Difference between revisions of "Thermal Evap 2 (Solder)"
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= About = |
= About = |
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+ | Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators. |
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− | write something... |
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= Detailed Specifications = |
= Detailed Specifications = |
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+ | Wafers up to 12" can be mounted. |
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− | work on this page... |
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=Documentation= |
=Documentation= |
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= Materials Table = |
= Materials Table = |
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For the materials tables, please visit the [[Thermal_Evaporation_Recipes#Materials_Table_(Thermal Evaporator #1)|Thermal Evaporation Recipe Page]]. |
For the materials tables, please visit the [[Thermal_Evaporation_Recipes#Materials_Table_(Thermal Evaporator #1)|Thermal Evaporation Recipe Page]]. |
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+ | ==Data== |
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+ | [[Thermal Evaporation Recipes]] |
Revision as of 10:47, 24 May 2017
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About
Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators.
Detailed Specifications
Wafers up to 12" can be mounted.
Documentation
Materials Table
For the materials tables, please visit the Thermal Evaporation Recipe Page.