Difference between revisions of "Dry Etching Recipes"

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m (fix ICP1 GaAs link)
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{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
  
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! colspan="17" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
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! colspan="18" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
 
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! colspan="4" width="300" height="35" align="center" bgcolor="#d0e7ff" |'''[[RIE Etching Recipes|RIE Etching]]'''
  
! colspan="4" width="300" height="35" align="center" bgcolor="#d0e7ff" |'''[[RIE Etching Recipes|RIE Etching]]'''
 
! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
  
! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
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! colspan="4" align="center" bgcolor="#d0e7ff" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
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! colspan="5" align="center" bgcolor="#d0e7ff" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
 
! colspan="3" align="center" bgcolor="#d0e7ff" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
  
! colspan="3" align="center" bgcolor="#d0e7ff" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
 
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| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
  
| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
 
| width="95" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
  
| width="95" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
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| width="95" bgcolor="#daf1ff" |[[Plasma Clean (YES EcoClean)]]
 
| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
  
| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
 
| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
  
| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
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|{{rl|ICP Etching Recipes|Al Etch (Panasonic 1)}}
  
|{{rl|ICP Etching Recipes|Al Etch (Panasonic 1)}}
 
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|{{Rl|ICP Etching Recipes|Ru (Ruthenium) Etch (Panasonic 2)}}
  
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|{{rl|ICP Etching Recipes|DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)}}
  
|{{rl|ICP Etching Recipes|DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)}}
 
|{{Rl|ICP Etching Recipes|Si Etching}}
  
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|{{rl|ICP Etching Recipes|Ti Etch (Panasonic 1)}}
  
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|[https://www.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Al2O3_Etching_.28Panasonic_2.29 R]
  
|[https://www.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Al2O3_Etching_.28Panasonic_2.29 R]
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|{{rl|ICP Etching Recipes|Sapphire Etch (Panasonic 1)}}
  
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|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|AlGaAs Etch (Unaxis VLR)}}
  
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|AlGaAs Etch (Unaxis VLR)}}
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|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|GaAs Etch (Unaxis VLR)}}
  
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|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
  
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
 
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
  
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
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| bgcolor="#daf1ff" |[[Plasma Clean (YES EcoClean)]]
 
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
  
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
 
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
  
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]

Revision as of 21:11, 16 September 2019

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 1
(Retired) 		RIE 2
(MRC) 		RIE 3
(MRC) 		RIE 5
(PlasmaTherm) 		DSEIII
(PlasmaTherm) 		SLR Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic 1) 		ICP Etch 2
(Panasonic 2) 		ICP-Etch
(Unaxis VLR) 		Ashers
(Technics PEII) 		Plasma Clean
(Gasonics 2000) 		Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)
Ag
Al A R R
Au A
Cr A R A
Cu
Ge A
Mo
Ni R
Pt R
Ru A R
Si R R R
Ta
Ti R A
Al2O3 R
Al2O3 (Sapphire) R A
AlGaAs R R R
AlGaN R
AlN R
CdZnTe R
GaAs R R R R
GaN R R R
GaSb A R
HfO2
InGaAlAs R R
InGaAsP R R
InP R A A R
ITO R
Photoresist

& ARC

A R R R A A
SiC R A
SiN R R R A
SiO2 R A R R R
SiOxNy A A
Ta2O5 A
TiN
TiO2
W-TiW R A
ZnO2
ZnS R
ZnSe R
ZrO2
Material RIE 1
(Retired) 		RIE 2
(MRC) 		RIE 3
(MRC) 		RIE 5
(PlasmaTherm) 		DSEIII
(PlasmaTherm) 		SLR Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E626I) 		ICP Etch 2
(Panasonic E640) 		ICP-Etch
(Unaxis VLR) 		Ashers
(Technics PEII) 		Plasma Clean
(Gasonics 2000) 		Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Dry_Etching_Recipes&oldid=156768"