Difference between revisions of "Surface Analysis (KLA/Tencor Surfscan)"

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|super= Biljana Stamenic
 
|super= Biljana Stamenic
 
|location=Bay 5
 
|location=Bay 5
|description = ?
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|description = Surface Analysis
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KLA/Tencor Surfscan
 
|manufacturer = Tencor
 
|manufacturer = Tencor
 
|materials =
 
|materials =
 
|toolid=
 
|toolid=
 
}}
 
}}
=About=
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==About==
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface.
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This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 6 inches.
   
=Documentation=
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==Documentation==
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*[[KLA-Tencor Surfscan - Standard Operating Procedure|Standard Operating Procedure]]
 
*[[media:Surfscan-Operation-Manual.pdf|Operations Manual]]
 
*[[media:Surfscan-Operation-Manual.pdf|Operations Manual]]
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**''For detailed measurement info, it is highly recommended that you read the manual.''
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*[[media:Surfscan-Surfscan 6200 info.pdf|Surfscan Info]]
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=== Screenshots ===
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[[File:UCSBTEST.png|left|thumb|'''UCSBTEST2''' for big size particles '''(1.6-28.0)um''']][[File:UCSBTEST2 for small particles.png|left|thumb|'''UCSBTEST2''' for small size particles '''(0.16-1.6)um''']]

Revision as of 09:44, 11 April 2019

Surface Analysis (KLA/Tencor Surfscan)
KLA.jpg
Tool Type Inspection, Test and Characterization
Location Bay 5
Supervisor Biljana Stamenic
Supervisor Phone (805) 893-4002
Supervisor E-Mail biljana@ece.ucsb.edu
Description Surface Analysis
KLA/Tencor Surfscan 
Manufacturer Tencor


About

This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 6 inches.

Documentation

Screenshots

UCSBTEST2 for big size particles (1.6-28.0)um
UCSBTEST2 for small size particles (0.16-1.6)um