Difference between revisions of "E-Beam 4 (CHA)"

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|picture=e-beam4.jpg
 
|picture=e-beam4.jpg
 
|type = Vacuum Deposition
 
|type = Vacuum Deposition
|super= Tony Bosch
+
|super= Brian Lingg
|phone=(805)839-3918x217
+
|phone=(805)839-3918x210
 
|location=Bay 3
 
|location=Bay 3
|email=bosch@ece.ucsb.edu
+
|email=lingg@ece.ucsb.edu
 
|description = Multi-Wafer Evaporator
 
|description = Multi-Wafer Evaporator
 
|manufacturer = CHA Industries
 
|manufacturer = CHA Industries
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}}
 
}}
 
= About =
 
= About =
This electron-beam evaporation system is the newest of the lab for metal deposition. This system is a bell-jar type system and has the capability to do up to 10-4” wafers in a lift-off configuration and up to 24-4” wafers in a sidewall coverage configuration. Rotational motion in combination with baffling is used for lift-off and provides roughly 5% uniformity across a 4” wafer. The sidewall coverage fixturing uses full planetary motion to provide coverage over all sidewalls. The system also an 8-pocket e-beam source and an Inficon IC/5 deposition controller that allows for programming of fully automated multiple layer depositions. The metals available for deposition are Al, Ti, Au, Pt, Ni, Pd, Ag, Ge, Fe, NiCr, NiFe and Cr. This system is used for n-type ohmic contact metalization to compound semiconductors, Schottky contacts to semiconductors, bond pads, and other general metalizations. The maximum deposition thickness during a run is limited to 1.0 microns.
+
This electron-beam evaporation system is a bell-jar type system and has the capability to do up to 9-4” wafers in a lift-off configuration and up to 18-4” wafers in a sidewall coverage configuration. Rotational motion in combination with baffling is used for lift-off and provides roughly 5% uniformity across a 4” wafer. The sidewall coverage fixturing uses full planetary motion to provide coverage over all sidewalls. The system also an 8-pocket e-beam source and an Inficon IC/5 deposition controller that allows for programming of fully automated multiple layer depositions. The metals available for deposition are Al, Ti, Au, Pt, Ni, Pd, Ag, Ge, Fe, NiCr, NiFe and Cr. This system is used for n-type ohmic contact metalization to compound semiconductors, Schottky contacts to semiconductors, bond pads, and other general metalizations. The maximum deposition thickness during a run is limited to 1.0 microns.
   
 
= Detailed Specifications =
 
= Detailed Specifications =
 
*Temescal 10kV power supply
 
*Temescal 10kV power supply
 
*1-Temescal 8-pocket series 260 e-beam sources
 
*1-Temescal 8-pocket series 260 e-beam sources
*Cryo-pumped system with ~ 1e-7 ultimate base pressure
+
*Cryo-pumped system with ~ 5e-7 ultimate base pressure
 
*Rotation with baffle for 5% uniformity over 4” wafer
 
*Rotation with baffle for 5% uniformity over 4” wafer
 
*Automatic vacuum sequencing
 
*Automatic vacuum sequencing
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*Automatic deposition of multiple layer stacks
 
*Automatic deposition of multiple layer stacks
 
*Sample size: Pieces or up to 10-4” wafers for lift-off and 24-4” wafers for sidewall coverage
 
*Sample size: Pieces or up to 10-4” wafers for lift-off and 24-4” wafers for sidewall coverage
*Metals: Al, Ti, Au, Pt, Ni, Pd, Ag, Ge, Fe, NiCr, NiFe and Cr
+
*Metals: Al, Ti, Au, Pt, Ni, Pd, Ag, Ge, Fe, NiCr, NiFe, Cr
   
 
=Documentation=
 
=Documentation=
*[[media:E-Beam-4-Operating-Procedures.pdf|Operating Procedures]]
+
*[[media:Wiki Operational Procedure EB4 With EBC Rev 3.pdf|Operating Procedures]]
 
   
 
= Materials Table =
 
= Materials Table =
  +
For the materials tables, please visit the [[E-Beam_Evaporation_Recipes#Materials_Table_(E-Beam #4)|E-Beam Recipe Page]].
 
{| border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" class="collapsible collapsed wikitable"
 
|-
 
! colspan=6 width=1300 height=35 bgcolor="#D0E7FF" align="center"|<div style="font-size: 150%;">Materials Table</div>
 
|- bgcolor="#D0E7FF"
 
! width="45" bgcolor="#D0E7FF" align="center" | '''Material'''
 
! width="45" bgcolor="#D0E7FF" align="center" | '''Density, g/cm3'''
 
! width="45" bgcolor="#D0E7FF" align="center" | '''Z Ratio'''
 
! width="45" bgcolor="#D0E7FF" align="center" | '''Master tooling, %'''
 
! width="45" bgcolor="#D0E7FF" align="center" | '''Process Gain, A/sec/%pwr'''
 
! width="100" bgcolor="#D0E7FF" align="center" | '''Comments'''
 
|-
 
|Ag
 
| 10.50
 
| 0.529
 
|110
 
|10.0
 
|
 
|-
 
|Al
 
| 2.70
 
| 1.080
 
|165
 
|6.0
 
|
 
|-
 
|Au
 
|19.30
 
| 0.381
 
|120
 
|10.0
 
|
 
|-
 
|Co
 
|8.90
 
| 0.343
 
|150
 
|5.0
 
|
 
|-
 
|Cr
 
|7.20
 
| 0.305
 
|140
 
|10.0
 
|
 
|-
 
|Fe
 
|7.86
 
| 0.349
 
|165
 
|10.0
 
|
 
|-
 
|Ge
 
|5.35
 
| 0.516
 
|126
 
|10.0
 
|
 
|-
 
|Hf
 
|13.09
 
| 0.360
 
|150
 
|10.0
 
|
 
|-
 
|Ir
 
|22.40
 
| 0.129
 
|130
 
|10.0
 
|
 
|-
 
|Ni
 
|8.91
 
| 0.331
 
|150
 
|5.0
 
|
 
|-
 
|NiCr
 
|8.23
 
| 0.321
 
|140
 
|10.0
 
|
 
|-
 
|NiFe
 
|8.70
 
|1.00
 
|100
 
|10.0
 
|
 
 
 
 
 
|
 

Latest revision as of 13:56, 1 April 2019

E-Beam 4 (CHA)
E-beam4.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description Multi-Wafer Evaporator
Manufacturer CHA Industries
Model SEC-600-RAP
Vacuum Deposition Recipes
Sign up for this tool


About

This electron-beam evaporation system is a bell-jar type system and has the capability to do up to 9-4” wafers in a lift-off configuration and up to 18-4” wafers in a sidewall coverage configuration. Rotational motion in combination with baffling is used for lift-off and provides roughly 5% uniformity across a 4” wafer. The sidewall coverage fixturing uses full planetary motion to provide coverage over all sidewalls. The system also an 8-pocket e-beam source and an Inficon IC/5 deposition controller that allows for programming of fully automated multiple layer depositions. The metals available for deposition are Al, Ti, Au, Pt, Ni, Pd, Ag, Ge, Fe, NiCr, NiFe and Cr. This system is used for n-type ohmic contact metalization to compound semiconductors, Schottky contacts to semiconductors, bond pads, and other general metalizations. The maximum deposition thickness during a run is limited to 1.0 microns.

Detailed Specifications

  • Temescal 10kV power supply
  • 1-Temescal 8-pocket series 260 e-beam sources
  • Cryo-pumped system with ~ 5e-7 ultimate base pressure
  • Rotation with baffle for 5% uniformity over 4” wafer
  • Automatic vacuum sequencing
  • Temescal e-beam sweep control
  • Inficon IC/5 programmable crystal thickness monitoring system
  • Automatic deposition of multiple layer stacks
  • Sample size: Pieces or up to 10-4” wafers for lift-off and 24-4” wafers for sidewall coverage
  • Metals: Al, Ti, Au, Pt, Ni, Pd, Ag, Ge, Fe, NiCr, NiFe, Cr

Documentation

Materials Table

For the materials tables, please visit the E-Beam Recipe Page.