Difference between revisions of "Stepper 3 (ASML DUV)"

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(link to SOP)
(Operating Procedures: link to error & calibration procedure)
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=Operating Procedures=
=Operating Procedures=
* [[ASML Stepper 3 Standard Operating Procedure|Standard Operating Procedure]]
* [[ASML Stepper 3 Standard Operating Procedure|Standard Operating Procedure]]
* [[ASML Stepper 3 Error Recovery, Troubleshooting and Calibration|Error Recovery, Troubleshooting and Calibration]]
* [[media:ASML Job Set-Up Guide v2.pdf|Job Programming - Full]]
* [[media:ASML Job Set-Up Guide v2.pdf|Job Programming - Full]]

Revision as of 13:14, 17 July 2018

Stepper 3 (ASML DUV)
Tool Type Lithography
Location Bay 3
Supervisor Brian Thibeault
Supervisor Phone (805) 893-2268
Supervisor E-Mail thibeault@ece.ucsb.edu
Description ASML PAS 5500/300 DUV Stepper
Manufacturer ASML
Sign up for this tool


The ASML 5500 stepper is a 248nm DUV stepper for imaging dense features down to below 200nm and isolated line structures down to below 150nm. Overlay accuracy is better than 30nm.

The system is configured for 4” wafers and, with staff support, mounted pieces down to 14mm in size can be exposed using a 4” wafer as a carrier. The system is designed for high throughput, so shooting multiple 4" wafers is extremely fast. Additionally, exposure jobs are highly programmable, allowing for very flexible exposures of multiple aligned patterns from multiple masks in a single session, allowing for process optimization of large vs. small features in a single lithography.

The full field useable exposure area is limited to the intersection of a 31mm diameter circle and a rectangle of dimensions 22mm x 27mm. See the Mask Making Guidelines page for more info on exposure field sizes and how to order your mask plates.

Resists Used (see PhotoLith. Recipes for processing info):

  • UV210-0.3 - Positive: 300nm nominal thickness
  • UV6-0.8 - Positive: 800nm nominal thickness
  • UV26-2.5 - Positive: 2.5um nominal thickness
  • UVN2300-0.5 - Negative: 500nm nominal thickness
  • AR2/DUV42P-6/DS-K101: Anti-Reflective Coatings
  • PMGI: Underlayer

AZ300MIF Developer for all processes

Process Information

  • Process Page
  • Alignment Accuracy: < 50 nm
  • Minimum Feature Size: ≤150 nm isolated lines, ≤200 nm dense patterns
  • Maximum Wafer Bow: approx. 100 µm. (4-inch diam.).
    • Above this and the job may fail or lose the wafer inside the machine due to wafer vacuum error.

Service Provider

Operating Procedures

Troubleshooting and Recovery