Difference between revisions of "Tool List"

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(Lithography)
(added S-Cubed Flexi to Wet processing tools as well)
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__NOTOC__
 
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=Lithography=
 
=Lithography=
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{|
 
{|
|-valign="top"
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|- valign="top"
|width=300|
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| width="300" |
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=====Photoresists and Lithography Chemicals=====
* [[Suss Aligners (SUSS MJB-3)]]
 
  +
* [[IR Aligner (SUSS MJB-3 IR)]]
 
  +
*See the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
* [[DUV Flood Expose]]
 
  +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
* [[Ovens 1, 2 & 3 (Labline)]]
 
  +
* [[Oven 4 (Fisher)]]
 
  +
=====Contact Aligners (Optical Exposure)=====
* [[Oven 5 (Blue M)]]
 
  +
* [[Vacuum Oven (YES)]]
 
* [[Holographic Lith/PL Setup]]
+
*[[Suss Aligners (SUSS MJB-3)]]
  +
*[[IR Aligner (SUSS MJB-3 IR)]]
|width=400|
 
* [[Stepper 1 (GCA 6300)]]
+
*[[Contact Aligner (SUSS MA-6)]]
* [[Stepper 2 (AutoStep 200)]]
+
*[[DUV Flood Expose]]
  +
* [[Stepper 3 (ASML)]]
 
  +
=====Other Patterning Systems=====
* [[E-Beam Lithography System (JEOL JBX-6300FS)]]
 
  +
* [[AFM-based Nanolithography Tool (NanoMan)]]
 
  +
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
* [[Nano-Imprint Tool (Nanonex NX2000)]]
 
* [[Contact Aligner (SUSS MA-6)]]
+
*[[Nano-Imprint (Nanonex NX2000)]]
  +
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
* [[Wafer Bonder (SUSS SB6-8E)]]
 
  +
| width="400" |
  +
=====Steppers (Optical Exposure)=====
  +
  +
*[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]]
  +
*[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]
  +
*[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]]
  +
  +
=====Thermal Processing for Photolithography=====
  +
  +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]]
  +
*[[Ovens 1, 2 & 3 (Labline)]]
  +
*[[Oven 4 (Fisher)]]
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*[[Oven 5 (Labline)]]
  +
*[[High Temp Oven (Blue M)]]
  +
*[[Vacuum Oven (YES)]]
  +
*The [https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
 
|-
 
|-
 
|}
 
|}
   
 
=Vacuum Deposition=
 
=Vacuum Deposition=
  +
 
{|
 
{|
|-valign="top"
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|- valign="top"
|width=200|
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| width="300" |
  +
=====Physical Vapor Deposition (PVD)=====
* [[E-Beam 1 (Sharon)]]
 
  +
* [[E-Beam 2 (Custom)]]
 
* [[E-Beam 3 (Temescal)]]
+
*[[E-Beam 1 (Sharon)]]
* [[E-Beam 4 (CHA)]]
+
*[[E-Beam 2 (Custom)]]
* [[Sputter 1 (Custom)]]
+
*[[E-Beam 3 (Temescal)]]
* [[Sputter 2 (SFI Endeavor)]]
+
*[[E-Beam 4 (CHA)]]
* [[Sputter 3]]
+
*[[Thermal Evap 1]]
* [[Sputter 4]]
+
*[[Thermal Evap 2 (Solder)]]
  +
|width=200|
 
* [[Sputter 5 (Lesker AXXIS)]]
+
=====Sputter Deposition=====
  +
* [[PECVD 1]]
 
* [[PECVD 2 (Advanced Vacuum)]]
+
*[[Sputter 3 (AJA ATC 2000-F)]]
* [[Unaxis VLR ICP-PECVD]]
+
*[[Sputter 4 (AJA ATC 2200-V)]]
  +
*[[Sputter 5 (AJA ATC 2200-V)]]
* [[IBD]]
 
* [[Molecular Vapor Deposition]]
+
*[[Ion Beam Deposition (Veeco NEXUS)]]
  +
* [[Atomic Layer Deposision (Oxford Flexal)]]
 
  +
| width="400" |
|-
 
  +
=====Chemical Vapor Deposition (CVD)=====
  +
  +
*[[PECVD 1 (PlasmaTherm 790)]]
  +
*[[PECVD 2 (Advanced Vacuum)]]
  +
*[[ICP-PECVD (Unaxis VLR)]]
  +
*[[Molecular Vapor Deposition]]
  +
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]
  +
 
|}
 
|}
   
 
=Dry Etch=
 
=Dry Etch=
  +
 
{|
 
{|
|-valign="top"
+
|- valign="top"
|width=200|
+
| width="300" |
  +
=====Reactive Ion Etching (RIE)=====
* [[RIE 1]]
 
  +
* [[RIE 2]]
 
* [[RIE 3]]
+
*[[RIE 2 (MRC)]]
* [[RIE 5]]
+
*[[RIE 3 (MRC)]]
* [[Si Deep RIE]]
+
*[[RIE 5 (PlasmaTherm)]]
* [[Ashers]]
+
*[[Ashers (Technics PEII)]]
  +
*[[Plasma Clean (Gasonics 2000)]]
* [[Unaxis VLR ICP-Etch]]
 
  +
*[[Plasma Clean (YES EcoClean)]]
|width=200|
 
* [[ICP Etch 1]]
+
*[[Plasma Activation (EVG 810)]]
* [[ICP Etch 2]]
+
*[[CAIBE (Oxford Ion Mill)]]
  +
* [[UV Ozone Reactor]]
 
  +
=====Etch Monitoring=====
* [[Plasma Clean]]
 
  +
* [[XeF2 Etch]]
 
  +
*[[Laser Etch Monitoring]] (Endpoint Detection)
* [[Plasma Activation Tool]]
 
  +
*Optical Emission Spectra
|-
 
  +
*Residual Gas Analyzer (RGA)
  +
| width="400" |
  +
=====ICP-RIE=====
  +
  +
*[[ICP Etch 1 (Panasonic E626I)]]
  +
*[[ICP Etch 2 (Panasonic E640)]]
  +
*[[ICP-Etch (Unaxis VLR)]]
  +
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
  +
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
  +
  +
=====Other Dry Etching=====
  +
  +
*[[UV Ozone Reactor]]
  +
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
  +
*[[Vapor HF Etch]]
  +
 
|}
 
|}
   
 
=Wet Processing=
 
=Wet Processing=
  +
See the [[Chemical List|Chemical List page]] for stocked chemicals such as Developers, Etchants, Solvents etc.
* [[Wet Benches]]
 
  +
{|
* [[Gold Plating Bench]]
 
  +
|- valign="top"
* [[Critical Point Dryer]]
 
  +
| width="300" |
* [[Spin Rinse Dryer]]
 
  +
*[[Wet Benches]]
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**[[Solvent Cleaning Benches]]
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**[[Spin Coat Benches]]
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**[[Develop Benches]]
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**[[Toxic Corrosive Benches]]
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**[[HF/TMAH Processing Benches]]
  +
**[[Plating Bench]]
  +
| width="400" |
  +
*[[Gold Plating Bench]]
  +
*[[Critical Point Dryer]]
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*[[Spin Rinse Dryer (SemiTool)]]
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*[[Chemical-Mechanical Polisher (Logitech)]]
  +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
  +
|-
  +
|}
   
 
=Thermal Processing=
 
=Thermal Processing=
  +
{|
* [[Rapid Thermal Processor]]
 
  +
|- valign="top"
* [[Strip Annealer]]
 
  +
| width="400" |
* [[Tube Furnace (Tystar 8300)]]
 
  +
*[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
* [[Tube Furnace Wafer Bonding (Thermco)]]
 
  +
*[[Rapid Thermal Processor (SSI Solaris 150)]]
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
 
  +
*[[Tube Furnace (Tystar 8300)]]
  +
*[[Tube Furnace Wafer Bonding (Thermco)]]
  +
*[[Tube Furnace AlGaAs Oxidation (Lindberg)]]
  +
*[[Wafer Bonder (SUSS SB6-8E)]]
  +
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
  +
| width="400" |
  +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]]
  +
**[[Ovens 1, 2 & 3 (Labline)]]
  +
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
  +
**[[Oven 5 (Labline)]]
  +
**[[Vacuum Oven (YES)]]
  +
**[[High Temp Oven (Blue M)]]
  +
|-
  +
|}
   
 
=Packaging=
 
=Packaging=
  +
* [[Flip-Chip Bonder]]
 
* [[Vacuum Sealer]]
+
*[[Dicing Saw (ADT)]]
  +
*[[Flip-Chip Bonder (Finetech)]]
* [[Dicing Saw]]
 
  +
*[[Vacuum Sealer]]
  +
*[[Wire Saw (Takatori)]]
   
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=
  +
{|
* [[Field Emission SEM 1]]
 
  +
|- valign="top"
* [[Field Emission SEM 2]]
 
  +
| width="300" |
* [[Step Profile]]
 
  +
=====Optical/Electron Microscopy=====
* [[Step Profilometer]]
 
  +
* [[Ellipsometer]]
 
* [[Microscopes]]
+
*[[Microscopes|Optical Microscopes]]
  +
*[[Fluorescence Microscope (Olympus MX51)]]
* [[Probe Station & Curve Tracer]]
 
* [[Optical Film Thickness (Filmetrics)]]
+
*[[Deep UV Optical Microscope (Olympus)]]
* [[Scanning Probe Microscope]]
+
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  +
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
* [[Tencor Flexus Film Stress]]
 
* [[Optical Film Thickness (Nanometric)]]
+
*[[Field Emission SEM 1 (FEI Sirion)]]
* [[SEM Sample Coater]]
+
*[[Field Emission SEM 2 (JEOL 7600F)]]
  +
*[[SEM Sample Coater (Hummer)]]
* [[Surface Analysis]]
 
  +
* [[Photo-emission & IR Microscope]]
 
  +
=====Topographical Metrology=====
* [[Ellipsometer (Woollam)]]
 
  +
* [[Goniometer]]
 
  +
*[[Step Profilometer (KLA Tencor P-7)]]
* [[4-Point Probe Resistivity Mapper]]
 
  +
*[[Step Profilometer (Dektak 6M)]]
  +
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
  +
*[[Surface Analysis (KLA/Tencor Surfscan)]]
  +
**''Sub-micron Particle Counter''
  +
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  +
*[[Optical Profilometer - White-Light/Phase-Shift Interference (Filmetrics Profilm3D)]]
  +
| width="400" |
  +
=====Thin-Film Analysis/Measurement=====
  +
  +
*[[Ellipsometer (Woollam)]]
  +
*[[Film Stress (Tencor Flexus)]]
  +
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
  +
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
  +
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
  +
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
  +
*[[Optical Film Thickness (Nanometric)]]
  +
*[[Resistivity Mapper (CDE RESMAP)]]
  +
  +
=====Other Tools=====
  +
  +
*[[Probe Station & Curve Tracer]]
  +
*[[Goniometer]]
  +
*[[Photoluminescence PL Setup (Custom)]]
  +
|-
  +
|}

Revision as of 15:05, 8 October 2019

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Etch Monitoring
ICP-RIE
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical/Electron Microscopy
Topographical Metrology
Thin-Film Analysis/Measurement
Other Tools