Sputtering Recipes

Back to Vacuum Deposition Recipes.

Sputter 2 (SFI Endeavor)

Al Deposition (Sputter 2)

• Al Deposition Recipe

AlN_x Deposition (Sputter 2)

• AlN_x Deposition Recipe

Au Deposition (Sputter 2)

• Au Deposition Recipe

TiO₂ Deposition (Sputter 2)

• TiO2₂ Deposition Recipe

Sputter 3 (AJA ATC 2000-F)

Material	P(mT)	Pow(W)	Sub(W)	T(C)	Ar	N2	O2	Height-Tilt	Rate(nm/min)	Stress(MPa)	Rs(uOhm-cm)	n@633nm	k@633nm	Data Below	Comment
XXX	XXX	XXX	XXX	XXX	XXX	XXX	XXX	XXX	XXX	XXX	XXX	XXX	XXX	XXX	XXX

Ni and Ta Deposition (Sputter 3)

• Ni and Ta Deposition Recipe

Sputter 4 (AJA ATC 2200-V)

The recipes below are given as starting points from data obtained in the nanofab. For critical depositions, calibrations are recommended.

Material	P(mT)	Pow(W)	Sub(W)	T(C)	Ar	N2	O2	Height-Tilt	Rate(nm/min)	Stress(MPa)	Rs(uOhm-cm)	n@633nm	k@633nm	Data Below	Comment
W	3	300	0	50	45	0	0	H2.75-T5	11.5	-150 to 150	11	-	-	Yes	Jeremy Watcher
TiW	4.5	300	0	75	45	0	0	H2.75-T5	9.5	-150 to 150	60	-	-	Yes	10%Ti by Wt

W-TiW Deposition (Sputter 4)

• W-TiW Deposition Recipe

Ion Beam Deposition (Veeco NEXUS)

IBD Calibrations Spreadsheet - Records of historical film depositions (rates, indices), Uniformity etc.

All users are required to enter their calibration deps (simple test deps only)

SiO₂ deposition (IBD)

• Refractive Index: ≈1.485
• Rate: ≈6.1nm/min (users must calibrate this prior to critical deps)
• Stress ≈ -320MPa (compressive)

• Recipe: SiO₂_dep

Si₃N₄ deposition (IBD)

• Refractive Index ≈ 2.01
• Rate ≈ 4.5nm/min (users must calibrate this prior to critical deps)
• Stress ≈ -1756MPa (compressive)

• Recipe: SiN_dep
• SiN Film Data (IBD)
• SiN Recipe Details (IBD)

Ta₂O₅ deposition (IBD)

• Refractive Index ≈ 2.10
• Rate ≈7.8nm/min (users must calibrate this prior to critical deps)
• Stress ≈ -140MPa (compressive)

• Recipe: Ta₂O₅_dep

TiO₂ deposition (IBD)

• Refractive Index ≈ 2.3-2.4
• Rate ≈ 1.8nm/min
• Recipe: TiO₂_dep