Difference between revisions of "Lithography Recipes"

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== General Information ==
 +
==General Information==
   
 
This page contains information and links to recipes/datasheets spin-coated materials used in the facility. In general, the following information is provided for the following materials:
  
This page contains information and links to recipes/datasheets spin-coated materials used in the facility. In general, the following information is provided for the following materials:
   
  +
*'''[[#PositivePR |Photoresists]]''':
−
* [[#PositivePR | Photoresists]]: Links to nominal recipes to provide the user with starting points are found in the Photo Lithography Recipe section. Substrate, surface materials, pattern size can often affect process parameters. Datasheets provided for reference.
  
−
* [[#EBLPR | E-beam Lithography Resists]]: Links to nominal recipes may be provided in the E-Beam Lithography Recipe Section. Substrates and patterns play a large role in process parameters. Datasheets provided for reference.
 +
**[[#Photolithography_Recipes |Photo Lithography Recipe section]]: Has links to nominal recipes (spin, bake, exposure, develop etc.) to provide the user with starting points are found in the. Substrate, surface materials, pattern size can often affect process parameters.
  +
**[[#PositivePR |Stocked Lithography Chemical + Datasheets]]: Lists all stocked photolith. chemicals, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.
−
* [[#Underlayers | Underlayers]]: These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist. Datasheets are provided and some recipes are found in the Lift-Off Techniques section.
  
  +
*'''[[#EBLPR |E-beam Lithography Resists]]''': Links to nominal recipes may be provided in the [[#E-Beam_Lithography_Recipes | E-Beam Lithography Recipe Section]]. Substrates and patterns play a large role in process parameters. [[#EBLPR | Datasheets]] provided for reference.
−
* [[#NanoImprinting | Nanoimprinting Resists]]: Datasheets are provided. Any recipes provided are for use in the Nanonex NX2000 system only and are found in the Nanoimprint section.
  
  +
*'''[[#NanoImprinting |Nanoimprinting Resists]]''': Datasheets are provided. Any recipes provided are for use in the [[Nano-Imprint_(Nanonex_NX2000) | Nano-Imprint (Nanonex NX2000)]] system only and are found in the [[#Nanoimprinting_Recipes | Nanoimprinting Recipes section]].
−
* Holography: For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square. Recipe on silicon provided in the holography section.
  
−
* [[#AntiReflectionCoatings | Anti-Reflection Coatings]]: These are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes. Recipes using these materials are found within the photoresist recipes themselves. Datasheets are provided for reference on use of the materials.
  
−
* [[#ContrastEnhancement | Contrast Enhancement Materials (CEM)]]: Used for resolution enhancement. Not for use in contact aligners. Recipes using these materials are found within the photoresist recipes themselves. Datasheets also provided.
  
−
* [[#AdhesionPromoters | Adhesion Promoters]]: Datasheets are provided on use of these materials.
 
−
* [[#BCBandSOG | Low-K Spin-on Dielectrics]]: Datasheets are provided for BCB, Photo-BCB, and SOG for reference on use. Some recipes are provided in the Low-K section.
  
−
* [[#Developers | Developers and Removers]]: Datasheets provided for reference.
  
   
  +
*'''[[#Underlayers |Underlayers]]''': These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist. Datasheets are provided and some recipes are found in the [[#Lift-Off_Techniques | Lift-Off Techniques section]].
−
== Lift-Off Techniques ==
  
  +
*'''Holography''': For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square. Recipes for silicon substrates are provided in the [[#Holography_Recipes |Holography section]].
  +
*'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''': Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes. Recipes using these materials are found within the [[#Photolithography_Recipes |photoresist recipes]] themselves. Datasheets are provided for reference on use of the materials.
  +
*'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]''': Used for resolution enhancement. Not for use in contact aligners. Recipes using these materials are found within the [[#Photolithography_Recipes |photoresist recipes]] themselves. Datasheets also provided.
  +
*'''[[#AdhesionPromoters |Adhesion Promoters]]''': These are used to improve wetting of photoresists to your substrate. Datasheets are provided on use of these materials.
   
  +
*'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]''': Datasheets are provided for BCB, Photo-BCB, and SOG for reference on use. Some recipes are provided in the [[#Low-K_Spin-On_Dielectric_Recipes | Low-K Spin-On Dielectric Recipes section]].
−
*{{fl|Liftoff-Techniques.pdf|Description/Tutorial}}
 
  +
*'''[[#Developers |Developers and Removers]]''': Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching. Datasheets provided for reference.
−
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
  
   
  +
==Photolithography Recipes==
−
== Chemical Datasheets ==
  
   
  +
{{Recipe Table Explanation}}
  +
  +
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" border="1"
  +
|- bgcolor="#D0E7FF"
  +
! colspan="9" height="45" |<div style="font-size: 150%;">Photolithography Recipes</div>
  +
  +
|- bgcolor="#D0E7FF"
  +
|<!-- INTENTIONALLY LEFT BLANK --><br>
  +
! colspan="2" bgcolor="#D0E7FF" align="center" |'''[[Contact Alignment Recipes|Contact Aligners]]'''
  +
! colspan="3" bgcolor="#D0E7FF" align="center" |'''[[Stepper Recipes|Steppers]]'''
  +
  +
  +
|-
  +
! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists'''
  +
{{LithRecipe Table}}
  +
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |AZ4110
  +
| bgcolor="EEFFFF" |{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  +
| bgcolor="EEFFFF" |{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
  +
| bgcolor="EEFFFF" |A
  +
| bgcolor="EEFFFF" |A
  +
| bgcolor="EEFFFF" |
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |AZ4210
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
  +
|A
  +
|A
  +
|<br>
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |AZ4330RS
  +
| bgcolor="EEFFFF" |{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  +
| bgcolor="EEFFFF" |{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
  +
| bgcolor="EEFFFF" |A
  +
| bgcolor="EEFFFF" |A
  +
| bgcolor="EEFFFF" |
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |OCG 825-35CS
  +
|A
  +
|A
  +
|A
  +
|A
  +
|<br>
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |SPR 950-0.8
  +
| bgcolor="EEFFFF" |A
  +
| bgcolor="EEFFFF" |A
  +
| bgcolor="EEFFFF" |A
  +
| bgcolor="EEFFFF" |A
  +
| bgcolor="EEFFFF" |
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |SPR 955 CM-0.9
  +
|A
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
  +
|{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
  +
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
  +
|<br>
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |SPR 955 CM-1.8
  +
| bgcolor="EEFFFF" |A
  +
| bgcolor="EEFFFF" |A
  +
| bgcolor="EEFFFF" |{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
  +
| bgcolor="EEFFFF" |{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
  +
| bgcolor="EEFFFF" |
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |SPR 220-3.0
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
  +
|{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
  +
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
  +
|<br>
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |SPR 220-7.0
  +
| bgcolor="EEFFFF" |{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  +
| bgcolor="EEFFFF" |{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
  +
| bgcolor="EEFFFF" |{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
  +
| bgcolor="EEFFFF" |{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
  +
| bgcolor="EEFFFF" |
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |THMR-IP3600 HP D
  +
|<br>
  +
|<br>
  +
|A
  +
|A
  +
|<br>
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |UV6-0.8
  +
| bgcolor="EEFFFF" |
  +
| bgcolor="EEFFFF" |
  +
| bgcolor="EEFFFF" |
  +
| bgcolor="EEFFFF" |
  +
| bgcolor="EEFFFF" |[https://www.nanotech.ucsb.edu/wiki/index.php/Stepper_Recipes#Positive_Resist_.28ASML_DUV.29 R]
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |UV210-0.3
  +
|
  +
|
  +
|
  +
|
  +
|[https://www.nanotech.ucsb.edu/wiki/index.php/Stepper_Recipes#Positive_Resist_.28ASML_DUV.29 R]
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |UV26-2.5
  +
| bgcolor="EEFFFF" |
  +
| bgcolor="EEFFFF" |
  +
| bgcolor="EEFFFF" |
  +
| bgcolor="EEFFFF" |
  +
| bgcolor="EEFFFF" |A
  +
  +
  +
|-
  +
! bgcolor="#D0E7FF" align="center" |'''Negative Resists'''
  +
{{LithRecipe Table}}
  +
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |AZ5214-EIR
  +
|{{rl|Contact_Alignment_Recipes|Negative Resist (MJB-3)}}
  +
|{{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
  +
|{{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
  +
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
  +
|
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |AZnLOF 2020
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  +
|{{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
  +
|{{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
  +
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
  +
|
  +
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |AZnLOF 2035
  +
|A
  +
|A
  +
|A
  +
|A
  +
|
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |AZnLOF 2070
  +
|A
  +
|A
  +
|A
  +
|A
  +
|
  +
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |AZnLOF 5510
  +
|A
  +
|A
  +
|{{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
  +
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
  +
|
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |UVN30-0.8
  +
|
  +
|
  +
|
  +
|
  +
|{{rl|Stepper Recipes|Negative Resist (ASML DUV)}}
  +
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |SU-8 2005,2010, 2015
  +
|A
  +
|{{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
  +
|A
  +
|A
  +
|
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |SU-8 2075
  +
|A
  +
|A
  +
|A
  +
|A
  +
|
  +
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |NR9-1000,3000,6000PY
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
  +
|A
  +
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
  +
|
  +
  +
  +
|-
  +
! bgcolor="#D0E7FF" align="center" | '''Anti-Reflection Coatings'''
  +
{{LithRecipe Table}}
  +
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |DUV42-P
  +
|
  +
|
  +
|
  +
|
  +
|{{rl|Stepper Recipes|DUV-42P}}
  +
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |DS-K101-304
  +
|
  +
|
  +
|
  +
|
  +
|{{rl|Stepper Recipes|DS-K101-304}}
  +
  +
|-
  +
! bgcolor="#D0E7FF" align="center" | ''' '''
  +
{{LithRecipe Table}}
  +
  +
  +
|}
  +
<!-- end Litho Recipes table -->
  +
  +
==E-Beam Lithography Recipes==
  +
  +
*Under Development.
  +
  +
==[[Automated Coat/Develop System (S-Cubed Flexi)|Automated Coat/Develop System Recipes (S-Cubed Flexi)]]==
  +
Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.
  +
  +
''To Be Added''
  +
  +
==Nanoimprinting Recipes==
  +
  +
*{{fl|Thermal-Nanoimprint-Process-Tutorial-revA.pdf|Thermal Nanoimprint Process and Tutorial}}
  +
*{{fl|Nanoinprint-Lithopgraphy-UV-Low-Pressure-Temperature-Ormostamp-PDMS-RevA.docx|UV-Cure Low Temp, Low Pressure, Soft-Stamp Nanoimprint Process}}
  +
  +
==Holography Recipes==
  +
  +
*{{fl|Holography_Process_for_1D-lines_and_2D-dots_(ARC-11_%26_THMR-IP3600HP-D)-updated-8-13-2018-A.pdf|Standard Holography Process - on SiO2 on Si}}
  +
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}}
  +
*{{fl|05-SiO2_Nano-structure_Etch.pdf|Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width}}
  +
*{{fl|30-Redicing_Nanowire_Diameter_by_Thermal_Oxidation_and_Vapored_HF_Etch.pdf|Reduce SiO2 Nanowire Diameter - Thermal Oxidation - Vapor HF Etching}}
  +
  +
==Low-K Spin-On Dielectric Recipes==
  +
  +
*{{fl|Lithography-BCB-photo-lowk-dielectric-spinon-4024-40-revA.docx|Photo BCB (4024-40)}}
  +
*{{fl|BCB-cyclotene-3000-revA.pdf|Standard BCB (3022-46)}}
  +
*{{fl|512B-Application-Data-Bake-revA.pdf|SOG (T512B)}}
  +
  +
==Lift-Off Techniques==
  +
  +
*{{fl|Liftoff-Techniques.pdf|Description/Tutorial}}
  +
*[[Lift-Off Tutorial|Lift-Off Tutorial and Limits]]
  +
**How it works, process limits and considerations for designing your process
  +
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
  +
*[[Lift-Off with DUV Imaging + PMGI Underlayer|DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer]]
  +
  +
==Chemicals Stocked + Datasheets==
  +
''The following is a list of the lithography chemicals we have available in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.''
 
{|
  
{|
 
|- valign="top"
  
|- valign="top"
−
| width="400" |
+
| width="400" |
 
;<div id="PositivePR"><big>Positive Photoresists</big></div>
  
;<div id="PositivePR"><big>Positive Photoresists</big></div>
  +
 
'''''i-line and broadband'''''
  
'''''i-line and broadband'''''
  +
−
*{{fl|AXP4000pb-Datasheet.pdf|AZP4000 (AZ4110, AZ4210, AZ4330)}}
 
−
*{{fl|OCG825-Positive-Resist-Datasheet.pdf|OCG825}}
+
*{{fl|AXP4000pb-Datasheet.pdf|AZP4000 (AZ4110, AZ4210, AZ4330)}}
−
*{{fl|SPR220-Positive-Resist-Datasheet.pdf|SPR220 (SPR220-3, SPR220-7)}}
+
*{{fl|OCG825-Positive-Resist-Datasheet.pdf|OCG825}}
−
*{{fl|SPR950-Positive-Resist-Datasheet.pdf|SPR950-0.8}}
+
*{{fl|SPR220-Positive-Resist-Datasheet.pdf|SPR220 (SPR220-3, SPR220-7)}}
 
*{{fl|SPR955-Positive-Resist-Datasheet.pdf|SPR955CM (SPR955CM-0.9, SPR955CM-1.8)}}
  
*{{fl|SPR955-Positive-Resist-Datasheet.pdf|SPR955CM (SPR955CM-0.9, SPR955CM-1.8)}}
 
*{{fl|THMR_iP_3500_iP3600.pdf|THMR-3600HP-1 (thin i-line and Holography)}}
  
*{{fl|THMR_iP_3500_iP3600.pdf|THMR-3600HP-1 (thin i-line and Holography)}}
 
*{{fl|3600_D,_D2v_Spin_Speed_Curve.pdf|THMR-3600HP-2 (thin i-line and Holography)}}
  
*{{fl|3600_D,_D2v_Spin_Speed_Curve.pdf|THMR-3600HP-2 (thin i-line and Holography)}}
 
*{{fl|THMR-iP3600_HP_D_20140801_(B)_GHS_US.pdf|THMR-3600HP-3 (thin i-line and Holography)}}
  
*{{fl|THMR-iP3600_HP_D_20140801_(B)_GHS_US.pdf|THMR-3600HP-3 (thin i-line and Holography)}}
  +
 
'''''DUV-248nm'''''
  
'''''DUV-248nm'''''
  +
 
*{{fl|UV210-Positive-Resist-Datasheet.pdf|UV210-0.3}}
  
*{{fl|UV210-Positive-Resist-Datasheet.pdf|UV210-0.3}}
−
*{{fl|UV6-Positive-Resist-Datasheet.pdf|UV6-0.8}}
+
*{{fl|UV6-Positive-Resist-Datasheet.pdf|UV6-0.8}}
−
*{{fl|PEK-162-Positive-Resist-Datasheet.pdf|PEK-162C1}}
+
*{{fl|UV26-Positive-Resist-Datasheet.pdf|UV26-2.5}}
   
   
 
;<div id="NegativePR"><big>Negative Photoresists</big></div>
  
;<div id="NegativePR"><big>Negative Photoresists</big></div>
  +
 
'''''i-line and broadband'''''
  
'''''i-line and broadband'''''
  +
−
*{{fl|AZ5214-Negative-Resist-Datasheet.pdf|AZ5214}}
 
−
*{{fl|AZnLOF5510-Negative-Resist-Datasheet.pdf|AZnLOF5510}}
+
*{{fl|AZ5214-Negative-Resist-Datasheet.pdf|AZ5214}}
−
*{{fl|AZnLOF2020-Negative-Resist-Datasheet.pdf|AZnLOF2000 (AZnLOF2020, AZnLOF2035, AZnLOF2070)}}
+
*{{fl|AZnLOF5510-Negative-Resist-Datasheet.pdf|AZnLOF5510}}
  +
*{{fl|AZnLOF2020-Negative-Resist-Datasheet.pdf|AZnLOF2000 (AZnLOF2020, AZnLOF2035, AZnLOF2070)}}
 
*{{fl|NR9-1000PY-revA.pdf|Futurrex NR9-1000PY(use AZ300MIF dev)}}
  
*{{fl|NR9-1000PY-revA.pdf|Futurrex NR9-1000PY(use AZ300MIF dev)}}
 
*{{fl|NR9-3000PY-revA.pdf|Futurrex NR9-3000PY(use AZ300MIF dev)}}
  
*{{fl|NR9-3000PY-revA.pdf|Futurrex NR9-3000PY(use AZ300MIF dev)}}
Line 50: Line 318:
 
*{{fl|SU-8-2015-revA.pdf|SU-8-2005,2010, 2015}}
  
*{{fl|SU-8-2015-revA.pdf|SU-8-2005,2010, 2015}}
 
*{{fl|SU-8-2075-revA.pdf|SU-8-2075}}
  
*{{fl|SU-8-2075-revA.pdf|SU-8-2075}}
  +
 
'''''DUV-248nm'''''
  
'''''DUV-248nm'''''
  +
−
*{{fl|UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf|UVN-30}}
  
  +
*{{fl|UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf|UVN-30-0.8}}
   
   
 
;<div id="Underlayers"><big>Underlayers</big></div>
  
;<div id="Underlayers"><big>Underlayers</big></div>
   
−
*{{fl|PMGI-Underlayer-Datasheet.pdf|PMGI (PMGI SF3,5,8,11,15)}}
+
*{{fl|PMGI-Underlayer-Datasheet.pdf|PMGI (PMGI SF3,5,8,11,15)}}
 
*{{fl|LOL2000-Underlayer-Datasheet.pdf|Shipley LOL2000}}
  
*{{fl|LOL2000-Underlayer-Datasheet.pdf|Shipley LOL2000}}
   
Line 62: Line 332:
 
;<div id="EBLPR"><big>E-beam resists</big></div>
  
;<div id="EBLPR"><big>E-beam resists</big></div>
   
−
*{{fl|PMMA-E-Beam-Resist-Datasheet.pdf|PMMA (PMMA, P(MMA-MAA) copolymer)}}
+
*{{fl|PMMA-E-Beam-Resist-Datasheet.pdf|PMMA (PMMA, P(MMA-MAA) copolymer)}}
 
*{{fl|maN2403-E-Beam-Resist-Datasheet.pdf|maN 2403}}
  
*{{fl|maN2403-E-Beam-Resist-Datasheet.pdf|maN 2403}}
   
Line 68: Line 338:
 
;<div id="NanoImprinting"><big>Nanoimprinting</big></div>
  
;<div id="NanoImprinting"><big>Nanoimprinting</big></div>
   
−
*{{fl|NX1020-Nanoimprinting-Datasheet.pdf|NX1020}}
+
*{{fl|NX1020-Nanoimprinting-Datasheet.pdf|NX1020}}
 
*{{fl|MRI-7020-Nanoimprinting-Datasheet.pdf|MRI-7020}}
  
*{{fl|MRI-7020-Nanoimprinting-Datasheet.pdf|MRI-7020}}
 
*{{fl|Mr-UVCur21.pdf|MR-UVCur21}}
  
*{{fl|Mr-UVCur21.pdf|MR-UVCur21}}
Line 81: Line 351:
 
;<div id="AntiReflectionCoatings"><big>Anti-Reflection Coatings</big></div>
  
;<div id="AntiReflectionCoatings"><big>Anti-Reflection Coatings</big></div>
   
−
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC (i-line)}}
+
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC (i-line)}}
−
*{{fl|AR2-Anti-Reflective-Coating.pdf|AR2 (DUV) (Discontinued 2016)}}
 
 
*{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P (DUV) (For AR2 replacement)}}
  
*{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P (DUV) (For AR2 replacement)}}
−
*{{fl|DS-K101-Anti-Reflective-Coating.pdf|DS-K101 (DUV developable BARC)}}
 +
*{{fl|DS-K101-304-Anti-Reflective-Coating.pdf|DS-K101-304 (DUV developable BARC)}}
   
   
 
;<div id="AdhesionPromoters"><big>Adhesion Promoters</big></div>
  
;<div id="AdhesionPromoters"><big>Adhesion Promoters</big></div>
   
−
*HMDS
+
*HMDS
 
*AP3000 BCB Adhesion Promoter
  
*AP3000 BCB Adhesion Promoter
 
*{{fl|OMNICOAT-revA.pdf|Omnicoat, SU-8 Adhesion Promoter}}
  
*{{fl|OMNICOAT-revA.pdf|Omnicoat, SU-8 Adhesion Promoter}}
Line 95: Line 364:
   
   
−
;<div id="BCBandSOG"><big>BCB and SOG</big></div>
 +
;<div id="SpinOnDielectrics"><big>Spin-On Dielectrics</big></div>
   
−
''Low-K Spin-On Dielectrics: Benzocyclobutane and Spin-on Glass''
 +
''Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass''
   
−
*{{fl|BCB-cyclotene-3000-revA.pdf|BCB, Cyclotene 3022-46(Not Photosensitive)}}
+
*{{fl|BCB-cyclotene-3000-revA.pdf|BCB, Cyclotene 3022-46(Not Photosensitive)}}
 
*{{fl|BCB-cyclotene-4000-revA.pdf|PhotoBCB, Cyclotene 4022-40(Negative Polarity)}}
  
*{{fl|BCB-cyclotene-4000-revA.pdf|PhotoBCB, Cyclotene 4022-40(Negative Polarity)}}
  +
*{{fl|BCB-adhesion.pdf|BCB Adhesion Notes from Vendor}}
  +
*{{fl|BCB-rework.pdf|BCB rework Notes from Vendor}}
 
*{{fl|512B-Datasheet-revA.pdf|Spin-on-Glass, Honeywell 512B (Not Photosensitive)}}
  
*{{fl|512B-Datasheet-revA.pdf|Spin-on-Glass, Honeywell 512B (Not Photosensitive)}}
 
*{{fl|512B-Application-Data-Bake-revA.pdf|Honeywell 512B Apps Data}}
  
*{{fl|512B-Application-Data-Bake-revA.pdf|Honeywell 512B Apps Data}}
Line 107: Line 378:
 
;<div id="Developers"><big>Developers</big></div>
  
;<div id="Developers"><big>Developers</big></div>
   
−
*{{fl|AZ400K-Developer-Datasheet.pdf|AZ400K (AZ400K, AZ400K1:4)}}
+
*{{fl|AZ400K-Developer-Datasheet.pdf|AZ400K (AZ400K, AZ400K1:4)}}
 
*{{fl|AZ300MIF-Developer-Datasheet.pdf|AZ300MIF}}
  
*{{fl|AZ300MIF-Developer-Datasheet.pdf|AZ300MIF}}
 
*DS2100 BCB Developer
  
*DS2100 BCB Developer
Line 116: Line 387:
 
;<div id="PRRemovers"><big>Photoresist Removers</big></div>
  
;<div id="PRRemovers"><big>Photoresist Removers</big></div>
   
−
*[http://www.microchemicals.com/products/remover_stripper/nmp.html AZ NMP]]
 +
*[http://www.microchemicals.com/products/remover_stripper/nmp.html AZ NMP]
−
** ''This replaces {{fl|1165-Resist-Remover.pdf|1165}}''
 +
**''This replaces {{fl|1165-Resist-Remover.pdf|1165}}''
−
*{{fl|AZ300T-Resist-Remover.pdf|AZ300T}}
+
*{{fl|AZ300T-Resist-Remover.pdf|AZ300T}}
 
*{{fl|RemoverPG-revA.pdf|Remover PG, SU-8 stripper}}
  
*{{fl|RemoverPG-revA.pdf|Remover PG, SU-8 stripper}}
  +
*AZ EBR ("Edge Bead Remover", PGMEA)
   
 
|}
  
|}
−  
−
== Photolithography Recipes ==
  
−  
−
{{Recipe Table Explanation}}
 
−  
−
{| border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" class="wikitable"
  
−
|- bgcolor="#D0E7FF"
  
−
! height="45" colspan="9" | <div style="font-size: 150%;">Photolithography Recipes</div>
  
−
|- bgcolor="#D0E7FF"
  
−
| <!-- INTENTIONALLY LEFT BLANK --> <br>
 
−
! bgcolor="#D0E7FF" align="center" colspan="2" | '''[[Contact Alignment Recipes|Contact Aligners]]'''
 
−
! bgcolor="#D0E7FF" align="center" colspan="3" | '''[[Stepper Recipes|Steppers]]'''
 
−  
−
|-
  
−
! width="150" bgcolor="#D0E7FF" align="center" | '''Positive Resists'''
 
−
{{LithRecipe Table}}
 
−  
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | AZ4110
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | AZ4210
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| A
 
−
| A
 
−
| <br>
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | AZ4330RS
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | OCG 825-35CS
 
−
| A
 
−
| A
 
−
| A
 
−
| A
 
−
| <br>
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | SPR 950-0.8
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | SPR 955 CM-0.9
 
−
| A
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
−
| {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
−
| <br>
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | SPR 955 CM-1.8
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | SPR 220-3.0
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
−
| {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
−
| <br>
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | SPR 220-7.0
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | THMR-IP3600 HP D
 
−
| <br>
 
−
| <br>
 
−
| A
 
−
| A
 
−
| <br>
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | UV6-0.8
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | UV210-0.3
 
−
|
 
−
|
 
−
|
 
−
|
 
−
| {{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | PEK-162C1
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" | A
 
−
|-
  
−
! bgcolor="#D0E7FF" align="center" | '''Negative Resists'''
 
−
{{LithRecipe Table}}
 
−  
−
|- bgcolor="EEFFFF"
  
−
| bgcolor="#D0E7FF" align="center" | AZ5214-EIR
 
−
| {{rl|Contact_Alignment_Recipes|Negative Resist (MJB-3)}}
 
−
| {{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
 
−
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
 
−
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
−
|
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | AZnLOF 2020
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| {{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
 
−
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
 
−
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
−
|
 
−
|- bgcolor="EEFFFF"
  
−
| bgcolor="#D0E7FF" align="center" | AZnLOF 2035
 
−
| A
 
−
| A
 
−
| A
 
−
| A
 
−
|
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | AZnLOF 2070
 
−
| A
 
−
| A
 
−
| A
 
−
| A
 
−
|
 
−
|- bgcolor="EEFFFF"
  
−
| bgcolor="#D0E7FF" align="center" | AZnLOF 5510
 
−
| A
 
−
| A
 
−
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
 
−
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
−
|
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | UVN2300-0.5
 
−
|
 
−
|
 
−
|
 
−
|
 
−
| {{rl|Stepper Recipes|Negative Resist (ASML DUV)}}
 
−
|- bgcolor="EEFFFF"
  
−
| bgcolor="#D0E7FF" align="center" | SU-8 2005,2010, 2015
 
−
| A
 
−
| {{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
 
−
| A
 
−
| A
 
−
|
 
−
|-
 
−
| bgcolor="#D0E7FF" align="center" | SU-8 2075
 
−
| A
 
−
| A
 
−
| A
 
−
| A
 
−
|
 
−
|-bgcolor="EEFFFF"
  
−
| bgcolor="#D0E7FF" align="center" | NR9-1000,3000,6000PY
 
−
| A
 
−
| A
 
−
| A
 
−
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
−
|
 
−
|-
 
−  
−
! bgcolor="#D0E7FF" align="center" |
 
−
{{LithRecipe Table}}
 
−  
−
|}
  
−  
−
== E-Beam Lithography Recipes ==
  
−
*Under Development
  
−  
−
== Nanoimprinting ==
  
−
*{{fl|Thermal-Nanoimprint-Process-Tutorial-revA.pdf|Thermal Nanoimprint Process and Tutorial}}
  
−
*{{fl|Nanoinprint-Lithopgraphy-UV-Low-Pressure-Temperature-Ormostamp-PDMS-RevA.docx|UV-Cure Low Temp, Low Pressure, Soft-Stamp Nanoimprint Process}}
  
−  
−
== Holography Recipes ==
  
−
*{{fl|31-Holography_Process_for_1D-lines_and_2D-dots-rev-3-13-2014.pdf|Standard Holography Process - on SiO2 on Si}}
  
−
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}}
  
−
*{{fl|05-SiO2_Nano-structure_Etch.pdf|Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width}}
  
−
*{{fl|30-Redicing_Nanowire_Diameter_by_Thermal_Oxidation_and_Vapored_HF_Etch.pdf|Reduce SiO2 Nanowire Diameter - Thermal Oxidation - Vapor HF Etching}}
  
−  
−
== Low-K Dielectric ==
  
−
*{{fl|Lithography-BCB-photo-lowk-dielectric-spinon-4024-40-revA.docx|Photo BCB (4024-40)}}
  
−
*{{fl|BCB-cyclotene-3000-revA.pdf|Standard BCB (3022-46)}}
  
−
*{{fl|512B-Application-Data-Bake-revA.pdf|SOG (T512B)}}
  
   
 
[[Category:Processing]]
  
[[Category:Processing]]

Revision as of 12:15, 19 November 2019

General Information

This page contains information and links to recipes/datasheets spin-coated materials used in the facility. In general, the following information is provided for the following materials:

  • Underlayers: These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist. Datasheets are provided and some recipes are found in the Lift-Off Techniques section.
  • Holography: For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square. Recipes for silicon substrates are provided in the Holography section.
  • Anti-Reflection Coatings: Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes. Recipes using these materials are found within the photoresist recipes themselves. Datasheets are provided for reference on use of the materials.
  • Contrast Enhancement Materials (CEM): Used for resolution enhancement. Not for use in contact aligners. Recipes using these materials are found within the photoresist recipes themselves. Datasheets also provided.
  • Adhesion Promoters: These are used to improve wetting of photoresists to your substrate. Datasheets are provided on use of these materials.

Photolithography Recipes

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.


Photolithography Recipes

 Contact Aligners Steppers


Positive Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)


AZ4110 R R A A
AZ4210 R R A A
AZ4330RS R R A A
OCG 825-35CS A A A A
SPR 950-0.8 A A A A
SPR 955 CM-0.9 A R R R
SPR 955 CM-1.8 A A R R
SPR 220-3.0 R R R R
SPR 220-7.0 R R R R
THMR-IP3600 HP D

A A
UV6-0.8 R
UV210-0.3 R
UV26-2.5 A


Negative Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)


AZ5214-EIR R R R R
AZnLOF 2020 R R R R
AZnLOF 2035 A A A A
AZnLOF 2070 A A A A
AZnLOF 5510 A A R R
UVN30-0.8 R
SU-8 2005,2010, 2015 A R A A
SU-8 2075 A A A A
NR9-1000,3000,6000PY R R A R


Anti-Reflection Coatings SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)


DUV42-P R
DS-K101-304 R
SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)


E-Beam Lithography Recipes

  • Under Development.

Automated Coat/Develop System Recipes (S-Cubed Flexi)

Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.

To Be Added

Nanoimprinting Recipes

Holography Recipes

Low-K Spin-On Dielectric Recipes

Lift-Off Techniques

Chemicals Stocked + Datasheets

The following is a list of the lithography chemicals we have available in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.

Positive Photoresists

i-line and broadband

DUV-248nm


Negative Photoresists

i-line and broadband

DUV-248nm


Underlayers


E-beam resists


Nanoimprinting
Contrast Enhancement Materials


Anti-Reflection Coatings


Adhesion Promoters


Spin-On Dielectrics

Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass


Developers


Photoresist Removers
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