +
*[[Step Profilometer (KLA Tencor P-7)]]
  +
*[[Step Profilometer (Dektak 6M)]]
  +
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
  +
*[[Surface Analysis (KLA/Tencor Surfscan)]]
  +
**''Sub-micron Particle Counter''
  +
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  +
*[[Optical Profilometer - White-Light/Phase-Shift Interference (Filmetrics Profilm3D)]]
 
| width="400" |
  
| width="400" |
−
===== Thin-Film Analysis/Measurement =====
 +
=====Thin-Film Analysis/Measurement=====
  +
−
* [[Ellipsometer (Woollam)]]
 
−
* [[Ellipsometer (Rudolph)]]
+
*[[Ellipsometer (Woollam)]]
−
* [[Film Stress (Tencor Flexus)]]
+
*[[Film Stress (Tencor Flexus)]]
−
* Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)
 +
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
−
* [[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
 +
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
−
* [[Optical Film Thickness (Nanometric)]]
 +
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
  +
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
−
* [[Resistivity Mapper (CDE RESMAP)]]
  
  +
*[[Optical Film Thickness (Nanometric)]]
  +
*[[Resistivity Mapper (CDE RESMAP)]]
  +
  +
=====Other Tools=====
   
  +
*[[Probe Station & Curve Tracer]]
−
===== Other Tools =====
  
  +
*[[Goniometer]]
−
* [[Probe Station & Curve Tracer]]
  
  +
*[[Photoluminescence PL Setup (Custom)]]
−
* [[Goniometer]]
  
 
|-
  
|-
 
|}
  
|}

Revision as of 12:09, 20 February 2020

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching


Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical/Electron Microscopy
Topographical Metrology
Thin-Film Analysis/Measurement
Other Tools
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Tool_List&oldid=157127"