Optical Film Thickness & Wafer-Mapping (Filmetrics F50)
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About
This tool is for thickness and optical property measurements of films on substrates, including mapping of thin-films on full wafers. The technique used is white light reflection. Data is taken with normal incidence reflection of white light (190 nm – 1700 nm) from the surface using a Deuterium (UV) and Halogen (Vis-nIR) lamps. The motorized stage automatically acquires optical reflection spectra at programmed points across the wafer. The data is modeled at each point, and the optical parameters (thickness/refractive index/absorption) are adjusted to give a best least-squared fit to the data. The accuracy of the technique will depend on the thickness of the film and the optical models used for the fitting of the data. For a more complete description go to Filmetrics.
Equipment Specifications
- 190-1700 nm reflection spectrum
- 10 Å to 150 µm thickness, n, and k measurements
- Accepts wafers up to 150mm for motorized mapping.
- Small substrates also possible, ≥ 2-3mm
- Data can be saved
- Can model up to three layers with accuracy