Difference between revisions of "Surface Analysis (KLA/Tencor Surfscan)"
Jump to navigation
Jump to search
(→About) |
|||
| Line 10: | Line 10: | ||
}} |
}} |
||
=About= |
=About= |
||
| + | This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. |
||
| + | |||
=Documentation= |
=Documentation= |
||
*[[media:Surfscan-Operation-Manual.pdf|Operations Manual]] |
*[[media:Surfscan-Operation-Manual.pdf|Operations Manual]] |
||
Revision as of 14:20, 10 July 2015
|
About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface.