Difference between revisions of "Dry Etching Recipes"

Revision as of 15:03, 6 November 2017

R = Recipe is available. Clicking this link will take you to the recipe.

A = Material is available for use, but no recipes are provided.

Dry Etching Recipes
	RIE Etching				ICP Etching					Oxygen Plasma Systems				Other Dry Etchers
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	Si Deep RIE (PTI/Bosch)	ICP Etch 1 (Panasonic 1)	ICP Etch 2 (Panasonic 2)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)
Ag
Al				A			R	R
Au																R
Cr				A			R	A
Cu
Ge
Mo
Ni																R
Pt																R
Ru
Si						R								R
Ta
Ti							R	A
Al₂O₃
Al₂O_{3 (Sapphire)}							R	A
AlGaAs				R			R		R
AlGaN									R
AlN									R
CdZnTe		R
GaAs				R			R	R	R
GaN				R			R		R
GaSb								A	R
HfO₂
InGaAlAs		R							R
InGaAsP		R							R
InP		R					A	A	R
ITO		R
SiC							R	A
SiN			R				R	R
SiO₂			R				R	R							R
SiOxNy
Ta₂O₅								A
TiN
TiO₂
W-TiW							R	A
ZnO₂
ZnS		R
ZnSe		R
ZrO₂
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)		Si Deep RIE (PlasmaTherm/Bosch Etch)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)

Difference between revisions of "Dry Etching Recipes"

Revision as of 15:03, 6 November 2017

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 {| class="wikitable" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
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-! colspan="16" width="725" height="45" | <div style="font-size: 150%;">Dry Etching Recipes</div>
+! colspan="17" width="725" height="45" | <div style="font-size: 150%;">Dry Etching Recipes</div>
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 ! colspan="4" width="300" bgcolor="#D0E7FF" align="center" height="35" | '''[[RIE Etching Recipes|RIE Etching]]'''
-! colspan="4" width="300" bgcolor="#D0E7FF" align="center" | '''[[ICP Etching Recipes|ICP Etching]]'''
+! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
 ! colspan="4" bgcolor="#D0E7FF" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
 ! colspan="3" bgcolor="#D0E7FF" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
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 | width="65" bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
 | width="100" bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
+|DSEIII (PlasmaTherm)
 | width="100" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#Si_Deep_RIE_.28PlasmaTherm.2FBosch_Etch.29|Si Deep RIE<br>(PTI/Bosch)]]
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 | bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#Si_Deep_RIE_.28PlasmaTherm.2FBosch_Etch.29|Si Deep RIE<br>(PlasmaTherm/Bosch Etch)]]
 | bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic E626I)]]