Difference between revisions of "Thermal Evap 2 (Solder)"

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= About =
 
= About =
  +
  +
Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators.
   
  +
= Detailed Specifications =
= Materials Table =
 
  +
Wafers up to 12" can be mounted.
   
  +
=Documentation=
{| border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" class="collapsible collapsed wikitable"
 
  +
*[[ media: Thermal Evaporator2.pdf|Operating Instructions]]
|-
 
  +
! colspan=6 width=1300 height=35 bgcolor="#D0E7FF" align="center"|<div style="font-size: 150%;">Materials Table</div>
 
  +
= Materials Table =
|- bgcolor="#D0E7FF"
 
  +
For the materials tables, please visit the [[Thermal_Evaporation_Recipes#Materials_Table_(Thermal Evaporator #1)|Thermal Evaporation Recipe Page]].
! width="45" bgcolor="#D0E7FF" align="center" | '''Material'''
 
  +
==Data==
! width="45" bgcolor="#D0E7FF" align="center" | '''Symbol'''
 
  +
[[Thermal Evaporation Recipes]]
! width="45" bgcolor="#D0E7FF" align="center" | '''Density, g/cm3'''
 
! width="45" bgcolor="#D0E7FF" align="center" | '''Z Ratio'''
 
! width="45" bgcolor="#D0E7FF" align="center" | '''Tooling, %'''
 
! width="100" bgcolor="#D0E7FF" align="center" | '''Comments'''
 
|-
 
|Aluminum
 
|Al
 
|2.70
 
|1.08
 
|
 
|
 
|-
 
|Antimony
 
|Sb
 
|6.620
 
|0.768
 
|
 
|
 
|-
 
|Arsenic
 
|As
 
|5.73
 
|0.996
 
|
 
|
 
|-
 
|Beryllium
 
|Be
 
|1.85
 
|0.543
 
|
 
|
 
|-
 
|Boron
 
|B
 
|2.54
 
|0.389
 
|
 
|
 
|-
 
|Cadmium
 
|Cd
 
|8.64
 
|0.682
 
|
 
|
 
|-
 
|Cadmium sulfide
 
|CdS
 
|4.83
 
|1.02
 
|
 
|
 
|-
 
|Cadmium telluride
 
|CdTe
 
|5.85
 
|0.980
 
|
 
|
 
|-
 
|Calcium fluoride
 
|CaF<sub>2</sub>
 
|3.18
 
|0.775
 
|
 
|Used often
 
|-
 
|Carbon (graphite)
 
|C
 
|2.25
 
|3.26
 
|
 
|
 
|-
 
|Chromium
 
|Cr
 
|7.20
 
|0.305
 
|155
 
|Used often
 
|-
 
|Cobalt
 
|Co
 
|8.71
 
|0.343
 
|
 
|
 
|-
 
|Copper
 
|Cu
 
|8.93
 
|0.437
 
|
 
|
 
|-
 
|Gallium
 
|Ga
 
|5.93
 
|0.593
 
|
 
|
 
|-
 
|Gallium Arsenide
 
|GaAs
 
|5.31
 
|1.59
 
|
 
|
 
|-
 
|Germanium
 
|Ge
 
|5.35
 
|0.516
 
|
 
|
 
|-
 
|Gold
 
|Au
 
|19.30
 
|0.381
 
|
 
|Used often
 
|-
 
|Indium
 
|In
 
|7.30
 
|0.841
 
|120
 
|USed often
 
|-
 
|Indium antimonide
 
|InSb
 
|5.76
 
|0.769
 
|
 
|
 
|-
 
|Iridium
 
|Ir
 
|22.4
 
|0.129
 
|
 
|
 
|-
 
|Iron
 
|Fe
 
|7.86
 
|0.349
 
|
 
|
 
|-
 
|Lead
 
|Pb
 
|11.3
 
|1.13
 
|
 
|
 
|-
 
|Lead sulfide
 
|PbS
 
|7.50
 
|0.566
 
|
 
|
 
|-
 
|Lithium fluoride
 
|LiF
 
|2.638
 
|0.778
 
|
 
|
 
|-
 
|Magnesium
 
|Mg
 
|1.74
 
|1.61
 
|
 
|
 
|-
 
|Magnesium oxide
 
|MgO
 
|3.58
 
|0.411
 
|
 
|
 
|-
 
|Magnesium Fluoride
 
|MgF<sub>2</sub>
 
|3.00 ( should be 3.18)
 
|0.427( should be 0.637)
 
|
 
|
 
|-
 
|Manganese
 
|Mn
 
|7.20
 
|0.377
 
|
 
|
 
|-
 
|Manganese(II) Sulfide
 
|MnS
 
|3.99
 
|0.94
 
|
 
|
 
|-
 
|Mercury
 
|Hg
 
|13.46
 
|0.74
 
|
 
|
 
|-
 
|Molybdenum
 
|Mo
 
|10.2
 
|0.257
 
|
 
|
 
|-
 
|Nickel
 
|Ni
 
|8.91
 
|0.331
 
|
 
|Used often
 
|-
 
|Niobium
 
|Nb
 
|8.578
 
|0.492
 
|
 
|
 
|-
 
|Niobium(V) Oxide
 
|Nb<sub>2</sub>O<sub>5</sub>
 
|4.47
 
|1.00
 
|z ratio has not been established
 
|
 
|-
 
|Palladium
 
|Pd
 
|12.0
 
|0.357
 
|
 
|
 
|-
 
|Platinum
 
|Pt
 
|21.4
 
|0.245
 
|
 
|
 
|-
 
|Potasium Cloride
 
|KCl
 
|1.98
 
|2.05
 
|
 
|
 
|-
 
|Selenium
 
|Se
 
|4.82
 
|0.864
 
|
 
|
 
|-
 
|Silicon
 
|Si
 
|2.32
 
|0.712
 
|
 
|
 
|-
 
|Silicon(II) Oxide
 
|SiO
 
|2.13
 
|0.87
 
|
 
|
 
|-
 
|Silicon dioxide (fused quarz)
 
|SiO<sub>2</sub>
 
|2.20
 
|1.07
 
|
 
|
 
|-
 
|Silver
 
|Ag
 
|10.5
 
|0.529
 
|
 
|
 
|-
 
|Silver bromide
 
|AgBr
 
|6.47
 
|1.18
 
|
 
|
 
|-
 
|Silver chloride
 
|AgCl
 
|5.56
 
|1.32
 
|
 
|
 
|-
 
|Sodium
 
|Na
 
|0.97
 
|4.8
 
|
 
|
 
|-
 
|Sodium chloride
 
|NaCl
 
|2.17
 
|1.57
 
|
 
|
 
|-
 
|Tantalum
 
|Ta
 
|16.6
 
|0.262
 
|
 
|
 
|-
 
|Tantalum(IV) oxide
 
|Ta<sub>2</sub>O<sub>5</sub>
 
|8.2
 
|0.30
 
|
 
|
 
|-
 
|Tin
 
|Sn
 
|7.30
 
|0.724
 
|
 
|Used often
 
|-
 
|Titanium
 
|Ti
 
|4.50
 
|0.628
 
|
 
|Used often
 
|-
 
|Titanium (IV) Oxide
 
|TiO<sub>2</sub>
 
|4.26
 
|0.40
 
|
 
|
 
|-
 
|Titanium Oxide
 
|TiO
 
|4.90
 
|N/A
 
|
 
|
 
|-
 
|Tangsten
 
|W
 
|19.3
 
|0.163
 
|
 
|
 
|-
 
|Tangsten carbide
 
|WC
 
|15.6
 
|0.151
 
|
 
|
 
|-
 
|Zinc
 
|Zn
 
|7.04
 
|0.514
 
|
 
|Used often; Density should be 7.14
 
|-
 
|Zinc Oxide
 
|ZnO
 
|5.61
 
|0.556
 
|
 
|
 
|-
 
|Zinc Sulphide
 
|ZnS
 
|4.09
 
|0.775
 
|
 
|
 
|-
 
|Zirconium
 
|Zr
 
|6.51
 
|0.60
 
|
 
|Should be 6.40
 
|-
 
|Zirconium Oxide
 
|ZrO<sub>2</sub>
 
|5.6
 
|
 
|
 
|Should be 5.49
 
|-
 

Revision as of 10:47, 24 May 2017

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
Sign up for this tool



About

Thermal evaporator #2 is the designated "Solder" evaporator. The tool is used primarily for solder materials including Gold, Indium and Tin. Use this tool for materials with low melting temperatures, or for materials that have a high risk of contamination in the e-beam evaporators.

Detailed Specifications

Wafers up to 12" can be mounted.

Documentation

Materials Table

For the materials tables, please visit the Thermal Evaporation Recipe Page.

Data

Thermal Evaporation Recipes