Difference between revisions of "Tool List"

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(Wet Processing)
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__NOTOC__
 
__NOTOC__
 
=Lithography=
 
=Lithography=
  +
 
{|
 
{|
|-valign="top"
+
|- valign="top"
|width=300|
+
| width="300" |
  +
=====Photoresists and Lithography Chemicals=====
* [[Suss Aligners (SUSS MJB-3)]]
 
  +
* [[IR Aligner (SUSS MJB-3 IR)]]
 
  +
*See the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
* [[DUV Flood Expose]]
 
  +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
* [[Ovens 1, 2 & 3 (Labline)]]
 
  +
* [[Oven 4 (Fisher)]]
 
  +
=====Contact Aligners (Optical Exposure)=====
* [[Oven 5 (Blue M)]]
 
  +
* [[Vacuum Oven (YES)]]
 
* [[Holographic Lith/PL Setup]]
+
*[[Suss Aligners (SUSS MJB-3)]]
  +
*[[IR Aligner (SUSS MJB-3 IR)]]
|width=400|
 
* [[Stepper 1 (GCA 6300)]]
+
*[[Contact Aligner (SUSS MA-6)]]
* [[Stepper 2 (AutoStep 200)]]
+
*[[DUV Flood Expose]]
  +
* [[Stepper 3 (ASML)]]
 
  +
=====Other Patterning Systems=====
* [[E-Beam Lithography System (JEOL JBX-6300FS)]]
 
  +
* [[AFM-based Nanolithography Tool (NanoMan)]]
 
  +
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
* [[Nano-Imprint Tool (Nanonex NX2000)]]
 
* [[Contact Aligner (SUSS MA-6)]]
+
*[[Nano-Imprint (Nanonex NX2000)]]
  +
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
* [[Wafer Bonder (SUSS SB6-8E)]]
 
  +
| width="400" |
  +
=====Steppers (Optical Exposure)=====
  +
  +
*[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]]
  +
*[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]
  +
*[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]]
  +
  +
=====Thermal Processing for Photolithography=====
  +
  +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]]
  +
*[[Ovens 1, 2 & 3 (Labline)]]
  +
*[[Oven 4 (Fisher)]]
  +
*[[Oven 5 (Labline)]]
  +
*[[High Temp Oven (Blue M)]]
  +
*[[Vacuum Oven (YES)]]
  +
*The [https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
 
|-
 
|-
 
|}
 
|}
   
= Vacuum Deposition =
+
=Vacuum Deposition=
   
 
{|
 
{|
 
|- valign="top"
 
|- valign="top"
| width="300" |
+
| width="300" |
  +
=====Physical Vapor Deposition (PVD)=====
*[[E-Beam 1 (Sharon)]]
 
*[[E-Beam 2 (Custom)]]
 
*[[E-Beam 3 (Temescal)]]
 
*[[E-Beam 4 (CHA)]]
 
*[[Sputter 1 (Custom)]]
 
*[[Sputter 2 (SFI Endeavor)]]
 
*[[Sputter 3 (ATC 2000-F)]]
 
*[[Sputter 4 (ATC 2200-V)]]
 
*[[Sputter 5 (Lesker AXXIS)]]
 
   
  +
*[[E-Beam 1 (Sharon)]]
| width="400" |
 
*[[PECVD 1 (PlasmaTherm 790)]]
+
*[[E-Beam 2 (Custom)]]
*[[PECVD 2 (Advanced Vacuum)]]
+
*[[E-Beam 3 (Temescal)]]
*[[Thermal Evap 1]]
+
*[[E-Beam 4 (CHA)]]
*[[Thermal Evap 2]]
+
*[[Thermal Evap 1]]
*[[Unaxis VLR ICP-PECVD]]
+
*[[Thermal Evap 2 (Solder)]]
  +
*[[Ion Beam Deposition (Veeco NEXUS)]]
 
*[[Molecular Vapor Deposition]]
+
=====Sputter Deposition=====
  +
*[[Atomic Layer Deposision (Oxford FlexAL)]]
 
  +
*[[Sputter 3 (AJA ATC 2000-F)]]
  +
*[[Sputter 4 (AJA ATC 2200-V)]]
  +
*[[Sputter 5 (AJA ATC 2200-V)]]
  +
*[[Ion Beam Deposition (Veeco NEXUS)]]
  +
  +
| width="400" |
  +
=====Chemical Vapor Deposition (CVD)=====
  +
  +
*[[PECVD 1 (PlasmaTherm 790)]]
  +
*[[PECVD 2 (Advanced Vacuum)]]
  +
*[[ICP-PECVD (Unaxis VLR)]]
  +
*[[Molecular Vapor Deposition]]
  +
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]
   
 
|}
 
|}
   
= Dry Etch =
+
=Dry Etch=
   
 
{|
 
{|
 
|- valign="top"
 
|- valign="top"
| width="300" |
+
| width="300" |
  +
=====Reactive Ion Etching (RIE)=====
*[[RIE 1 (Custom)]]
 
*[[RIE 2 (MRC)]]
 
*[[RIE 3 (MRC)]]
 
*[[RIE 5 (PlasmaTherm SLR)]]
 
*[[Si Deep RIE (Bosch Etch)]]
 
*[[Ashers (Technics PEII)]]
 
*[[Unaxis VLR ICP-Etch]]
 
   
  +
*[[RIE 2 (MRC)]]
| width="400" |
 
*[[ICP Etch 1 (Panasonic E626I)]]
+
*[[RIE 3 (MRC)]]
*[[ICP Etch 2 (Panasonic E640)]]
+
*[[RIE 5 (PlasmaTherm)]]
*[[UV Ozone Reactor]]
+
*[[Ashers (Technics PEII)]]
*[[Plasma Clean (Gasonics 2000)]]
+
*[[Plasma Clean (Gasonics 2000)]]
  +
*[[Plasma Clean (YES EcoClean)]]
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
 
*[[Plasma Activation Tool (EVG 810)]]
+
*[[Plasma Activation (EVG 810)]]
*[[HF Vapor Etch]]
+
*[[CAIBE (Oxford Ion Mill)]]
  +
  +
=====Etch Monitoring=====
  +
  +
*[[Laser Etch Monitoring]] (Endpoint Detection)
  +
*Optical Emission Spectra
  +
*Residual Gas Analyzer (RGA)
  +
| width="400" |
  +
=====ICP-RIE=====
  +
  +
*[[ICP Etch 1 (Panasonic E626I)]]
  +
*[[ICP Etch 2 (Panasonic E640)]]
  +
*[[ICP-Etch (Unaxis VLR)]]
  +
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
  +
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
  +
  +
=====Other Dry Etching=====
  +
  +
*[[UV Ozone Reactor]]
  +
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
  +
*[[Vapor HF Etch]]
   
 
|}
 
|}
   
 
=Wet Processing=
 
=Wet Processing=
  +
See the [[Chemical List|Chemical List page]] for stocked chemicals such as Developers, Etchants, Solvents etc.
 
{|
 
{|
|-valign="top"
+
|- valign="top"
|width=300|
+
| width="300" |
* [[Gold Plating Bench]]
+
*[[Wet Benches]]
* [[Critical Point Dryer]]
+
**[[Solvent Cleaning Benches]]
* [[Spin Rinse Dryer (SemiTool)]]
+
**[[Spin Coat Benches]]
* [[Scales]]
+
**[[Develop Benches]]
** [[Wet Etch Wafer Scale]]
+
**[[Toxic Corrosive Benches]]
** [[Solvent Processing Wafer Scale]]
+
**[[HF/TMAH Processing Benches]]
  +
**[[Plating Bench]]
|width=400|
 
  +
| width="400" |
* [[Chemical-Mechanical Polisher (Logitech)]]
 
  +
*[[Gold Plating Bench]]
* Wet Benches
 
**[[Acid Benches]]
+
*[[Critical Point Dryer]]
  +
*[[Spin Rinse Dryer (SemiTool)]]
**[[Solvent Benches]]
 
  +
*[[Chemical-Mechanical Polisher (Logitech)]]
**[[Photoresist Spin Coat Benches]]
 
  +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
**[[Develop Wet Benches]]
 
 
|-
 
|-
 
|}
 
|}
   
 
=Thermal Processing=
 
=Thermal Processing=
  +
{|
* [[Rapid Thermal Processor (AET RX6)]]
 
  +
|- valign="top"
* [[Strip Annealer]]
 
  +
| width="400" |
* [[Tube Furnace (Tystar 8300)]]
 
  +
*[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
* [[Tube Furnace Wafer Bonding (Thermco)]]
 
  +
*[[Rapid Thermal Processor (SSI Solaris 150)]]
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
 
  +
*[[Tube Furnace (Tystar 8300)]]
  +
*[[Tube Furnace Wafer Bonding (Thermco)]]
  +
*[[Tube Furnace AlGaAs Oxidation (Lindberg)]]
  +
*[[Wafer Bonder (SUSS SB6-8E)]]
  +
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
  +
| width="400" |
  +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]]
  +
**[[Ovens 1, 2 & 3 (Labline)]]
  +
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
  +
**[[Oven 5 (Labline)]]
  +
**[[Vacuum Oven (YES)]]
  +
**[[High Temp Oven (Blue M)]]
  +
|-
  +
|}
   
 
=Packaging=
 
=Packaging=
  +
* [[Flip-Chip Bonder (Finetech)]]
 
* [[Vacuum Sealer]]
+
*[[Dicing Saw (ADT)]]
* [[Dicing Saw (ADT)]]
+
*[[Flip-Chip Bonder (Finetech)]]
* [[Wire Saw (Takatori)]]
+
*[[Vacuum Sealer]]
  +
*[[Wire Saw (Takatori)]]
   
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=
 
{|
 
{|
|-valign="top"
+
|- valign="top"
|width=300|
+
| width="300" |
  +
=====Optical/Electron Microscopy=====
* [[Field Emission SEM 1 (FEI Sirion)]]
 
  +
* [[Field Emission SEM 2 (JEOL 7600F)]]
 
  +
*[[Microscopes|Optical Microscopes]]
* [[Step Profile (Dektak IIA)]]
 
* [[Step Profilometer (Dektak 6M)]]
+
*[[Fluorescence Microscope (Olympus MX51)]]
  +
*[[Deep UV Optical Microscope (Olympus)]]
* [[Ellipsometer (Rudolph)]]
 
  +
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
* [[Microscopes]]
 
  +
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
* [[Probe Station & Curve Tracer]]
 
* [[Optical Film Thickness (Filmetrics)]]
+
*[[Field Emission SEM 1 (FEI Sirion)]]
* [[Optical Film Thickness (Nanometric)]]
+
*[[Field Emission SEM 2 (JEOL 7600F)]]
* [[Scanning Probe Microscope (Veeco NanoMan)]]
+
*[[SEM Sample Coater (Hummer)]]
  +
|width=400|
 
  +
=====Topographical Metrology=====
* [[Tencor Flexus Film Stress]]
 
  +
* [[SEM Sample Coater (Hummer)]]
 
* [[Surface Analysis (KLA/Tencor Surfscan)]]
+
*[[Step Profilometer (KLA Tencor P-7)]]
  +
*[[Step Profilometer (Dektak 6M)]]
* [[Photo-emission & IR Microscope (QFI)]]
 
  +
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
* [[Ellipsometer (Woollam)]]
 
  +
*[[Surface Analysis (KLA/Tencor Surfscan)]]
* [[Goniometer]]
 
  +
**''Sub-micron Particle Counter''
* [[4-Point Probe Resistivity Mapper]]
 
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
+
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  +
*[[Optical Profilometer - White-Light/Phase-Shift Interference (Filmetrics Profilm3D)]]
* [[Deep UV Optical Microscope (Olympus)]]
 
  +
| width="400" |
  +
=====Thin-Film Analysis/Measurement=====
  +
  +
*[[Ellipsometer (Woollam)]]
  +
*[[Film Stress (Tencor Flexus)]]
  +
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
  +
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
  +
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
  +
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
  +
*[[Optical Film Thickness (Nanometric)]]
  +
*[[Resistivity Mapper (CDE RESMAP)]]
  +
  +
=====Other Tools=====
  +
  +
*[[Probe Station & Curve Tracer]]
  +
*[[Goniometer]]
  +
*[[Photoluminescence PL Setup (Custom)]]
 
|-
 
|-
 
|}
 
|}

Revision as of 15:05, 8 October 2019

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Etch Monitoring
ICP-RIE
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical/Electron Microscopy
Topographical Metrology
Thin-Film Analysis/Measurement
Other Tools