Difference between revisions of "Dicing Saw (ADT)"
Jump to navigation
Jump to search
(→About) |
(linked to Dicing Recipes) |
||
| Line 11: | Line 11: | ||
|toolid=49 |
|toolid=49 |
||
}} |
}} |
||
| − | = About = |
+ | == About == |
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 6” diameter wafers. |
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 6” diameter wafers. |
||
| + | |||
| + | == Recipes == |
||
| + | * Packaging Recipes > [https://www.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes (ADT 7100)] |
||
| + | Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting. |
||
Revision as of 08:58, 16 October 2018
|
About
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 6” diameter wafers.
Recipes
- Packaging Recipes > Dicing Saw Recipes (ADT 7100)
Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting.