Difference between revisions of "Step Profilometer (KLA Tencor P-7)"

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{{tool|{{PAGENAME}}
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{{tool2|{{PAGENAME}}
 
|picture=KLA-Tencor-P7_Photo.JPG
 
|picture=KLA-Tencor-P7_Photo.JPG
 
|type = Inspection, Test and Characterization
 
|type = Inspection, Test and Characterization
|super= Brian Lingg
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|super= Bill Millerski
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|super2= Aidan Hopkins
 
|phone=(805)839-3918x210
 
|phone=(805)839-3918x210
 
|location=Bay 4
 
|location=Bay 4
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|materials =
 
|materials =
 
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== About ==
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==About==
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The KLA-Tencor P7 profilometer is a stylus profilometer that drags a stylus across the wafer surface with controlled pressure, aligned via microcope, and measures the step-heights of surface features during the measurement. The system has a motor-controlled stage for X/Y/Rotation, and is typically used to measure step heights in single areas on various sample sizes frmo small pieces to 4-inch wafers. It can be programmed to scan multiple locations on a single wafer or 3D areas topography.
The KLA Tencor info will be here
 
   
 
==Detailed Specifications==
 
==Detailed Specifications==
*More info to go here
 
   
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*Probe Tip: 2um radius and 60° angle
== Instructions ==
 
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*Maximum wafer size: 6-inch
* [[KLA Tencor P7 - Basic profile instructions|Basic profile instructions]]
 
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*1D Profile and 2D Raster Scanning
* [[KLA Tencor P7 - Saving Profile Data|Saving+Extracting Profile Data]]
 
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*Automated Measurement Routines
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==Instructions==
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*[[KLA Tencor P7 - Basic profile instructions|KLA Tencor Operation Procedure]]
 
*[[KLA Tencor P7 - Saving Profile Data|Saving+Extracting Profile Data]]

Latest revision as of 23:06, 4 April 2024

Step Profilometer (KLA Tencor P-7)
KLA-Tencor-P7 Photo.JPG
Location Bay 4
Tool Type Inspection, Test and Characterization
Manufacturer KLA Tencor
Description Surface Profilometer

Primary Supervisor Bill Millerski
(805) 893-2655
wmillerski@ucsb.edu

Secondary Supervisor

Aidan Hopkins


Recipes N/A


About

The KLA-Tencor P7 profilometer is a stylus profilometer that drags a stylus across the wafer surface with controlled pressure, aligned via microcope, and measures the step-heights of surface features during the measurement. The system has a motor-controlled stage for X/Y/Rotation, and is typically used to measure step heights in single areas on various sample sizes frmo small pieces to 4-inch wafers. It can be programmed to scan multiple locations on a single wafer or 3D areas topography.

Detailed Specifications

  • Probe Tip: 2um radius and 60° angle
  • Maximum wafer size: 6-inch
  • 1D Profile and 2D Raster Scanning
  • Automated Measurement Routines

Instructions