Difference between revisions of "Stepper 3 (ASML DUV)"

From UCSB Nanofab Wiki
Jump to: navigation, search
(Operating Procedures)
(Operating Procedures)
Line 24: Line 24:
=Operating Procedures=
=Operating Procedures=
* [[media:ASML_Job_Set-Up_Guide_v2.pdf|Training Manual]]
* [[media:ASML_Job_Set-Up_Guide_v2.pdf|Job Programming - Full]]
* [[media:ASML_Job_Set-Up_Guide_simple_v1.pdf|Job Programming- Simplified -Full Wafers]]
* [[media:ASML_Mask_Making_Guidelines.pdf|Mask Making Guidelines]]
* [[media:ASML_Mask_Making_Guidelines.pdf|Mask Making Guidelines]]

Revision as of 10:49, 3 June 2016

Stepper 3 (ASML DUV)
Tool Type Lithography
Location Bay 3
Supervisor Brian Thibeault
Supervisor Phone (805) 893-2268
Supervisor E-Mail thibeault@ece.ucsb.edu
Description ASML PAS 5500/300 DUV Stepper
Manufacturer ASML
Sign up for this tool


The ASML 5500 stepper is a 248nm DUV stepper for imaging dense features down to below 200nm and isolated line structures down to below 150nm. The system has a variable NA system and has a field image size of 21 x 21mm for 0.63 NA and a field size of 22mm x 27mm for 0.4 to 0.57 NA. Overlay accuracy is better than 30nm. The system is configured for 4” wafers and pieces down to 14mm in size can be exposed using a 4” wafer as a carrier.

Process Information

Service Provider

Operating Procedures